Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/14/2008US20080194045 Ferroelectric register, and method for manufacturing capacitor of the same
08/14/2008US20080193880 Water Soluble Resin Composition and Method for Pattern Formation Using the Same
08/14/2008US20080193875 First and second organic layers are both thicker than sacrificial layer and can be adjusted according to wavelengths of light sources used in exposure; by adjusting thicknesses of sacrificial and first organic layer, the composite photoresist structure is thick enough to block etching; photolithography
08/14/2008US20080193862 Forming a pattern in uppermost layer of an absorber layer; etching the lower layer of the absorber layer using the pattern formed in the uppermost layer as a mask to form a pattern in the lower layer
08/14/2008US20080193779 Dummy substrate and substrate processing method using the same
08/14/2008US20080193718 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof
08/14/2008US20080193645 Vaporizer and various devices using the same and an associated vaporizing method
08/14/2008US20080193274 Substrate treatment equipment and manufacturing method of substrate
08/14/2008US20080193271 Test Handler
08/14/2008US20080193262 Substrate Transfer Apparatus, Component Mounting Equipment, and Substrate Transfer Method
08/14/2008US20080192781 Semiconductor Light Emitting Device
08/14/2008US20080192532 Hybrid circuit having nanotube memory cells
08/14/2008US20080192526 Manufacturing method for an integrated semiconductor memory device and corresponding semiconductor memory device
08/14/2008US20080192433 Interface module-mounted lsi package
08/14/2008US20080192423 Bare Chip Mounted Structure and Mounting Method
08/14/2008US20080192405 Variable frequency electrostatic clamping
08/14/2008US20080192328 Mems device fabricated on a pre-patterned substrate
08/14/2008US20080192226 Stage Unit, Exposure Apparatus, and Exposure Method
08/14/2008US20080192220 Method for adjusting a projection objective
08/14/2008US20080192219 Lithographic apparatus and device manufacturing method
08/14/2008US20080192161 Active matrix substrate and display device
08/14/2008US20080191969 Flat panel display
08/14/2008US20080191944 Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder
08/14/2008US20080191788 Soi mosfet device with adjustable threshold voltage
08/14/2008US20080191729 Thermal interface for electronic chip testing
08/14/2008US20080191728 Isolation circuit
08/14/2008US20080191724 Electrical testing device for testing electrical test samples
08/14/2008US20080191720 Multilayer Substrate and Probe Card
08/14/2008US20080191710 Integrated Circuit Arrangement
08/14/2008US20080191613 Display Device and Method of Manufacturing the Same
08/14/2008US20080191364 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
08/14/2008US20080191361 Electronic Device Comprising an Integrated Circuit
08/14/2008US20080191360 Adhesive Strip Conductor on an Insulating Layer
08/14/2008US20080191359 Panel, semiconductor device and method for the production thereof
08/14/2008US20080191356 Power Semiconductor
08/14/2008US20080191355 Semiconductor device having buffer layer pattern and method of forming same
08/14/2008US20080191351 Molybdenum-doped indium oxide structures and methods
08/14/2008US20080191350 Magnesium-doped zinc oxide structures and methods
08/14/2008US20080191349 Semiconductor device with magnetic powder mixed therein and manufacturing method thereof
08/14/2008US20080191347 Conductive ball-or pin-mounted semiconductor packaging substrate, method for manufacturing the same and conductive bonding material
08/14/2008US20080191346 Bump structure and manufacturing method thereof
08/14/2008US20080191345 Integrated circuit package system with bump over via
08/14/2008US20080191344 Integrated circuit packaging
08/14/2008US20080191343 Integrated circuit package having large conductive area and method for fabricating the same
08/14/2008US20080191340 Power Semiconductor Module And Method For Its Manufacture
08/14/2008US20080191339 Module with silicon-based layer
08/14/2008US20080191336 Subminiature electronic device having hermetic cavity and method of manufacturing the same
08/14/2008US20080191335 Cmos image sensor chip scale package with die receiving opening and method of the same
08/14/2008US20080191333 Image sensor package with die receiving opening and method of the same
08/14/2008US20080191328 Surface Mount Electronic Component and Process for Manufacturing Same
08/14/2008US20080191326 Coreless packaging substrate and method for manufacturing the same
08/14/2008US20080191324 Chip package structure and method of fabricating the same
08/14/2008US20080191323 Semiconductor package and its manufacturing method
08/14/2008US20080191322 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch
08/14/2008US20080191321 Semiconductor device and method for manufacturing the same
08/14/2008US20080191318 Semiconductor device and method of sawing semiconductor device
08/14/2008US20080191317 Self-aligned epitaxial growth of semiconductor nanowires
08/14/2008US20080191316 Semiconductor transistor device and method of manufacturing the same
08/14/2008US20080191315 Semiconductor device and method of manufacturing the same
08/14/2008US20080191312 Semiconductor circuit
08/14/2008US20080191311 Metal-insulator-metal capacitor and fabrication method thereof
08/14/2008US20080191310 By-product removal for wafer bonding process
08/14/2008US20080191309 Methods and structure for charge dissipation in integrated circuits
08/14/2008US20080191305 Bipolar schottky diode and method
08/14/2008US20080191303 MEMS thermal actuator and method of manufacture
08/14/2008US20080191302 Solid-state image pickup device and method for producing the same
08/14/2008US20080191298 Ambient light detectors using conventional cmos image sensor process
08/14/2008US20080191295 Non-Volatile Magnetic Memory Element with Graded Layer
08/14/2008US20080191293 Integrated passive device and method of fabrication
08/14/2008US20080191292 METAL GATES WITH LOW CHARGE TRAPPING AND ENHANCED DIELECTRIC RELIABILITY CHARACTERISTICS FOR HIGH-k GATE DIELECTRIC STACKS
08/14/2008US20080191290 Semiconductor devices and methods of manufacturing the same
08/14/2008US20080191289 Fabrication of transistors with a fully silicided gate electrode and channel strain
08/14/2008US20080191288 Semiconductor device and method of manufacturing the same
08/14/2008US20080191287 Method for fabricating strained-silicon cmos transistor
08/14/2008US20080191286 Methods for manufacturing a CMOS device with dual dielectric layers
08/14/2008US20080191285 CMOS devices with schottky source and drain regions
08/14/2008US20080191284 Method for improved fabrication of a semiconductor using a stress proximity technique process
08/14/2008US20080191283 Semiconductor device and manufacturing method thereof
08/14/2008US20080191282 Mugfet array layout
08/14/2008US20080191281 Stressed soi fet having tensile and compressive device regions
08/14/2008US20080191280 N-type carbon nanotube field effect transistor and method of fabricating the same
08/14/2008US20080191279 Thin film transistor, electronic device having the same, and method for manufacturing the same
08/14/2008US20080191278 Semiconductor device, method for manufacturing the same, liquid crystal television, and EL television
08/14/2008US20080191276 Semiconductor devices and fabrication methods thereof
08/14/2008US20080191275 Dotted channel mosfet and method
08/14/2008US20080191271 Semiconductor device having fins fet and manufacturing method thereof
08/14/2008US20080191270 Nand-Type Non-Volatile Semiconductor Memory Device and Method of Manufacturing the Same
08/14/2008US20080191268 Integrated circuit and method of manufacturing an integrated circuit
08/14/2008US20080191265 Nanoparticles In a Flash Memory Using Chaperonin Proteins
08/14/2008US20080191264 Non-volatile memory devices and methods of operating and fabricating the same
08/14/2008US20080191263 Nonvolatile memory devices and methods of fabricating the same
08/14/2008US20080191262 Non-volatile memory and fabricating method thereof
08/14/2008US20080191261 Nonvolatile memory devices and methods of fabricating the same
08/14/2008US20080191258 Low voltage coefficient mos capacitors
08/14/2008US20080191256 Polyoxometallates in Memory Devices
08/14/2008US20080191255 Ferroelectric random access memories (frams) having lower electrodes respectively self-aligned to node conductive layer patterns and methods of forming the same
08/14/2008US20080191254 Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
08/14/2008US20080191253 Semiconductor device and method for manufacturing the same
08/14/2008US20080191252 Semiconductor device and method for manufacturing the semiconductor device
08/14/2008US20080191250 Transistor Having Coupling-Preventing Electrode Layer, Fabricating Method Thereof, and Image Sensor Having the Same
1 ... 2504 2505 2506 2507 2508 2509 2510 2511 2512 2513 2514 2515 2516 2517 2518 2519 2520 2521 2522 2523 2524 ... 6590