Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/21/2008DE102006024750B4 Druckvorrichtung und ein Druckverfahren unter Verwendung derselben A printing apparatus and a printing method using the same
08/21/2008DE102005063258B4 Verfahren zum Herstellen eines elektrischen Kontakts für ein elektrisches Bauelement und elektrisches Bauelement A method of manufacturing an electrical contact for an electrical component and an electrical component
08/21/2008DE102005005622B4 Sicherheits-Chipstapel und ein Verfahren zum Herstellen eines Sicherheits-Chipstapels Security chip stack and a method for manufacturing a security chip stack
08/21/2008DE102004025773B4 Elektronisches Bauelement mit thermisch voneinander isolierten Bereichen Electronic component with thermally insulated from one another areas
08/21/2008DE10125029B4 Verwendung einer Halbleitervorrichtung mit Nebenschaltung im Kerf-Bereich und Verfahren Use of a semiconductor device having sub-circuit in the kerf area and procedures
08/21/2008DE10046021B4 Verfahren zur Herstellung von Kondensatoren auf Halbleitersubstraten in einer Einrichtung zur Bildung von Dünnfilmen Process for the preparation of capacitors on semiconductor substrates in a device for the formation of thin films
08/21/2008DE10003240B4 Verfahren zum Steuern einer Drahtsäge und Drahtsäge A method of controlling a wire saw and wire saw
08/20/2008EP1959506A2 Method of manufacturing a semiconductor light-emitting device
08/20/2008EP1959503A1 Semiconductor light emitting element and method for manufacturing semiconductor light emitting element
08/20/2008EP1959501A2 Power semiconductor device
08/20/2008EP1959500A2 High-voltage vertical FET
08/20/2008EP1959498A2 High-voltage vertical FET
08/20/2008EP1959497A2 High-voltage vertical FET
08/20/2008EP1959496A2 High-voltage vertical FET
08/20/2008EP1959495A1 Trench gate power semiconductor device
08/20/2008EP1959492A1 Semiconductor device
08/20/2008EP1959491A2 Semiconductor device and method for manufacturing the same
08/20/2008EP1959490A1 Method of manufacturing a semiconductor-type structure on an insulator
08/20/2008EP1959489A2 Substrate support assembly
08/20/2008EP1959488A1 Electrode sheet for electrostatic chuck, and electrostatic chuck
08/20/2008EP1959487A1 Surface roughness tester
08/20/2008EP1959486A2 Silicon wafer and its manufacturing method
08/20/2008EP1959485A2 Activated chemical process for enhancing material properties of dielectric films
08/20/2008EP1959484A1 Microwave introduction device
08/20/2008EP1959483A1 Double side grinding machine for semiconductor wafer, static pressure pad, and double side grinding method using such static pressure pad
08/20/2008EP1959482A1 Laser processing method
08/20/2008EP1959481A1 Method of manufacturing a transistor
08/20/2008EP1959480A1 Plasma processing apparatus and plasma processing method
08/20/2008EP1959479A2 Electronic device manufacture
08/20/2008EP1959478A2 Molecular gluing method using hydrofluoric acid in vapour phase for cleaning and deionised water for rinsing
08/20/2008EP1959303A1 Cleaning solution for semiconductor device or display device, and cleaning method
08/20/2008EP1959301A1 Spin coating device and method
08/20/2008EP1959260A1 Probe card
08/20/2008EP1959251A1 Appearance inspecting device
08/20/2008EP1959157A1 Mass body for controlling vibration
08/20/2008EP1958748A2 Equipment and method for controlling encapsulating semiconductors with plastics
08/20/2008EP1958263A1 Multi-operational mode transistor with multiple-channel device structure
08/20/2008EP1958258A1 Resistance in an integrated circuit
08/20/2008EP1958252A2 Low-resistance void-free contacts for eeprom devices
08/20/2008EP1958251A2 Method of forming a self aligned copper capping layer
08/20/2008EP1958250A1 Isolation trench intersection structure with reduced gap width
08/20/2008EP1958249A1 Isolation structures for semiconductor integrated circuit substrates and methods of forming the same
08/20/2008EP1958245A2 System and method for the manufacture of semiconductor devices by the implantation of carbon clusters
08/20/2008EP1958244A1 Method of fabricating self aligned schottky junctions for semiconductors devices
08/20/2008EP1958243A1 Method of manufacturing semiconductor device
08/20/2008EP1958242A1 High efficiency solar cell fabrication
08/20/2008EP1958241A2 Method for dry chemical treatment of substrates and use thereof
08/20/2008EP1957600A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
08/20/2008EP1957599A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
08/20/2008EP1957212A2 Apparatus and method for cleaning and drying a container for semiconductor workpieces
08/20/2008EP1678753A4 High performance strained cmos devices
08/20/2008EP1676296A4 Strained dislocation-free channels for cmos and method of manufacture
08/20/2008EP1576652A4 Chip package sealing method
08/20/2008EP1576072B1 Aqueous phosphoric acid compositions for cleaning semiconductor devices
08/20/2008EP1572833B1 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
08/20/2008EP1567531A4 Composition and method for low temperature deposition of silicon-containing films such as films including silicon, silicon nitride, silicon dioxide and/or silicon-oxynitride
08/20/2008EP1502309A4 Integrated circuit with internal impedance matching circuit
08/20/2008EP1435091A4 Magnetic material structures, devices and methods
08/20/2008EP1405337B1 Structural reinforcement of highly porous low k dielectric films by ild posts
08/20/2008EP1264011A4 Iii-v nitride substrate boule and method of making and using the same
08/20/2008EP1225794B1 Matching device and plasma processing apparatus
08/20/2008EP1218464B1 Chemical mechanical polishing systems and methods for their use
08/20/2008EP1197992B1 Production method for a semiconductor wafer
08/20/2008EP1155437B1 Cooled showerhead for rapid thermal processing (rtp) system
08/20/2008EP1142119B1 On-chip decoupling capacitor system with parallel fuse
08/20/2008EP1095393B1 System and method to correct for distortion caused by bulk heating in a substrate
08/20/2008EP1074643B1 Single-crystal silicon wafer having few crystal defects and method for manufacturing the same
08/20/2008EP1074046B1 Elimination of poly cap for easy poly1 contact for nand floating gate memory
08/20/2008CN201104322Y Seal protection circuit for chip
08/20/2008CN201104321Y Inactive atmosphere device for wet method cleaning
08/20/2008CN101248529A Dual port gain cell with side and top gated read transistor
08/20/2008CN101248528A Sidewall spacers on a memory device
08/20/2008CN101248523A Ferroelectric memory device and manufacturing method thereof, fabricating method for semiconductor device
08/20/2008CN101248522A Gold alloy wire for use as bonding wire exhibiting high bonding reliability, high circularity of press bonded ball, high straight advancing property and high resin flow resistance
08/20/2008CN101248521A Technique for efficiently patterning an underbump metallization layer using a dry etch process
08/20/2008CN101248520A Method for manufacturing semiconductor device
08/20/2008CN101248519A Substrate stiffness method and resulting devices for layer transfer processes
08/20/2008CN101248518A Method for fabricating a wafer level package having through wafer vias for external package connectivity
08/20/2008CN101248517A Encapsulation for micro-processor and the fourth level high speed caching
08/20/2008CN101248516A Selective wet etching of metal nitrides
08/20/2008CN101248515A Semiconductor on glass insulator with deposited barrier layer
08/20/2008CN101248514A Silicon surface preparation
08/20/2008CN101248507A Selection of wavelenghts for end point in a time division multiplexed process
08/20/2008CN101248392A Optical imaging arrangement
08/20/2008CN101248391A Lithographic coated-type underlayer film forming composition containing vinylnaphthalene resin derivative
08/20/2008CN101248390A Positive photoresist composition, thick film photoresist laminate, method for producing thick film resist pattern, and method for producing connecting terminal
08/20/2008CN101248373A Process of making semiconductor optical lens and semiconductor optical lens fabricated thereby
08/20/2008CN101248363A Semiconductor device, semiconductor chip, method for testing wiring between chips and method for switching wiring between chips
08/20/2008CN101248361A Electronic device testing device and its temperature control method
08/20/2008CN101248222A Doping of particulate semiconductor materials
08/20/2008CN101248221A Process for producing semiconductor substrate
08/20/2008CN101248219A Porous polymer membrane, method for producing same, and method for manufacturing stamper used for production of same
08/20/2008CN101248212A Plasma treatment of hafnium-containing materials
08/20/2008CN101247900A Systems and methods for capture substrates
08/20/2008CN101247077A Voltage booster circuit, power supply circuit, and liquid crystal driver
08/20/2008CN101246949A Non-volatile memory and its production method
08/20/2008CN101246941A Preparation of II-VI family semiconductor CdTe quantum point with H2Te as tellurium source
08/20/2008CN101246938A Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
08/20/2008CN101246937A Method for forming two-dimension graphic pattern by nano-sphere
08/20/2008CN101246933A Soldering pad manufacturing process used for LED Epi wafer
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