Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/20/2008CN101246931A trace amount of boron doped intrinsic silicon hydride thin film
08/20/2008CN101246911A Metal microgrid transparent electrode and method for producing the same
08/20/2008CN101246910A Metal-insulator-metal type capacitor and production method thereof
08/20/2008CN101246909A Thin film transistor and method of forming the same
08/20/2008CN101246904A Semiconductor device and method for manufacturing same
08/20/2008CN101246903A Semiconductor and producing method thereof
08/20/2008CN101246902A InA1N/GaN heterojunction enhancement type high electron mobility transistor structure and production method thereof
08/20/2008CN101246901A Semiconductor transistor device and method of manufacturing the same
08/20/2008CN101246900A Semiconductor device and manufacturing method thereof
08/20/2008CN101246899A Secondary extension structure of silicon carbide
08/20/2008CN101246897A Wafer level image sensor package with die receiving cavity and method of the same
08/20/2008CN101246896A Image sensor devices having light blocking layers and methods of fabricating the same
08/20/2008CN101246894A Photoelectric conversion device and electronic device, and method for manufacturing photoelectric conversion device
08/20/2008CN101246893A Integrated circuit package body with large conductive area and its production method
08/20/2008CN101246891A Nonvolatile memory devices and methods of fabricating the same
08/20/2008CN101246890A Semiconductor device and method of manufacturing the same
08/20/2008CN101246889A Nonvolatile memory transistor having poly-silicon fin, stacked nonvolatile memory device and method of fabricating the same
08/20/2008CN101246886A Power transistor with MOS structure and production method thereof
08/20/2008CN101246884A Shallow plough groove isolation region, shallow plough groove isolation region mask plate and its production method
08/20/2008CN101246883A Integrated circuit packaging
08/20/2008CN101246882A Semiconductor device package with multi-chips and method of the same
08/20/2008CN101246880A LED array packaging structure with silica carrier plate and its production method
08/20/2008CN101246879A White light LED packaging structure with silica substrate and its production method
08/20/2008CN101246878A LED chip packaging structure with ceramic as substrate and its production method
08/20/2008CN101246875A Semiconductor device and method for fabricating the same
08/20/2008CN101246874A Structure for metal cap applications
08/20/2008CN101246871A Multi-layer ceramic substrate and its preparing process
08/20/2008CN101246869A Chip upside-down mounting and packaging structure for reducing substrate warping and its production method
08/20/2008CN101246868A Packaging structure and method for sphere pin array substrate with contact pad located in chip center
08/20/2008CN101246867A Electronic device having metal pad structure and method of fabricating the same
08/20/2008CN101246866A Conductive structure for semiconductor integrated circuit and method for forming the same
08/20/2008CN101246865A Packaging conductive structure and its manufacturing method
08/20/2008CN101246864A Packaging conductive structure and its forming method
08/20/2008CN101246863A Conductive structure for semiconductor integrated circuit and method for forming the same
08/20/2008CN101246862A Wafer with radiating structure and its production method
08/20/2008CN101246861A Package board and method for manufacturing thereof
08/20/2008CN101246858A Pixel forming method
08/20/2008CN101246857A Method of forming non-volatile memory cell
08/20/2008CN101246856A Production method of SONOS flash memory
08/20/2008CN101246855A Production method of non-volatile storage device selection grid
08/20/2008CN101246854A Production method of complementary metal-oxide-semiconductor transistor
08/20/2008CN101246853A Production method and structure of complementary metal-oxide-semiconductor transistor
08/20/2008CN101246852A Method for fabricating dual-gate semiconductor device
08/20/2008CN101246851A Method for controlling thickness of grid oxidizing layer and production method of semiconductor device
08/20/2008CN101246850A Insulated gate field effect transistor and method for manufacturing the same
08/20/2008CN101246849A Integrated circuit with antenna conductor and process for manufacturing the same
08/20/2008CN101246848A Semiconductor device
08/20/2008CN101246847A Interconnect structure with bi-layer metal cap
08/20/2008CN101246846A Method of forming metal wire in semiconductor device
08/20/2008CN101246845A Method of forming contact hole of semiconductor device
08/20/2008CN101246844A Production method of hatch and interlayer window hatch
08/20/2008CN101246843A Multi-metal intra-connection structure with optical shielding property and its production method
08/20/2008CN101246842A Method for forming shallow plough groove isolation area in semiconductor integrated circuit technique
08/20/2008CN101246841A Method for reducing cornet shaped particles in STI HDP production
08/20/2008CN101246840A Semiconductor isolation structure and forming method thereof
08/20/2008CN101246839A Semiconductor isolation structure and forming method thereof
08/20/2008CN101246838A Semiconductor isolation structure and forming method thereof
08/20/2008CN101246837A Semiconductor isolation structure and forming method thereof
08/20/2008CN101246836A Substrate carrying platform and process method for its surface
08/20/2008CN101246835A Substrate support assembly
08/20/2008CN101246834A Defect source identifier
08/20/2008CN101246833A Substrate position detecting method, substrate processing method and device
08/20/2008CN101246832A Method of manufacturing a semiconductor integrated circuit device
08/20/2008CN101246831A System and method for film stress and curvature gradient mapping for screening problematic wafers
08/20/2008CN101246830A Method for emending output current by amending semiconductor pin test voltage
08/20/2008CN101246829A Wafer classification method and correlated production method
08/20/2008CN101246828A Method for producing tiny soldered balls with repeatedly-usable substrates
08/20/2008CN101246827A Wire cleaning guide
08/20/2008CN101246826A Method for mounting electronic components
08/20/2008CN101246825A Production method of silicon material high-frequency low-power consumption power junction field effect transistor(JFET)
08/20/2008CN101246824A Method for dynamically etching sheet metal and forming metal wire
08/20/2008CN101246823A Method for preventing crystal defect on fluorine-doped oxide film surface
08/20/2008CN101246822A Laser etching and trench digging method of semiconductor chip
08/20/2008CN101246821A Growing method of gallium-polar gallium nitride buffer layer
08/20/2008CN101246820A Preparation of gallium nitride based epitaxial film
08/20/2008CN101246819A Preparation of strained germanium thin film
08/20/2008CN101246818A Redeposit amorphous silicon thin film
08/20/2008CN101246817A Method for producing silicon quantum wire on insulating layer
08/20/2008CN101246816A Method of fabricating a semiconductor device
08/20/2008CN101246815A Vertical type heat processing apparatus and vertical type heat processing method
08/20/2008CN101246814A Stripping method and method for producing semiconductor device
08/20/2008CN101246813A Substrate processing apparatus
08/20/2008CN101246812A Substrate processing apparatus
08/20/2008CN101246811A Process for wafer bonding
08/20/2008CN101246810A Method for attaching and peeling pressure-sensitive adhesive sheet, attaching and peeling apparatus of pressure-sensitive adhesive sheet
08/20/2008CN101246809A Monitoring coupon and monitoring method for ion implantation technique
08/20/2008CN101246808A Ultraviolet processing equipment and method for forming stress film
08/20/2008CN101246807A Wet method etching device
08/20/2008CN101246760A Low-temperature sintering type conductive slurry based on semiconductor chip agglutination and its manufacturing technique
08/20/2008CN101246366A Three-axis stepping motor control platform
08/20/2008CN101246354A Wafer dry etching device and control method
08/20/2008CN101246313A Optical short distance amending method
08/20/2008CN101246309A Photoresist mask forming method
08/20/2008CN101246306A Optical proximity amending method
08/20/2008CN101246305A Graphic method
08/20/2008CN101246290A Electro-optical device substrate, method of manufacturing the same, electro-optical device and electronic apparatus
08/20/2008CN101246289A Liquid crystal display device and method of fabricating the same
08/20/2008CN101246193A Method of transferring test trays in a handler
08/20/2008CN101245470A Method for producing nano-scale gap metal electrode pair
08/20/2008CN101245450A Method for film coating in enormous quantities with movable plasma case single-chamber
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