Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/21/2008WO2008099949A1 Epitaxial substrate for field effect transistor
08/21/2008WO2008099901A1 Gallium nitride epitaxial crystal, method for production thereof, and field effect transistor
08/21/2008WO2008099896A1 Induction coil, plasma generating apparatus and plasma generating method
08/21/2008WO2008099878A1 Semiconductor integrated circuit device
08/21/2008WO2008099869A1 Compound for photoacid generator, resist composition using the same, and pattern-forming method
08/21/2008WO2008099852A1 GaN-FAMILY SEMICONDUCTOR ELEMENT
08/21/2008WO2008099843A1 Nitride semiconductor element and method for manufacturing nitride semiconductor element
08/21/2008WO2008099811A1 Material for forming silicon-containing film, and silicon-containing insulating film and method for forming the same
08/21/2008WO2008099808A1 Substrate position detecting apparatus and method for adjusting position of imaging component of the substrate position detecting apparatus
08/21/2008WO2008099789A1 Electrostatic chuck
08/21/2008WO2008099768A1 Etching apparatus, etching method, and method for production of electronic device
08/21/2008WO2008099725A1 Polymeric compound, resist composition, and method for formation of resist pattern
08/21/2008WO2008099709A1 Positive-type photosensitive resin composition
08/21/2008WO2008099700A1 Double gate transistor, method for manufacturing the same, and active matrix substrate comprising double gate transistor
08/21/2008WO2008099655A1 Photosensitive resin composition and layered product
08/21/2008WO2008099638A1 Carbon nanotube resistor, semiconductor device, and process for producing them
08/21/2008WO2008099626A1 Magnetoresistance effect element and magnetic random access memory
08/21/2008WO2008099621A1 Composition for under-resist film formation and under-resist film formed from the same
08/21/2008WO2008099620A1 Composition for antireflection film formation and method of forming resist pattern with the same
08/21/2008WO2008099597A1 Semiconductor device and method for manufacturing the same
08/21/2008WO2008099565A1 Semiconductor device and method for manufacturing the same
08/21/2008WO2008099528A1 Display device and method for manufacturing display device
08/21/2008WO2008099526A1 Thin film transistor, and display device
08/21/2008WO2008099522A1 Modifier for low dielectric constant film, and method for production thereof
08/21/2008WO2008099510A1 Process for producing silver powder
08/21/2008WO2008099499A1 P-type mos transistor manufacturing method, method for manufacturing cmos-type semiconductor device using the p-type mos transistor, and cmos-type semiconductor device manufactured by the manufacturing method
08/21/2008WO2008099449A1 Heat insulating structure, heater, heating system, substrate processing apparatus and process for manufacturing semiconductor device
08/21/2008WO2008099246A2 Multilayer structure and its fabrication process
08/21/2008WO2008099245A1 Method for polishing heterostructures
08/21/2008WO2008099229A1 Semiconductor device and method of forming a semiconductor device
08/21/2008WO2008098963A2 Method of forming an oxide thin film
08/21/2008WO2008098890A1 Metal gates with low charge trapping and enhanced dielectric reliability characteristics for high-k gate dielectric stacks
08/21/2008WO2008098861A1 Method and automatic mounting machine for mounting semiconductor chips on a substrate in the form of a flip-chip
08/21/2008WO2008098593A1 Titanium etchant composition
08/21/2008WO2008098404A2 Method for manufacturing a single-crystal film, and integrated optical device comprising such a single-crystal film
08/21/2008WO2008098278A1 A method for processing elongate substrates and a substrate securing apparatus
08/21/2008WO2008083284A3 Front-end processed wafer having through-chip connections
08/21/2008WO2008083250A3 Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
08/21/2008WO2008082978A3 Electrostatic chuck and method of forming
08/21/2008WO2008082976A3 Method for leakage reduction in fabrication of high -density fram arrays
08/21/2008WO2008082518A3 Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
08/21/2008WO2008079938A3 Light emitting diodes (leds) with improved light extraction by roughening
08/21/2008WO2008079077A3 Nanoelectronic structure and method of producing such
08/21/2008WO2008073954A3 Wet photoresist stripping process and apparatus
08/21/2008WO2008070830A3 Components for use in electro-optic displays
08/21/2008WO2008066678A3 Automation for high throughput semiconductor batch-wafer processing equipment
08/21/2008WO2008066678A2 Automation for high throughput semiconductor batch-wafer processing equipment
08/21/2008WO2008058196A3 Chemical mechanical polishing of moisture sensitive surfaces and compositions therefor
08/21/2008WO2008057770A9 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/21/2008WO2008057558A3 Systems and methods for nanowire growth
08/21/2008WO2008041211A3 Device and method for removing liquid from a surface of a disc-like article
08/21/2008WO2008027386A3 Controlled ambient system for interface engineering
08/21/2008WO2008009452A3 Device for cleaning a flat object
08/21/2008WO2007126815A3 Methods and apparatus for polishing an edge of a subtrate
08/21/2008WO2007120573A3 Plasma dielectric etch process including ex-situ backside polumer removal for low-dielectric constant material
08/21/2008WO2007117668A3 Methods and articles including nanomaterial
08/21/2008WO2007112171A3 Semiconductor device and method for forming the same
08/21/2008WO2007102925A3 Methods and arrangement for a highly efficient gas distribution arrangement
08/21/2008WO2007017404A3 Arrangement for hermetically sealing components, and method for the production thereof
08/21/2008WO2006062823A3 Systems and methods for solder bonding
08/21/2008WO2004101222A3 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
08/21/2008US20080201682 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
08/21/2008US20080201126 Method of Automatically Generating the Structures From Mask Layout
08/21/2008US20080200100 Substrate Processing Apparatus
08/21/2008US20080200039 Nitridation process
08/21/2008US20080200038 Heat processing method and apparatus for semiconductor process
08/21/2008US20080200037 Method of thinning a wafer
08/21/2008US20080200036 Manufacturing solar cells; forming extremely fine structures selectively without damaging or attacking adjacent areas; simple, low cost
08/21/2008US20080200035 Method of forming contact hole of semiconductor device
08/21/2008US20080200034 Method to remove beol sacrificial materials and chemical residues by irradiation
08/21/2008US20080200033 Chemical mechanical planarization of silicon carbide at high removal rate without affecting silicon dioxide dielectric layer; abrasive particles combined with benzotriazole, 1H-tetrazole, benzene sulfonic acid, phosphoric acid or organic phosphonic acid in solvent and water
08/21/2008US20080200032 Polishing method of semiconductor substrate
08/21/2008US20080200031 Method of fabricating gate electrode having polysilicon film and wiring metal film
08/21/2008US20080200030 Method For Producing an Electronic Component
08/21/2008US20080200029 Method of fabricating microstructures
08/21/2008US20080200028 Methods of positioning and/or orienting nanostructures
08/21/2008US20080200027 Method of forming metal wire in semiconductor device
08/21/2008US20080200026 Method of forming fine metal patterns for a semiconductor device using a damascene process
08/21/2008US20080200025 Method of forming composite opening and method of dual damascene process using the same
08/21/2008US20080200024 Semiconductor device and method for fabricating the same
08/21/2008US20080200023 Method of fabricating micro connectors
08/21/2008US20080200022 Post-seed deposition process
08/21/2008US20080200021 SPLIT POLY-SiGe/POLY-Si ALLOY GATE STACK
08/21/2008US20080200020 Semiconductor device and method of fabricating a semiconductor device
08/21/2008US20080200019 Selective Deposition of Noble Metal Thin Films
08/21/2008US20080200018 Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device
08/21/2008US20080200017 Method of producing semiconductor device
08/21/2008US20080200016 Method of fabricating nonvolatile semiconductor memory device
08/21/2008US20080200015 Multi-step plasma doping with improved dose control
08/21/2008US20080200014 Method of forming a vertical diode and method of manufacturing a semiconductor device using the same
08/21/2008US20080200013 Gallium nitride materials and methods associated with the same
08/21/2008US20080200012 Wafer processing method and laser processing apparatus
08/21/2008US20080200011 High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
08/21/2008US20080200010 Method for Manufacturing Bonded Wafer
08/21/2008US20080200009 Methods of Forming Stacked Semiconductor Devices with Single-Crystal Semiconductor Regions
08/21/2008US20080200008 Bonding interface quality by cold cleaning and hot bonding
08/21/2008US20080200007 Methods of forming semiconductor devices
08/21/2008US20080200006 Method for Forming Shallow Trench Isolation of Semiconductor Device
08/21/2008US20080200005 Structure and method of fabricating a transistor having a trench gate
08/21/2008US20080200004 Method of fabricating semiconductor optical device