Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/21/2008US20080200003 Method for Forming Multi-Layered Binary Oxide Film for Use in Resistance Random Access Memory
08/21/2008US20080200002 Plasma Sputtering Film Deposition Method and Equipment
08/21/2008US20080200001 Method of producing a transistor
08/21/2008US20080200000 Method for manufacturing semiconductor device
08/21/2008US20080199999 Formation of a Selective Carbon-Doped Epitaxial Cap Layer on Selective Epitaxial SiGe
08/21/2008US20080199998 Pre-epitaxial disposable spacer integration scheme with very low temperature selective epitaxy for enhanced device performance
08/21/2008US20080199997 Methods of Forming Inter-poly Dielectric (IPD) Layers in Power Semiconductor Devices
08/21/2008US20080199996 Method for forming a split gate memory device
08/21/2008US20080199995 Integrated Hydrogen Anneal and Gate Oxidation for Improved Gate Oxide Integrity
08/21/2008US20080199994 Method of Producing Semiconductor Device and Semiconductor Device
08/21/2008US20080199993 Protective layer in device fabrication
08/21/2008US20080199992 Display device, manufacturing method thereof, and television receiver
08/21/2008US20080199991 Stacked semiconductor device and method of fabrication
08/21/2008US20080199990 Semiconductor Constructions, and Methods of Forming Semiconductor Constructions
08/21/2008US20080199989 Method of manufacturing semiconductor device
08/21/2008US20080199988 Conductive pattern formation method
08/21/2008US20080199987 Manufacturing method of semiconductor device and manufacturing method of lead frame
08/21/2008US20080199986 Method and apparatus for manufacturing electronic integrated circuit chip
08/21/2008US20080199985 Leadframe enhancement and method of producing a multi-row semiconductor package
08/21/2008US20080199983 Method for manufacturing a semiconductor laser
08/21/2008US20080199982 Fabrication Process for Package With Light Emitting Device On A Sub-Mount
08/21/2008US20080199981 Method for forming a fluid ejection device
08/21/2008US20080199980 Method of manufacturing a semiconductor integrated circuit device
08/21/2008US20080199979 Semiconductor device and method for fabricating the same
08/21/2008US20080199977 Activated Chemical Process for Enhancing Material Properties of Dielectric Films
08/21/2008US20080199976 Method of manufacturing semiconductor device including ferroelectric capacitor
08/21/2008US20080199975 Methods of forming a metal oxide layer pattern having a decreased line width of a portion thereof and methods of manufacturing a semiconductor device using the same
08/21/2008US20080199974 Method for Functionalizing Biosensor Chips
08/21/2008US20080199817 Resist pattern forming method
08/21/2008US20080199816 Method of Automatic Fluid Dispensing for Imprint Lithography Processes
08/21/2008US20080199814 Device manufacturing process utilizing a double patterning process
08/21/2008US20080199810 Reacting such as polyether sulfone or carbonyl having haloalkyl substituents with allyl alcoholate or allylphenolate; forming allyl ether groups capable of reacting with peroxide to form crosslinkable epoxy groups; thermal ink jet printing
08/21/2008US20080199788 photo mask has different shapes depending on the desired thickness of the photoresist film to be formed in the translucent areas, it allow different amounts of light to pass through translucent areas, while thickness of the photoresist film that remains after light exposure is constant, reduces cost
08/21/2008US20080199653 Method of forming two-dimensional pattern by using nanospheres
08/21/2008US20080199284 Substrate processing apparatus
08/21/2008US20080199283 Substrate processing apparatus
08/21/2008US20080199282 Cluster tool architecture for processing a substrate
08/21/2008US20080199281 Vacuum System For Wafer Handling
08/21/2008US20080199126 Method for Printing a Near Field Photoinduced Stable Structure, and Optical Fiber Tip for Implementing Same
08/21/2008US20080198889 Semiconductor laser device
08/21/2008US20080198885 Low creep metallization for optoelectronic applications
08/21/2008US20080198649 Memory device and method of manufacturing a memory device
08/21/2008US20080198568 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
08/21/2008US20080198553 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
08/21/2008US20080198321 Liquid crystal optical device and method for producing the same
08/21/2008US20080198288 Liquid crystal display and manufacturing method for the same
08/21/2008US20080198287 Display panel, method for manufacturing the same, motherboard for manufacturing the same and method for manufacturing a display substrate for the same
08/21/2008US20080197514 Die coat perimeter to enhance semiconductor reliability
08/21/2008US20080197513 Beol interconnect structures with improved resistance to stress
08/21/2008US20080197512 Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby
08/21/2008US20080197511 Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
08/21/2008US20080197508 Plated pillar package formation
08/21/2008US20080197507 Electronic package structure and method
08/21/2008US20080197506 Semiconductor device manufacturing method, semiconductor device, and semiconductor wafer structure
08/21/2008US20080197505 Semiconductor device and method for manufacturing the same
08/21/2008US20080197504 Single-sided, flat, no lead, integrated circuit package
08/21/2008US20080197502 Semiconductor device having metal wirings of laminated structure
08/21/2008US20080197501 Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate
08/21/2008US20080197500 Interconnect structure with bi-layer metal cap
08/21/2008US20080197499 Structure for metal cap applications
08/21/2008US20080197498 Gate Electrode Silicidation Process
08/21/2008US20080197496 Semiconductor device having at least two layers of wirings stacked therein and method of manufacturing the same
08/21/2008US20080197494 Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
08/21/2008US20080197493 Integrated circuit including conductive bumps
08/21/2008US20080197492 Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
08/21/2008US20080197491 Semiconductor device and method for producing the same
08/21/2008US20080197490 Conductive structure for a semiconductor integrated circuit and method for forming the same
08/21/2008US20080197489 Packaging conductive structure and method for manufacturing the same
08/21/2008US20080197488 Bowed wafer hybridization compensation
08/21/2008US20080197487 Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device
08/21/2008US20080197486 Semiconductor device and method for manufacturing the same
08/21/2008US20080197485 Module comprising a semiconductor chip comprising a movable element
08/21/2008US20080197484 Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package
08/21/2008US20080197483 Lidless semiconductor cooling
08/21/2008US20080197482 Semiconductor module, portable device and method for manufacturing semiconductor module
08/21/2008US20080197480 Semiconductor device package with multi-chips and method of the same
08/21/2008US20080197479 Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
08/21/2008US20080197477 Flip-Chip Grid Ball Array Strip and Package
08/21/2008US20080197473 Chip holder with wafer level redistribution layer
08/21/2008US20080197469 Multi-chips package with reduced structure and method for forming the same
08/21/2008US20080197467 Conductive structure for a semiconductor integrated circuit and method for forming the same
08/21/2008US20080197465 Semiconductor device and method of manufacturing the same
08/21/2008US20080197463 Electronic Component And Method For Manufacturing An Electronic Component
08/21/2008US20080197461 Apparatus for wire bonding and integrated circuit chip package
08/21/2008US20080197460 Packaged ic device comprising an embedded flex circuit, and methods of making same
08/21/2008US20080197459 Encapsulated chip scale package having flip-chip on lead frame structure and method
08/21/2008US20080197457 Silicon wafer and its manufacturing method
08/21/2008US20080197456 Substrate polishing method, semiconductor device and fabrication method therefor
08/21/2008US20080197455 Semiconductor device and manufacturing method therefor
08/21/2008US20080197454 Method and system for removing impurities from low-grade crystalline silicon wafers
08/21/2008US20080197453 Semiconductor device and manufacturing method of the same
08/21/2008US20080197451 High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications
08/21/2008US20080197448 SHALLOW TRENCH ISOLATION FILL BY LIQUID PHASE DEPOSITION OF SiO2
08/21/2008US20080197447 Method for manufacturing a structure of semiconductor-on-insulator type
08/21/2008US20080197446 Isolated diode
08/21/2008US20080197444 Integrated circuit and method including an isolation arrangement
08/21/2008US20080197443 Semiconductor Substrate Comprising a Pn-Junction and Method For Producing Said Substrate
08/21/2008US20080197442 Semiconductor component with cell structure and method for producing the same
08/21/2008US20080197441 Semiconductor component with vertical structures having a high aspect ratio and method
08/21/2008US20080197439 Semiconductor Device And Method For Manufacturing Same
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