Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/28/2008US20080206939 Semiconductor device with integrated resistive element and method of making
08/28/2008US20080206937 Wrap-around gate field effect transistor
08/28/2008US20080206936 Method of Forming Conducting Nanowires
08/28/2008US20080206935 Method for fabricating thin film transistor using local oxidation and transparent thin film transistor
08/28/2008US20080206934 Forming semiconductor fins using a sacrificial fin
08/28/2008US20080206933 Semiconductor fin integration using a sacrificial fin
08/28/2008US20080206932 Data line layout in semiconductor memory device and method of forming the same
08/28/2008US20080206931 Nonvolatile memory element and production method thereof and storage memory arrangement
08/28/2008US20080206930 Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
08/28/2008US20080206929 Printing device, production unit, and production method of electronic parts
08/28/2008US20080206928 Soldering method and method of manufacturing semiconductor device including soldering method
08/28/2008US20080206927 Electronic component structure and method of making
08/28/2008US20080206926 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
08/28/2008US20080206925 Methods and apparatus to improve frit-sealed glass package
08/28/2008US20080206924 Method for fabtricating semiconductor device
08/28/2008US20080206923 Oxide semiconductor target, method of forming the same, method of forming oxide semiconductor layer using the same and method of manufacturing semiconductor device using the same
08/28/2008US20080206920 PCRAM device with switching glass layer
08/28/2008US20080206919 Method of manufacture of a microlens structure for opto-electric semiconductor device
08/28/2008US20080206918 Image sensor package and forming method of the same
08/28/2008US20080206917 Production of a Radiation Detector
08/28/2008US20080206916 Solar cell and method and apparatus for manufacturing solar cell
08/28/2008US20080206915 Connecting material before photolithography; vacuum pumping system; forming pattern of photosensitive polymer; etching; masking; combustion
08/28/2008US20080206914 Patterning self-aligned transistors using back surface illumination
08/28/2008US20080206913 Cleaving edge-emitting lasers from a wafer cell
08/28/2008US20080206912 Array substrate, method of manufacturing the same and method of crystallizing silicon
08/28/2008US20080206911 Method of manufacturing liquid crystal display
08/28/2008US20080206909 Composition of carbon nitride, thin film transistor with the composition of carbon nitride, display device with the thin film transistor, and manufacturing method thereof
08/28/2008US20080206908 Semiconductor device test structures and methods
08/28/2008US20080206907 Method for fabricating semiconductor device to which test is performed at wafer level and apparatus for testing semiconductor device
08/28/2008US20080206906 Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device
08/28/2008US20080206905 Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies
08/28/2008US20080206904 Method of making pcb circuit modification from multiple to individual chip enable signals
08/28/2008US20080206903 Adaptive threshold wafer testing device and method thereof
08/28/2008US20080206902 Stress measurements during large-mismatch epitaxial processes
08/28/2008US20080206901 Pulsed-plasma system with pulsed reaction gas replenish for etching semiconductor structures
08/28/2008US20080206900 Pulsed-plasma system for etching semiconductor structures
08/28/2008US20080206899 Measurement reflection of semiconductor substrate with concave segments; calibration; vapor deposition; forming metal film
08/28/2008US20080206898 Pattern Monitor Mark and Monitoring Method Suitable for Micropattern
08/28/2008US20080206897 Selective Depth Optical Processing
08/28/2008US20080206896 Method for repairing liquid crystal display panel
08/28/2008US20080206895 Magnetic random access memory and method of manufacturing the same
08/28/2008US20080206838 Nanoscaling ordering of hybrid materials using genetically engineered mesoscale virus
08/28/2008US20080206680 Coating comprises oligomer or resin of tris(hydroxyalkyl)isocyanurate or derivative on a substrate; baking to form an antireflective coating; photoresist covering; high dry etching rate; selectivity; semiconductors
08/28/2008US20080206657 Multilayer; substrate with light shielding film; measurement flatness; calibration
08/28/2008US20080206656 Scattering bar OPC application method for sub-half wavelength lithography patterning
08/28/2008US20080206654 Method for manufacturing semiconductor devices, and method for forming a pattern onto an exposure mask
08/28/2008US20080206653 Exposure mask
08/28/2008US20080206569 Diamond Based Substrate for Electronic Device
08/28/2008US20080206539 Durable conformal wear-resistant carbon-doped metal oxide-comprising coating
08/28/2008US20080206452 Quartz component for plasma processing apparatus and restoring method thereof
08/28/2008US20080206028 Pod cover removing-installing apparatus
08/28/2008US20080206023 Semiconductor substrate processing apparatus with horizontally clustered vertical stacks
08/28/2008US20080206022 Mult-axis robot arms in substrate vacuum processing tool
08/28/2008US20080206021 Stacked process chambers for magnetic media processing tool
08/28/2008US20080205476 HIGH EFFICIENCY PARTIAL DISTRIBUTED FEEDBACK (p-DFB) LASER
08/28/2008US20080205463 Method of manufacturing vertical-cavity surface-emitting laser device and vertical-cavity surface-emitting laser device
08/28/2008US20080205462 Surface emitting laser array, production process thereof, and image forming apparatus having surface emitting laser array
08/28/2008US20080205143 Nonvolatile semiconductor memory device having protection function for each memory block
08/28/2008US20080205140 Bit line structure for a multilevel, dual-sided nonvolatile memory cell array
08/28/2008US20080205133 Capacitor-less volatile memory cell, device, system and method of making same
08/28/2008US20080205132 Memory Element and Semiconductor Device, and Method for Manufacturing the Same
08/28/2008US20080205131 Magnetic random access memory with selective toggle memory cells
08/28/2008US20080205130 Mram free layer synthetic antiferromagnet structure and methods
08/28/2008US20080205118 Integrated circuit having a resistive switching device
08/28/2008US20080205117 Semiconductor integrated circuit device
08/28/2008US20080205116 Three-dimensional magnetic memory
08/28/2008US20080204724 Method Of Apparatus For Detecting Particles On A Specimen
08/28/2008US20080204693 Substrate Support Method
08/28/2008US20080204679 Lithographic apparatus and device manufacturing method
08/28/2008US20080204675 Coating/developing apparatus and pattern forming method
08/28/2008US20080204635 Transparent, Conductive Film with a Large Birefringence
08/28/2008US20080204620 Transflective Liquid Crystal Device and Method of Manufacturing the Same
08/28/2008US20080204065 Fault tolerant selection of die on wafer
08/28/2008US20080204059 Probe Tile for Probing Semiconductor Wafer
08/28/2008US20080203590 Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
08/28/2008US20080203588 Packaged integrated circuit
08/28/2008US20080203587 Semiconductor device including conductive lines with fine line width and method of fabricating the same
08/28/2008US20080203586 Integrated Circuit and Methods of Manufacturing a Contact Arrangement and an Interconnection Arrangement
08/28/2008US20080203585 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
08/28/2008US20080203583 Semiconductor package and fabrication method thereof
08/28/2008US20080203581 Integrated circuit
08/28/2008US20080203579 Sacrificial metal spacer dual damascene
08/28/2008US20080203578 Circuit device, a method for manufacturing a circuit device, and a semiconductor module
08/28/2008US20080203577 Semiconductor integrated circuit device and fabrication method for the same
08/28/2008US20080203576 Semiconductor device and method for manufacturing the same
08/28/2008US20080203574 Polysilsesquioxanes; wear resistance; etching resistance; dielectrics; reduced parasitic capacitance
08/28/2008US20080203572 Semiconductor device and method of fabricating the same
08/28/2008US20080203571 Backside metallization for integrated circuit devices
08/28/2008US20080203570 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method
08/28/2008US20080203569 Semiconductor device and manufacturing method thereof
08/28/2008US20080203564 Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same
08/28/2008US20080203563 Semiconductor package and manufacturing method thereof
08/28/2008US20080203561 High frequency device module and manufacturing method thereof
08/28/2008US20080203558 Method of semiconductor device protection, package of semiconductor device
08/28/2008US20080203557 Semiconductor module and method of manufacturing the same
08/28/2008US20080203556 Through-Wafer Interconnection
08/28/2008US20080203554 Semiconductor integrated circuit device
08/28/2008US20080203552 Stacked Package and Method of Fabricating the Same
08/28/2008US20080203550 Component, Power Component, Apparatus, Method Of Manufacturing A Component, And Method Of Manufacturing A Power Semiconductor Component
08/28/2008US20080203546 Quad flat no-lead chip carrier with stand-off
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