Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/27/2008EP1962165A1 Ozonated water flow and concentration control apparatus and method
08/27/2008EP1962128A1 Aligning apparatus, bonding apparatus and aligning method
08/27/2008EP1961838A1 Method and apparatus for comtrolling gas flow to a processing chamber
08/27/2008EP1961836A1 Apparatus for controlling gas flow to a processing chamber
08/27/2008EP1961775A1 Fluorine-containing polymer, negative photosensitive composition and partition wall
08/27/2008EP1961739A1 Novel compound, polymer, and resin composition
08/27/2008EP1961042A2 A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device
08/27/2008EP1961041A2 Method and system for processing frozen adhesive particles
08/27/2008EP1961040A2 Memory cell having stressed layers
08/27/2008EP1961039A1 Technique for reducing crystal defects in strained transistors by tilted preamorphization
08/27/2008EP1961038A1 Mos transistor with better short channel effect control and corresponding manufacturing method
08/27/2008EP1961037A1 Reciprocating aperture mask system and method
08/27/2008EP1961036A1 Wafer level hermetic bond using metal alloy with raised feature
08/27/2008EP1961035A1 Device and method for treating the surfaces of substrates
08/27/2008EP1961034A1 Magnetic annealing tool heat exchange system and processes
08/27/2008EP1960310A2 Silicon-germanium hydrides and methods for making and using same
08/27/2008EP1886339A4 Method and apparatus for hydrogenation of thin film silicon on glass
08/27/2008EP1744453B1 Surface acoustic wave device
08/27/2008EP1737600B1 Method and apparatus for transferring conductive pieces during semiconductor device fabrication
08/27/2008EP1719155B1 Semiconductor device and method using nanotube contacts
08/27/2008EP1683187A4 Stressed semiconductor device structures having granular semiconductor material
08/27/2008EP1625610B1 Plasma ashing apparatus comprising an endpoint detection system
08/27/2008EP1521974B1 Electronic circuit with test unit for testing interconnects
08/27/2008EP1509814A4 Acetal protected polymers and photoresists compositions thereof
08/27/2008EP1394842B1 Thin film forming apparatus cleaning method
08/27/2008EP1386115B1 Process chamber cooling
08/27/2008EP1297533B1 Magnetic memory
08/27/2008EP1192453A4 Molecular and atomic scale evaluation of biopolymers
08/27/2008EP1034457B1 Method of fine feature edge tuning with optically-halftoned mask
08/27/2008EP0932665B1 Method for sorting antifungal molecules acting on the glucanosyltransferase activity
08/27/2008CN201107806Y Device for picking up crystal particle
08/27/2008CN201107547Y Metal light shield box
08/27/2008CN201107546Y Metal light shield box and filtration apparatus thereof
08/27/2008CN201107505Y Reclaiming integrated circuit block hand casting trays with valves
08/27/2008CN201107330Y Needle clamp and needle clamp component
08/27/2008CN201106985Y Exhaust air pipeline of alloy baking apparatus
08/27/2008CN201105409Y Chemical mechanical grinder bench discharging pipe
08/27/2008CN101253633A Silicon carbide semiconductor device and method for producing the same
08/27/2008CN101253632A Semiconductor device including a strained superlattice on stress regions and associated methods
08/27/2008CN101253622A Capacitorless DRAM on bulk silicon
08/27/2008CN101253621A Semiconductor device and manufacturing method thereof
08/27/2008CN101253620A Semiconductor device and manufacturing method thereof
08/27/2008CN101253619A Technique for forming recessed strained drain/source in NMOS and PMOS transistors
08/27/2008CN101253618A Thin-film element, display device and memory cell using the thin-film element, and their fabrication method
08/27/2008CN101253617A Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions
08/27/2008CN101253616A Workpiece transfer device
08/27/2008CN101253615A Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
08/27/2008CN101253614A Workpiece support structures and apparatus for accessing same
08/27/2008CN101253613A Device and method for picking up semiconductor chip
08/27/2008CN101253612A Wafer-level burn-in method and wafer-level burn-in apparatus
08/27/2008CN101253611A 薄膜晶体管阵列衬底的制造方法、及薄膜晶体管阵列衬底 The method of manufacturing a thin film transistor array substrate and a thin film transistor array substrate,
08/27/2008CN101253610A Transistor, organic semiconductor device, and method of manufacturing same
08/27/2008CN101253609A Transistor and method of manufacturing same, and semiconductor device having the same
08/27/2008CN101253608A Process for forming an electronic device including discontinuous storage elements
08/27/2008CN101253607A Polishing composition
08/27/2008CN101253606A Polishing composition
08/27/2008CN101253605A Method of cleaning and process for producing semiconductor device
08/27/2008CN101253604A 衬底处理方法和衬底处理设备 The substrate processing method and substrate processing device
08/27/2008CN101253603A Method of film formation and computer-readable storage medium
08/27/2008CN101253602A Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
08/27/2008CN101253601A Post and penetration interconnection
08/27/2008CN101253449A Photosensitive resin composition and photosensitive element
08/27/2008CN101253447A Thin-film transistor substrate and display device
08/27/2008CN101253399A Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement
08/27/2008CN101253282A Film-forming method and film-forming apparatus
08/27/2008CN101253258A Aqueous solution and method for removing ionic contaminants from the surface of a workpiece
08/27/2008CN101253246A Insulating liquid die-bonding agent and semiconductor device
08/27/2008CN101253113A Work loading/unloading system and conveyance device
08/27/2008CN101253022A Polishing pad
08/27/2008CN101253021A Method of improving nanotopography on surface of wafer and wire saw device
08/27/2008CN101253019A Energy monitoring or control of individual vias formed during laser micromachining
08/27/2008CN101252169A Phase change memory device and method of fabricating the same
08/27/2008CN101252150A Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
08/27/2008CN101252149A Thin film transistor, an organic light emitting device including the same, and a manufacturing method thereof
08/27/2008CN101252146A Semiconductor structure and manufacture method thereof
08/27/2008CN101252145A Carbon nanometer tube nano electronic device and manufacturing method thereof
08/27/2008CN101252143A Method and apparatus for bitline and contact via integration in magnetic random access memory arrays
08/27/2008CN101252142A Solid-state imaging apparatus, manufacturing method therefor and electronic equipment using the same
08/27/2008CN101252141A Wafer level image sensor package with die receiving cavity and method of making the same
08/27/2008CN101252137A Photoelectric conversion devise and method of manufacturing the same
08/27/2008CN101252135A Electro-optical device, method for production of electro-optical device, and electronic apparatus
08/27/2008CN101252133A Semiconductor device and method for manufacturing the same
08/27/2008CN101252132A Semiconductor memory device and fabrication process thereof
08/27/2008CN101252130A Semiconductor integrated circuit device and layout method thereof
08/27/2008CN101252128A Semiconductor device and trimming method therefor
08/27/2008CN101252125A Multi-chips package with reduced structure and method for forming the same
08/27/2008CN101252124A Semiconductor device and method of manufacturing the same
08/27/2008CN101252122A Hermetically sealed optoelectronic mems wafer level package
08/27/2008CN101252118A Semiconductor device and method for producing the same
08/27/2008CN101252116A Interconnection structure and method of manufacturing the same
08/27/2008CN101252115A Semiconductor package and manufacture method thereof as well as electric system and manufacture method thereof
08/27/2008CN101252112A Semiconductor device and wire bonding method
08/27/2008CN101252111A Chip packaging structure and manufacturing method thereof
08/27/2008CN101252110A Encapsulation structure and manufacturing method thereof
08/27/2008CN101252108A Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same
08/27/2008CN101252107A Semiconductor package structure and manufacturing method thereof
08/27/2008CN101252104A Methods of forming wiring to transistor and related transistor
08/27/2008CN101252103A Flash memory device and method of forming the device
08/27/2008CN101252102A Method of manufacturing photoelectric conversion device
08/27/2008CN101252101A Method for making ultra-high power intelligent device using exposal field split joint technology
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