| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/28/2008 | US20080203381 Forming arsenide-based complementary logic on a single substrate |
| 08/28/2008 | US20080203379 Array of vertical bipolar junction transistors, in particular selectors in a phase change memory device |
| 08/28/2008 | US20080203378 Semiconductor memory device and method of manufacturing the same |
| 08/28/2008 | US20080203375 Memory Cell with Memory Element Contacting Ring-Shaped Upper End of Bottom Electrode |
| 08/28/2008 | US20080203361 Thermal barrier separates crystal growth area from synthesizing melt area of vessel; semiconductors |
| 08/28/2008 | US20080203354 Polishing liquid |
| 08/28/2008 | US20080203317 Multi-beam deflector array device for maskless particle-beam processing |
| 08/28/2008 | US20080203302 Sample transfer unit and sample transferring method |
| 08/28/2008 | US20080203182 Fluid supply nozzle, substrate processing apparatus and substrate processing method |
| 08/28/2008 | US20080203173 Rfid tag and rfid tag manufacturing method |
| 08/28/2008 | US20080203058 Substrate developing method and developing apparatus |
| 08/28/2008 | US20080203055 Method of forming one or more nanopores for aligning molecules for molecular electronics |
| 08/28/2008 | US20080202917 Method for Manufacturing a Magnetoresistive Multilayer Film |
| 08/28/2008 | US20080202892 Stacked process chambers for substrate vacuum processing tool |
| 08/28/2008 | US20080202801 Circuit Board Structure and Method for Manufacturing a Circuit Board Structure |
| 08/28/2008 | US20080202792 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 08/28/2008 | US20080202689 Plasma processing apparatus |
| 08/28/2008 | US20080202688 Silicon Carbide Gas Distribution Plate and RF Electrode for Plasma Etch Chamber |
| 08/28/2008 | US20080202687 Stacked process chambers for flat-panel display processing tool |
| 08/28/2008 | US20080202686 Self-contained process modules for magnetic media processing tool |
| 08/28/2008 | US20080202685 High yield plasma etch process for interlayer dielectrics |
| 08/28/2008 | US20080202677 Chip bonding tool and related apparatus and method |
| 08/28/2008 | US20080202587 System and method to supply chemical during semiconductor device fabrication |
| 08/28/2008 | US20080202582 Process for Producing Monocrystal Thin Film and Monocrystal Thin Film Device |
| 08/28/2008 | US20080202581 Photovoltaic cell with reduced hot-carrier cooling |
| 08/28/2008 | US20080202577 Dynamic design of solar cell structures, photovoltaic modules and corresponding processes |
| 08/28/2008 | US20080202576 Solar cell structures, photovoltaic panels and corresponding processes |
| 08/28/2008 | US20080202559 Wafer cleaning method and equipment |
| 08/28/2008 | US20080202550 Transmission of Ultrasonic Energy into Pressurized Fluids |
| 08/28/2008 | US20080202421 Mask and substrate alignment for solder bump process |
| 08/28/2008 | US20080202419 Gas manifold directly attached to substrate processing chamber |
| 08/28/2008 | US20080202417 Self-contained process modules for vacuum processing tool |
| 08/28/2008 | US20080202409 Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate |
| 08/28/2008 | US20080202209 Sensor |
| 08/28/2008 | US20080201944 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 08/28/2008 | US20080201925 Ultracapacitor electrode with controlled sulfur content |
| 08/28/2008 | DE202008008582U1 Gaszusammensetzung zum Plasmaätzen von siliziumhaltigen Schichten Gas composition for plasma etching of silicon-containing layers |
| 08/28/2008 | DE20023985U1 Barrierenschichten für ferroelektrische Speichervorrichtungen Barrier layers for ferroelectric memory devices |
| 08/28/2008 | DE19964480B4 Verfahren zum Herstellen einer nichtflüchtigen ferroelektrischen Speicherzelle vom NAND-Typ A method of manufacturing a non-volatile ferroelectric memory cell of the NAND type |
| 08/28/2008 | DE112006002726T5 Isolierung von selbstausgerichteten Gates Isolation of self-aligned gates |
| 08/28/2008 | DE112006002626T5 Halbleitersubstrat und Verfahren zu dessen Herstellung Semiconductor substrate and process for its preparation |
| 08/28/2008 | DE112006001735T5 Blockkontaktarchitekturen für Transistoren mit Kanälen in einer Nano-Größenordnung Contact block architectures for transistors with channels in a nano-scale |
| 08/28/2008 | DE112004001155T5 Positivresist - Zusammensetzung und Methode zur Bildung von Resistmustern unter Verwendung derselben Positive resist - Composition and method of forming resist patterns using the same |
| 08/28/2008 | DE10350684B4 Verfahren zur Herstellung einer Leistungstransistoranordnung und mit diesem Verfahren hergestellte Leistungstransistoranordnung A method of manufacturing a power transistor device and produced by this method power transistor device |
| 08/28/2008 | DE102008011265A1 Lötschicht und Substrat zum Bonden von Vorrichtungen, das diese verwendet, und Verfahren zum Herstellen eines solchen Substrats Solder layer and the substrate for bonding devices that uses these, and methods for making such a substrate |
| 08/28/2008 | DE102008010934A1 Laserstrahl-Bestrahlungseinrichtung und Laserstrahl-Bearbeitungseinrichtung Laser beam irradiation apparatus and laser processing equipment |
| 08/28/2008 | DE102008010321A1 Integrierte Schaltung mit Superjunctionhalbleiterelement Integrated circuit with Super Junction semiconductor element |
| 08/28/2008 | DE102008010110A1 Feldeffekttransistor-Anordnung und Verfahren zum Herstellen einer Feldeffekttransistor-Anordnung Field effect transistor arrangement and method of fabricating a field effect transistor arrangement |
| 08/28/2008 | DE102008010098A1 Halbleiterpackage mit einer ein Die aufnehmenden durchgehenden Ausnehmung und einer Verbindungsbohrung und ein Verfahren zu deren Herstellung A semiconductor package having a die receiving a continuous recess, and a connecting bore and a method for their preparation |
| 08/28/2008 | DE102008008752A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 08/28/2008 | DE102008008166A1 Kondensatorstruktur eines Halbleiterbauelements und Verfahren zur Herstellung derselben The capacitor structure of a semiconductor device and method of manufacturing the same |
| 08/28/2008 | DE102008008077A1 Chuck-Aufbau und Plasmaanlage für hohe Dichte mit demselben Chuck structure and plasma system for high density with the same |
| 08/28/2008 | DE102008008076A1 Verfahren zur Herstellung eines nicht-flüchtigen Speicherbauelements A process for producing a non-volatile memory device |
| 08/28/2008 | DE102008008068A1 Semiconductor package for e.g. integrated circuit card in e.g. mobile phone, has external contact terminal provided within through-hole, which electrically connects conductive pattern to semiconductor chip |
| 08/28/2008 | DE102008005866A1 Stapelpackung, Verfahren zur Herstellung derselben und Speicherkarte Stack pack, method for producing the same and the memory card |
| 08/28/2008 | DE102008004289A1 Gap formation prevention structure for use in wafer processing unit, has holder for holding wafer and gap prevention unit with ring, which is positioned on outer side of holder |
| 08/28/2008 | DE102008000217A1 Halbleiterbauelement-Teststrukturen und -verfahren Semiconductor device test structures and procedures |
| 08/28/2008 | DE102007060313A1 Wafer Level Package (WLP) mit guter CTE-Eigenschaft und Verfahren zu deren Herstellung Wafer Level Package (WLP) with good CTE property, and processes for their preparation |
| 08/28/2008 | DE102007057950A1 Work-piece e.g. optical lens surface, holding device for e.g. ion radiating processing device, has support carrier for holding work-piece carrier in position at stop unit using elastic unit |
| 08/28/2008 | DE102007045377A1 Optische Bearbeitung in selektiver Tiefe Optical processing in selective depth |
| 08/28/2008 | DE102007043341A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 08/28/2008 | DE102007035251B3 Isolation ditches with different side panel doping production method for use in dig-insulating smart-power-technology for leading connection of buried endowed layers, comprises drilling narrow and broad ditch by photolithographic process |
| 08/28/2008 | DE102007010563A1 Selektives Wachstum von polykristallinem siliziumhaltigen Halbleitermaterial auf siliziumhaltiger Halbleiteroberfläche Selective growth of polycrystalline silicon-containing semiconductor material of silicon semiconductor surface |
| 08/28/2008 | DE102007009371A1 Semiconductor chip mounting method, involves partially or completely soaking capillary meshing on substrate e.g. printed circuit board, using thin liquid adhesive, and fitting chips to capillary meshing |
| 08/28/2008 | DE102007009281A1 Procedure for the production of material deposition for semiconductor material wafer, comprises creating damage in a semiconductor material and subsequently treating the semiconductor material by heat for ten hours |
| 08/28/2008 | DE102007009255A1 Device for scanning surface of semiconductor, comprises scanning device for scanning surface, which has lighting device that withdraws light rays and glass fiber element |
| 08/28/2008 | DE102007009145A1 Vorrichtung zum Abscheiden kristalliner Schichten wahlweise mittels MOCVD oder HVPE Apparatus for depositing crystalline layers either by MOCVD or HVPE |
| 08/28/2008 | DE102007008934A1 Vorrichtung und Speichervorrichtung, Verfahren zur Herstellung von Strukturen in einem Werkstück und Verfahren zur Herstellung einer Speichervorrichtung Apparatus and storage device, process for the preparation of structures in a workpiece and methods of making a memory device |
| 08/28/2008 | DE102007008777A1 Halbleiterbauelement mit Zellenstruktur und Verfahren zur Herstellung desselben Of the same semiconductor device with cell structure and methods for preparing |
| 08/28/2008 | DE102007008540A1 Verfahren zum Laser-gestützten Bonden, derart gebondete Substrate und deren Verwendung Method for laser-assisted bonding, such bonded substrates and their use |
| 08/28/2008 | DE102007008530A1 Isolationsanordnung und Verfahren zur Herstellung derselben An insulation assembly and method of manufacturing the same |
| 08/28/2008 | DE102007000981A1 Vorrichtung und Verfahren zum Vermessen von Strukturen auf einer Maske und zur Berechnung der aus den Strukturen resultierenden Strukturen in einem Photoresist Apparatus and method for measuring structures on a mask and the calculation of results from the structures structures in a photoresist |
| 08/28/2008 | DE102006030264B4 Verfahren zur Herstellung von Transistoren mit einem Kanal mit biaxialer Verformung, die durch Silizium/Germanium in der Gateelektrode hervorgerufen wird A process for the fabrication of transistors with a channel having biaxial deformation is caused by silicon / germanium in the gate electrode |
| 08/28/2008 | DE102006017115B4 Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung A semiconductor device comprising a plastic housing and method for its preparation |
| 08/28/2008 | DE102005054431B4 Verfahren zum Herstellen eines Flaschengrabens und eines Flaschengrabenkondensators A method of manufacturing a bottle and a bottle trench capacitor grave |
| 08/28/2008 | DE102005039394B4 Verfahren zum Suchen potentieller Fehler eines Layouts einer integrierten Schaltung Method for searching potential failure of a layout of an integrated circuit |
| 08/28/2008 | DE102005030670B4 Vorrichtung zum Schneiden eines Substrats und Verfahren unter Verwendung derselben A device for cutting a substrate, and method using the same |
| 08/28/2008 | DE102005015036B4 Verfahren zur Montage eines Chips auf einer Unterlage A method of mounting a chip on a base |
| 08/28/2008 | DE102004049249B4 Elektronikmodul, Waferprodukt und Herstellungsverfahren Electronics module, wafer product and manufacturing process |
| 08/27/2008 | EP1962349A2 Nanowires-based transparent conductors |
| 08/27/2008 | EP1962347A1 Schottky barrier diode and method for using the same |
| 08/27/2008 | EP1962341A2 SRAM device integrated with a resistor and fabrication process thereof |
| 08/27/2008 | EP1962340A2 Method for manufacturing compound material wafers |
| 08/27/2008 | EP1962339A1 Method for evaluating semiconductor substrate |
| 08/27/2008 | EP1962338A1 Field effect transistor |
| 08/27/2008 | EP1962337A2 Method of preparing a dielectric material with oriented porosity on a substrate by electromagnetic and/or photonic treatment |
| 08/27/2008 | EP1962336A2 Insulating film material , multilayer interconnection structure, method for manufacturing the same and method for manufacturing semiconductor device |
| 08/27/2008 | EP1962335A1 Method of processing chamfered portion of semiconductor wafer and method of correcting groove shape of grindstone |
| 08/27/2008 | EP1962334A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 08/27/2008 | EP1962333A1 Semiconductor device manufacturing method |
| 08/27/2008 | EP1962332A2 Semiconductor device and method for manufacturing the same |
| 08/27/2008 | EP1962331A2 Thin-film solar cell and method of manufacturing the same |
| 08/27/2008 | EP1962330A2 Method for manufacturing SIC semiconductor device |
| 08/27/2008 | EP1962329A1 Substrate holding device, exposure device, exposure method, and device fabrication method |
| 08/27/2008 | EP1962328A1 Liquid recovery member, exposure apparatus, exposure method, and device production method |
| 08/27/2008 | EP1962327A1 Washing liquid for photolithography, and method for washing exposure device using the same |
| 08/27/2008 | EP1962326A1 Reflection-type mask blank for euv lithography, and substrate with electrically conductive film for the mask blank |
| 08/27/2008 | EP1962325A1 Method for manufacturing bonded substrate |
| 08/27/2008 | EP1962324A2 Adhesive tape joining apparatus |
| 08/27/2008 | EP1962323A1 Filament lamp and light irradiation type heat treatment apparatus |