Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/20/2008US20080286918 Methods for Fabricating Semiconductor Structures With Backside Stress Layers
11/20/2008US20080286917 Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics
11/20/2008US20080286916 Methods of stressing transistor channel with replaced gate
11/20/2008US20080286915 Metal-Oxide-Semiconductor High Electron Mobility Transistors and Methods of Fabrication
11/20/2008US20080286914 Display device, method of production of the same, and projection type display device
11/20/2008US20080286913 Field effect transistor with raised source/drain fin straps
11/20/2008US20080286912 Semiconductor device and method for fabricating the same
11/20/2008US20080286911 Method for manufacturing semiconductor device
11/20/2008US20080286910 Method for manufacturing SOI substrate and method for manufacturing semiconductor device
11/20/2008US20080286909 Sidewall semiconductor transistors
11/20/2008US20080286908 Method of Producing a Semiconductor Element in a Substrate
11/20/2008US20080286907 Semiconductor layer for thin film transistors
11/20/2008US20080286906 Stacked bit line dual word line nonvolatile memory
11/20/2008US20080286905 Fin-Type Antifuse
11/20/2008US20080286904 Method for manufacturing semiconductor package
11/20/2008US20080286903 Semiconductor device packaged into chip size and manufacturing method thereof
11/20/2008US20080286902 Method of manufacturing a semiconductor device
11/20/2008US20080286901 Method of Making Integrated Circuit Package with Transparent Encapsulant
11/20/2008US20080286900 Method for adhering semiconductor devices
11/20/2008US20080286899 Method for manufacturing semiconductor device and method for manufacturing system-in-package using the same
11/20/2008US20080286898 Material composition having core-shell microstructure used for varistor
11/20/2008US20080286895 Method of manufacturing an organic device
11/20/2008US20080286892 Method for fabricating three-dimensional photonic crystal
11/20/2008US20080286891 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
11/20/2008US20080286890 Liquid crystal display device and method of fabricating the same
11/20/2008US20080286889 Manufacturing method of liquid crystal display
11/20/2008US20080286888 Test structures and methodology for detecting hot defects
11/20/2008US20080286887 Method for adjusting a transistor model for increased circuit simulation accuracy
11/20/2008US20080286886 Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor Solder Bump Structures
11/20/2008US20080286885 Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
11/20/2008US20080286884 Method for in-situ repairing plasma damage and method for fabricating transistor device
11/20/2008US20080286883 Dry etching method and production method of magnetic memory device
11/20/2008US20080286698 Semiconductor device manufacturing methods
11/20/2008US20080286697 forming a photoresist film on a first side of a wafer having first and second sides, cleaning second side of the wafer while photoresist film on first side, exposing photoresist film on wafer first side to radiation after cleaning wafer second side
11/20/2008US20080286693 Sulfonate derivatives and the use thereof as latent acids
11/20/2008US20080286664 Full Phase Shifting Mask In Damascene Process
11/20/2008US20080286662 Photomask producing method and photomask blank
11/20/2008US20080286594 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
11/20/2008US20080286589 chemical vapor deposition; atomic layer deposition; integrated circuits
11/20/2008US20080286565 Method For Manufacturing Epitaxial wafer
11/20/2008US20080286444 In Situ Substrate Holder Leveling Method and Apparatus
11/20/2008US20080286081 Truck lifted rear-load transfer system
11/20/2008US20080286076 Methods and apparatus for repositioning support for a substrate carrier
11/20/2008US20080286075 Method for producing semiconductor device, and substrate processing apparatus
11/20/2008US20080285603 Tunable laser source with integrated optical modulator
11/20/2008US20080285357 1-transistor type dram cell, dram device and dram comprising thereof and driving method thereof and manufacturing method thereof
11/20/2008US20080285353 Flash memory device, method of manufacturing the same, and method of operating the same
11/20/2008US20080285349 Nonvolatile memory with backplate
11/20/2008US20080285344 Integrated Circuits; Methods for Manufacturing an Integrated Circuit; Memory Modules; Computing Systems
11/20/2008US20080285337 Recordable electrical memory
11/20/2008US20080285247 Low Exothermic Thermosetting Resin Compositions Useful As Underfill Sealants and Having Reworkability
11/20/2008US20080285204 Electrostatic chuck structure for semiconductor manufacturing apparatus
11/20/2008US20080285203 Substrate hold apparatus and method for judging substrate push-up state
11/20/2008US20080285202 In situ monitoring of wafer charge distribution in plasma processing
11/20/2008US20080285185 Semiconductor integrated circuit
11/20/2008US20080285165 Thin film filter system and method
11/20/2008US20080285059 Apparatus and method for in-situ monitoring of wafer bonding time
11/20/2008US20080285024 Highly efficient surface enhanced Raman and fluorescence nanostructure substrates
11/20/2008US20080284969 Thin film transistor array panel and method of manufacturing the same
11/20/2008US20080284967 In-plane switching mode liquid crystal display device and method for fabricating the same
11/20/2008US20080284935 Liquid crystal display units with data and/or address lines being formed of copper alloy and method of fabricating the same
11/20/2008US20080284932 Thin film transistor substrate and liquid crystal display device comprising the same
11/20/2008US20080284893 Solid state imaging device
11/20/2008US20080284837 Methods and systems for therma-based laser processing a multi-material device
11/20/2008US20080284709 Light-emitting device
11/20/2008US20080284611 Vertical system integration
11/20/2008US20080284463 programmable circuit having a carbon nanotube
11/20/2008US20080284457 Method and apparatus for control of a positioning device
11/20/2008US20080284048 Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same
11/20/2008US20080284047 Chip Package with Stiffener Ring
11/20/2008US20080284045 Method for Fabricating Array-Molded Package-On-Package
11/20/2008US20080284043 Base Semiconductor Component For a Semiconductor Component Stack and Method For the Production Thereof
11/20/2008US20080284042 Anisotropically conductive member and method of manufacture
11/20/2008US20080284039 Interconnect structures with ternary patterned features generated from two lithographic processes
11/20/2008US20080284037 Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers
11/20/2008US20080284036 Structure for optimizing fill in semiconductor features deposited by electroplating
11/20/2008US20080284035 Semiconductor device
11/20/2008US20080284034 Method of reducing the surface roughness of spin coated polymer films
11/20/2008US20080284033 Semiconductor device and method for manufacturing semiconductor device
11/20/2008US20080284029 Contact structures and semiconductor devices including the same and methods of forming the same
11/20/2008US20080284027 Method of manufacturing a semiconductor device and semiconductor device
11/20/2008US20080284026 Semiconductor device and method for fabricating the same
11/20/2008US20080284024 Semiconductor Device and Method of Manufacturing the Same
11/20/2008US20080284023 Semiconductor device and method for manufacturing boac/coa
11/20/2008US20080284022 Semiconductor device and method for manufacturing the same
11/20/2008US20080284021 Method for FEOL and BEOL Wiring
11/20/2008US20080284020 Semiconductor contact structure containing an oxidation-resistant diffusion barrier and method of forming
11/20/2008US20080284019 Conductor-dielectric structure and method for fabricating
11/20/2008US20080284016 Reliable metal bumps on top of I/O pads after removal of test probe marks
11/20/2008US20080284015 Bump on via-packaging and methodologies
11/20/2008US20080284013 Method for manufacturing semiconductor device, and semiconductor device
11/20/2008US20080284012 Semiconductor module manufacturing method, semiconductor module, and mobile device
11/20/2008US20080284010 Apparatus for connecting integrated circuit chip to power and ground circuits
11/20/2008US20080284009 Dimple free gold bump for drive IC
11/20/2008US20080284007 Semiconductor module and method for manufacturing semiconductor module
11/20/2008US20080284006 Semiconductor devices including interlayer conductive contacts and methods of forming the same
11/20/2008US20080284003 Semiconductor Packages And Method For Fabricating Semiconductor Packages With Discrete Components
11/20/2008US20080284001 Semiconductor device and fabrication method
11/20/2008US20080284000 Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages
11/20/2008US20080283999 Chip Package with Pin Stabilization Layer
1 ... 2393 2394 2395 2396 2397 2398 2399 2400 2401 2402 2403 2404 2405 2406 2407 2408 2409 2410 2411 2412 2413 ... 6590