Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/25/2008US7456038 Thin film transistor, integrated circuit, liquid crystal display, method of producing thin film transistor, and method of exposure using attenuated type mask
11/25/2008US7456037 EL display device and a method of manufacturing the same
11/25/2008US7456035 Flip chip light emitting diode devices having thinned or removed substrates
11/25/2008US7456034 Nitride semiconductor device and method for fabricating the same
11/25/2008US7456031 Exposure device, exposure method, and semiconductor device manufacturing method
11/25/2008US7456029 Planar flux concentrator for MRAM devices
11/25/2008US7455956 Alignment tolerances between narrow mask lines, for forming interconnects in the array region of an integrated circuit, and wider mask lines, interconnects in the periphery of the integrated circuit; forming contacts between pitch multiplied and non-pitch multiplied features
11/25/2008US7455955 Planarization method for multi-layer lithography processing
11/25/2008US7455950 Resist material and pattern formation method using the same
11/25/2008US7455893 Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD
11/25/2008US7455824 Amorphous carbon, amorphous-carbon coated member, and process for forming amorphous carbon film
11/25/2008US7455799 Method of producing polishing pad-use polyurethane foam and polyurethane foam
11/25/2008US7455791 Abrasives for copper CMP and methods for making
11/25/2008US7455790 Emission spectroscopic processing apparatus and plasma processing method using it
11/25/2008US7455789 Stamper, lithographic method of using the stamper and method of forming a structure by a lithographic pattern
11/25/2008US7455788 Nanoscale electric lithography
11/25/2008US7455748 Magnetic enhancement for mechanical confinement of plasma
11/25/2008US7455747 Substrate processing apparatus, control method for the apparatus, and program for implementing the method
11/25/2008US7455735 Width adjustable substrate support for plasma processing
11/25/2008US7455734 Substrate processing apparatus, substrate holder, and manufacturing method of semiconductor device
11/25/2008US7455729 Method for producing by vapour-phase epitaxy a gallium nitride film with low defect density
11/25/2008US7455563 Thin film electroluminescence display device and method of manufacturing the same
11/25/2008US7455540 Electrical contactor, especially wafer level contactor, using fluid pressure
11/25/2008US7455213 Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
11/25/2008US7455209 Filling device and method for filling balls in the apertures of a ball-receiving element
11/25/2008US7455181 Lid unit for thin plate supporting container
11/25/2008US7455180 Substrate storage container
11/25/2008US7455172 Break-away positioning conveyor mount for accommodating conveyor belt bends
11/25/2008US7455076 Apparatus and method for controlling exhaust pressure in semiconductor manufacturing
11/25/2008US7454834 Method of fabricating semiconductor chip assemblies
11/25/2008CA2367983C Low stress die attachment
11/20/2008WO2008141324A2 Methods for improving the quality of epitaxially-grown semiconductor materials
11/20/2008WO2008141301A1 Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field afm detection
11/20/2008WO2008141182A1 Electrically alterable non-volatile memory and array
11/20/2008WO2008141147A1 Microscopy support structures
11/20/2008WO2008141139A1 Self aligned narrow storage elements for advanced memory device
11/20/2008WO2008140904A1 Electronic device and method for operating a memory circuit
11/20/2008WO2008140876A1 Memory arrays, semiconductor constructions and electronic systems; and methods of forming memory arrays, semiconductor constructions and electronic systems
11/20/2008WO2008140815A1 Mems devices with an etch stop layer
11/20/2008WO2008140786A1 Method and apparatus for making uniform and ultrasmall nanoparticles
11/20/2008WO2008140769A1 Integrated circuit structure with nickel monosilicide film
11/20/2008WO2008140727A1 Substrate transport apparatus
11/20/2008WO2008140697A1 Thermal methods for cleaning post-cmp wafers
11/20/2008WO2008140664A1 Method of and apparatus for inline deposition of materials on a non-planar surface
11/20/2008WO2008140661A1 Flash memory cell with a gate having a flaring shape and manufacturing method thereof
11/20/2008WO2008140660A1 Residue free patterned layer formation method applicable to cmos structures
11/20/2008WO2008140638A2 Ultrasonic consolidated nanostructured materials and methods of manufacturing same
11/20/2008WO2008140589A2 Carbon nanotube ink
11/20/2008WO2008140585A1 Apparatus and method for conformal mask manufacturing
11/20/2008WO2008140558A1 Apparatus and method for fabricating one-dimensional nanostructures on flexible substrates
11/20/2008WO2008140541A1 Wire bonding methods and bonding force calibration
11/20/2008WO2008140254A1 Method of manufacturing semiconductor substrate having gan layer
11/20/2008WO2008140250A1 Reverse gap-fill method for semiconductor device
11/20/2008WO2008140249A1 Gap-fill method for semiconductor device
11/20/2008WO2008140248A1 Method for removing photoresist and contaminants
11/20/2008WO2008140247A1 Hybridly coupled plasma source and plasma chamber using the same
11/20/2008WO2008140136A1 A half tone mask having multi-half permeation part and a method of manufacturing the same
11/20/2008WO2008140119A1 Method for pattern formation
11/20/2008WO2008140094A1 Circuit-connecting material, and connection structure for circuit member
11/20/2008WO2008140093A1 Transfer apparatus, and vacuum treating apparatus
11/20/2008WO2008140087A1 Composition for electroconductive resin, electroconductive resin film, and method for forming electroconductive resin film
11/20/2008WO2008140083A1 Photoresist developing solution
11/20/2008WO2008140076A1 Photoresist remover composition
11/20/2008WO2008140022A1 Heat treatment method for compound semiconductor and apparatus therefor
11/20/2008WO2008140019A1 Method and apparatus for mounting solder ball
11/20/2008WO2008140012A1 Dry etching apparatus and dry etching method
11/20/2008WO2008139996A1 Film-like circuit connecting material and connection structure for circuit member
11/20/2008WO2008139964A1 Optical element driver, lens-barrel and exposure apparatus and method for fabricating device
11/20/2008WO2008139955A1 Projecting exposure method, alignment method and projecting exposure device
11/20/2008WO2008139927A1 Stamp device
11/20/2008WO2008139913A1 Exposure method and flat plate for exposure
11/20/2008WO2008139904A1 Photomask blank and photomask
11/20/2008WO2008139898A1 Semiconductor device manufacturing method and semiconductor device
11/20/2008WO2008139897A1 Semiconductor device manufacturing method and semiconductor device
11/20/2008WO2008139875A1 Vacuum treatment device
11/20/2008WO2008139871A1 Purge gas assembly
11/20/2008WO2008139848A1 Photomask substrate, photomask substrate forming member, photomask substrate manufacturing method, photomask, and exposure method using photomask
11/20/2008WO2008139815A1 Semiconductor device, and its manufacturing method
11/20/2008WO2008139735A1 Surface tester and surface testing method
11/20/2008WO2008139701A1 Electronic component mounting body and electronic component with solder bump and method for manufacturing them
11/20/2008WO2008139698A1 Resin composition and molded article obtained from the composition
11/20/2008WO2008139684A1 Soi substrate manufacturing method and soi substrate
11/20/2008WO2008139669A1 Method for manufacturing thin film transistor and thin film transistor
11/20/2008WO2008139668A1 Electronic part mounting apparatus and method of mounting electronic part
11/20/2008WO2008139654A1 In-Ga-Zn-Sn TYPE OXIDE SINTER AND TARGET FOR PHYSICAL FILM DEPOSITION
11/20/2008WO2008139643A1 Exposure method and exposure apparatus
11/20/2008WO2008139621A1 Process for producing semiconductor device
11/20/2008WO2008139605A1 Stacked package and method of forming stacked package
11/20/2008WO2008139569A1 Electron beam exposure device and electron beam exposure method
11/20/2008WO2008139509A1 Process for producing semiconductor device
11/20/2008WO2008139361A1 Method and system for rapid thermal processing
11/20/2008WO2008139277A1 Improvements in or relating to integrated circuit reliability
11/20/2008WO2008138882A1 Method for removing etching residues from semiconductor components
11/20/2008WO2008138881A1 Method for removing etching residues from semiconductor components
11/20/2008WO2008138725A1 Apparatus and method for ultrasonic wet treatment of plate-like articles
11/20/2008WO2008138608A1 Semiconductor component, method for the production thereof, and use thereof
11/20/2008WO2008122012A3 Integrated non-volatile memory and peripheral circuitry fabrication
11/20/2008WO2008118535A3 Post-supported microbolometer pixel
11/20/2008WO2008108824A3 Lumped plasmonic diode and lumped plasmonic rectifier
11/20/2008WO2008106040A3 Led device having improved light output
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