Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/13/2008US20080276979 Plurality of quantum dots on the first and second surface create strain in the nanoribbon; positions of quantum dots on first surface are anticorrelated with respect to positions of second such that an electronic energy miniband structure is created; periodic longitudinal modulation
11/13/2008US20080276959 Method and Apparatus for the Treatment of Objects, in Particular for the Cleaning of Semiconductor Elements
11/13/2008US20080276957 Method of cleaning a cvd device
11/13/2008US20080276813 Method and Apparatus for Printing a Patterned Layer on a Flatsubstate with a Flat-Type-Bed
11/13/2008DE202008011374U1 Thermodeneinheit zum Verbinden und/oder zum elektrischen Kontaktieren von elektrischen und/oder elektronischen Bauteilen sowie Vorrichtung zum Herstellen von mikroelektronischen Bauelementen und/oder Baugruppen Thermode unit for connecting and / or for the electrical contacting of electrical and / or electronic components, as well as apparatus for producing microelectronic components and / or subassemblies
11/13/2008DE112006003633T5 Klemmenlose und drahtlose Halbleiterchipbaugruppe und Verfahren zum Herstellen derselben Lots and the wireless terminal semiconductor chip module and method of manufacturing the same
11/13/2008DE112006003618T5 Leistungsvorrichtung unter Nutzung der chemisch-mechanischen Planarisierung Power device using the chemical mechanical planarization
11/13/2008DE112006003550T5 Mehrgateanordnung mit vertieften Beanspruchungsbereichen Multi-gate arrangement with recessed stress areas
11/13/2008DE112006002983T5 Nanostrukturbasierte Verbindungsbaugruppe Nanostructure-based joint assembly
11/13/2008DE112006002916T5 Gestapelte Anordnung integrierter Schaltungsbausteine Stacked array integrated circuit chips
11/13/2008DE10330192B4 Verfahren zum Abscheiden einer porösen Haftvermittlungsschicht auf einer Oberfläche eines elektrisch leitenden Körpers sowie Verwendung des Verfahrens A method for depositing a porous adhesion-promoting layer on a surface of an electrically conductive body, and use of the method
11/13/2008DE10319496B4 Verfahren zum Bereitstellen von kontextspezifischen Rezepten in einer Halbleiterherstellungsstätte durch Definieren von Produktkategorien A method for providing context-specific recipes in a semiconductor manufacturing facility by defining product categories
11/13/2008DE10257681B4 Verfahren zum Herstellen einer integrierten Schaltungsanordnung, die eine Metallnitridschicht enthält, und integrierte Schaltungsanordnung A method of fabricating an integrated circuit arrangement that contains a metal nitride layer, and integrated circuit arrangement
11/13/2008DE102008022201A1 Vorrichtung und Verfahren zum Messen einer lokalen Oberflächentemperatur eines Halbleiterbauelements Apparatus and method for measuring a local surface temperature of a semiconductor device
11/13/2008DE102008021242A1 Vorrichtung und Verfahren zur Steuerung einer Bewegungseinrichtung Apparatus and method for controlling a movement device
11/13/2008DE102008020145A1 Ion source e.g. duoplasmatron, for manufacturing e.g. microprocessor, has gas volume-control valve provided in position to determine gas pressure conditions in vacuum chamber, and gas supply mechanism for guiding gases into chamber
11/13/2008DE102007052202B3 Semiconductor component i.e. Schottky diode, has metallization structure electrically connected with compensation zones by Schottky contact and with drift zones by ohmic contact, where structure is arranged opposite to another structure
11/13/2008DE102007045734B3 Method for structuring of isolating material and semiconducting material in semiconductor elements for production of integrated circuit, involves partial clearing of semiconducting material
11/13/2008DE102007022273A1 Handling device for transport of semiconductor construction unit in semiconductor manufacturing machine, particularly sorter or flip chip mounter, has oscillation unit that is formed for producing acoustic waves
11/13/2008DE102007021823A1 Messsystem mit verbesserter Auflösung für Strukturen auf einem Substrat für die Halbleiterherstellung und Verwendung von Blenden bei einem Messsystem Measuring system with improved resolution for structures on a substrate for semiconductor production and use of screens in a measuring system
11/13/2008DE102007021512A1 Device for collecting flat objects in perpendicularly standing positioning and for fixing and conveying objects in a defined distance to each other, has two belts arranged parallel to each other
11/13/2008DE102007020266B3 Halbleiterstruktur mit einem elektrisch leitfähigen Strukturelement und Verfahren zu ihrer Herstellung Semiconductor structure having an electrically conductive structural member and a process for their preparation
11/13/2008DE102007014115B3 Integrierte Schaltung und Verfahren zu deren Herstellung Integrated circuit and method for their preparation
11/13/2008DE102007007142B4 Nutzen, Halbleiterbauteil sowie Verfahren zu deren Herstellung Use semiconductor device, and methods for their preparation
11/13/2008DE102007006455B4 Wärmereservoir und Verfahren zur Bearbeitung eines mit einem Wärmereservoir thermisch gekoppelten Substrates sowie Verwendung eines Wärmetransportmediums Heat reservoir and method of processing a thermally coupled with a heat reservoir, and the substrate using a heat transport medium
11/13/2008DE102006028718B4 Verfahren zur Vereinzelung von Halbleiterwafern zu Halbleiterchips A process for the separation of semiconductor wafers to form semiconductor chips
11/13/2008DE102005038219B4 Integrierte Schaltungsanordnung mit Kondensator in einer Leitbahnlage und Verfahren zum Herstellen derselben Integrated circuit arrangement having a capacitor and interconnect layer in a method of manufacturing the same
11/13/2008DE10126508B4 Vorrichtung mit mittels Spritzgusstechnik verpackten elektronischen Bauteilen, Spritzgusswerkzeug und Verfahren zum Verpacken von elektronischen Bauteilen Packaged device with electronic components by injection molding, injection-molding tool and method of packaging of electronic components
11/13/2008DE10056387B4 Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens Cooling device and process for their preparation, and device for carrying out the method
11/13/2008DE10047345B4 Wärmebehandlungsverfahren eines Siliciumwafers und behandelter Siliciumwafer Heat treatment process of a silicon wafer and treated silicon wafer
11/13/2008DE10007390B4 Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern Two-disc polishing machine, in particular for the processing of semiconductor wafers
11/12/2008EP1990845A1 Ambipolar, light-emitting field-effect transistors
11/12/2008EP1990841A2 Superlattice strain relief layer for semiconductor devices
11/12/2008EP1990838A1 Field effect transistor
11/12/2008EP1990837A1 Schottky junction type semiconductor element and method for manufacturing same
11/12/2008EP1990836A1 Method manufacturing of semiconductor device, and semiconductor memory device
11/12/2008EP1990835A2 Semiconductor integrated circuit
11/12/2008EP1990833A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990832A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990831A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
11/12/2008EP1990829A2 Solid-state imaging device and method of manufacturing the same
11/12/2008EP1990828A1 Exposure apparatus, exposure method and method for manufacturing device
11/12/2008EP1990432A1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method
11/12/2008EP1990345A1 Organometallic germanium compounds suitable for use in vapor deposition processes
11/12/2008EP1990103A1 Process for wafer backside polymer removal and wafer front side photoresist removal
11/12/2008EP1990092A1 Penetrable cap
11/12/2008EP1989818A2 Process for making contained layers and devices made with same
11/12/2008EP1989738A2 Noise isolation between circuit blocks in an integrated circuit chip
11/12/2008EP1989734A2 Contact formation
11/12/2008EP1989733A1 Metal interconnects in a dielectric material
11/12/2008EP1989732A1 Method for producing partial soi structures comprising zones connecting a superficial layer and a substrate
11/12/2008EP1989731A1 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus
11/12/2008EP1989730A2 Method for fabricating last level copper-to-c4 connection with interfacial cap structure
11/12/2008EP1989729A2 Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors
11/12/2008EP1989728A1 Process for forming a short channel trench mosfet and device
11/12/2008EP1989727A2 SEALED ELASTOMER BONDED Si ELECTRODES AND THE LIKE FOR REDUCED PARTICLE CONTAMINATION IN DIELECTRIC ETCH
11/12/2008EP1989725A2 White light emitting devices
11/12/2008EP1989343A2 Etching solution and method for structuring a ubm layer system
11/12/2008EP1989034A1 Method and arrangement for forming electronic device
11/12/2008EP1911088A4 Metal gate mosfet by full semiconductor metal alloy conversion
11/12/2008EP1759405A4 Method of forming a nanocluster charge storage device
11/12/2008EP1699951B1 Method of producing self-supporting substrates comprising iii-nitrides by means of heteroepitaxy on a sacrificial layer
11/12/2008EP1676306A4 Synergetic sp-sp2-sp3 carbon materials and deposition methods thereof
11/12/2008EP1535309B1 Radiation detector
11/12/2008EP1429341B1 Magnetic memory device and its recording control method
11/12/2008EP1366522B1 Method of producing interconnects on an integrated circuit
11/12/2008EP1293741B1 Heat treatment apparatus
11/12/2008EP1271647B1 Compound semiconductor device
11/12/2008EP1166354B1 Cooling system for pulsed power electronics
11/12/2008EP1057218B1 A method of manufacturing a semiconductor device
11/12/2008CN101305470A Semiconductor device and method for manufacturing same
11/12/2008CN101305469A Vertical diode doped with antimony to avoid or limit dopant diffusion
11/12/2008CN101305465A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/12/2008CN101305458A Selective removal of a silicon oxide layer
11/12/2008CN101305457A Electronic device including a transistor structure having an active region adjacent to a stressor layer and a process for forming the electronic device
11/12/2008CN101305456A Method of manufacturing a plurality of semiconductor devices and carrier substrate
11/12/2008CN101305455A Package using array capacitor core
11/12/2008CN101305454A Photovoltaic contact and wiring formation
11/12/2008CN101305453A Fine pitch interconnect and method of making
11/12/2008CN101305452A Programmable structure including nanocrystal storage elements in a trench
11/12/2008CN101305451A Shower plate and plasma treatment apparatus using shower plate
11/12/2008CN101305450A Polishing agent for silicon oxide, liquid additive, and method of polishing
11/12/2008CN101305449A Capacitor structure
11/12/2008CN101305448A Trench capacitor device suitable for decoupling applications in high-frequency operation
11/12/2008CN101305318A Substrate transport apparatus with automated alignment
11/12/2008CN101305259A Plane position detection device, exposure device and method for manufacturing elements
11/12/2008CN101304921A Process and equipment for charging material containing ethylene carbonate
11/12/2008CN101304847A Motion device having a double-sided suction bar
11/12/2008CN101304815A Process for producing semi-conductor coated substrate
11/12/2008CN101304630A Internal balanced coil for inductively coupled high density plasma processing chamber
11/12/2008CN101304076A Method for processing cathode insulated column of organic luminous display device
11/12/2008CN101304072A Organic optical detector and manufacturing method thereof as well as method for producing organic film transistor
11/12/2008CN101304064A LED heating heat sink rear using laser and heat sink bonding method
11/12/2008CN101304062A Method for making soldering-free type LED and structure thereof
11/12/2008CN101304061A Method for making soldering-free type LED and structure thereof
11/12/2008CN101304046A Thin film transistor and method for forming the same
11/12/2008CN101304045A Silicon nitride film and semiconductor device, and manufacturing method thereof
11/12/2008CN101304044A Semiconductor device and method of forming the same
11/12/2008CN101304042A Semiconductor device and method for fabricating the same
11/12/2008CN101304041A Metal oxynitride gate
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