Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/19/2008CN101308797A Lateral dmos device structure and manufacturing method thereof
11/19/2008CN101308796A Field effect transistor and manufacturing method thereof
11/19/2008CN101308795A Low-temp annealing method for MOCVD to grow doping semi-conducting material
11/19/2008CN101308794A Atomic layer deposition of tungsten material
11/19/2008CN101308793A Integrated circuit construction and forming method thereof
11/19/2008CN101308792A Apparatus and method for improving silica layer growth on wafer
11/19/2008CN101308791A Manufacturing method for semiconductor device rear part through hole
11/19/2008CN101308790A Method for removing dielectric layer on substrate and chemical mechanical polishing process
11/19/2008CN101308789A Air flow guiding device for vacuum process
11/19/2008CN101308788A Semiconductor apparatus and manufacturing method thereof
11/19/2008CN101308787A Etching method of polycrystalline silicon
11/19/2008CN101308786A Ion injection method of semiconductor device
11/19/2008CN101308785A Method of manufacturing cmos devices by the implantation of n- and p-type cluster ions
11/19/2008CN101308784A Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor
11/19/2008CN101308783A Semiconductor substrate, semiconductor device and manufacturing method thereof
11/19/2008CN101308782A Manufacturing method of soi substrate and manufacturing method of semiconductor device
11/19/2008CN101308781A Semiconductor apparatus, thin film transistor substrate, display apparatus and method for making same
11/19/2008CN101308780A Method for preparing semiconductor substrate
11/19/2008CN101308779A Stepped upper electrode for plasma processing uniformity
11/19/2008CN101308778A Thinning method of semiconductor chip
11/19/2008CN101308777A Nanostructure and manufacturing method of nanostructure
11/19/2008CN101308776A Normal pressure plasma cleaning device
11/19/2008CN101308775A Method and system for introducing process fluid through a chamber component
11/19/2008CN101308774A System for manufacturing flat display
11/19/2008CN101308773A System for manufacturing flat display
11/19/2008CN101308772A Method for manufacturing semiconductor device
11/19/2008CN101308771A Gas flow diffuser
11/19/2008CN101308770A In-situ dose monitoring using optical emission spectroscopy
11/19/2008CN101308769A Particle collection method and particle collecting unit, and apparatus equipped with the particle collecting unit
11/19/2008CN101308768A Method of forming pattern of semiconductor device
11/19/2008CN101308767A Method for in-situ repairing plasma damage and method for fabricating transistor device
11/19/2008CN101308766A Device and method for wet treating disc-like substrates
11/19/2008CN101308765A Etching method of metal wire
11/19/2008CN101308764A Method for eliminating residual polymer of etching procedure
11/19/2008CN101308763A Matching method implementing ion injection dose and energy on wafer
11/19/2008CN101308333A Imaging device in a projection exposure machine
11/19/2008CN101308331A Two time graph exposure method utilizing developing filler material
11/19/2008CN101308330A Two time graph exposure method utilizing developing filler material
11/19/2008CN101308326A Sensitized material, light resistance material and semiconductor assembly manufacture method
11/19/2008CN101308325A Manufacturing method of mask blank and manufacturing method of photomask
11/19/2008CN101308307A Liquid crystal display panel and thin film transistor substrate manufacture method
11/19/2008CN101308303A Display substrate, method of manufacturing the same and display device having the same
11/19/2008CN101308299A Liquid crystal display device and fabricating method thereof
11/19/2008CN101308294A In-plane switching mode liquid crystal display device and method for fabricating the same
11/19/2008CN101308161A Electronic device having molded resin case, and molding tool and method of manufacturing the same
11/19/2008CN101308110A Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method
11/19/2008CN101308109A P -type delafossite base oxide ozone gas sensory semiconductor material and method for making same
11/19/2008CN101308100A Visual inspection apparatus
11/19/2008CN101307498A Iii-v nitride substrate wafer and its manufacture method and uses
11/19/2008CN101307488A Polycrystalline silicon thin film preparation method
11/19/2008CN101307482A Electrolytic ni plating apparatus and method of manufacturing semiconductor device
11/19/2008CN101307460A Cleaning method and method for manufacturing electronic device
11/19/2008CN101307443A Chemical treatment method and chemical treatment apparatus
11/19/2008CN101307435A Liquid supplying unit and method, facility for treating substrates with the unit, and method for treating substrates
11/19/2008CN101306518A Polishing pad, use thereof and method for making the same
11/19/2008CN101306512A Substrate polishing apparatus
11/19/2008CN100435436C Method for making semiconductor substrate
11/19/2008CN100435432C Solder dispenser
11/19/2008CN100435365C Light-emitting diode, backlight device and method of manufacturing the light-emitting diode
11/19/2008CN100435358C Adjustment of masks by re-flow
11/19/2008CN100435355C Gate electrode and manufacturing method thereof
11/19/2008CN100435354C Semiconductor device
11/19/2008CN100435353C MOS transistor and its producing method
11/19/2008CN100435351C Method for modulating carrying-performance nano-grade field effect transistor using dipale effect
11/19/2008CN100435350C High-dielectric coefficient grid dielectric material titanium aluminate film and preparing method thereof
11/19/2008CN100435347C Fabrication of semiconductor devices
11/19/2008CN100435344C Solid-state imaging device and manufacturing method thereof
11/19/2008CN100435340C Semiconductor memory device
11/19/2008CN100435339C ROM memory, its array, apparatus and method for programming and erasing
11/19/2008CN100435338C Word and bit line arrangement for a fin FET semiconductor memory
11/19/2008CN100435335C Method for manufacturing semiconductor device and semiconductor device
11/19/2008CN100435334C Semiconductor device and its mfg. method
11/19/2008CN100435332C Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
11/19/2008CN100435331C Method for producing microsystems
11/19/2008CN100435330C Integrated circuit with plane type connection
11/19/2008CN100435329C Micro lead frame package and method to manufacture the micro lead frame package
11/19/2008CN100435327C Semiconductor device having a bond pad and manufacturing method therefor
11/19/2008CN100435325C Semiconductor device and method of producing the semiconductor device
11/19/2008CN100435323C Heat radiator for wafer encapsulation and its making method
11/19/2008CN100435320C Method for separately optimizing thin gate dielectric of pmos and nmos transistors within the same semiconductor chip and device manufactured thereby
11/19/2008CN100435319C Method in the fabrication of an integrated injection logic circuit
11/19/2008CN100435318C Method for manufacturing of CMOS image sensor
11/19/2008CN100435317C Manufacturing method of semiconductor integrated circuit device and probe card
11/19/2008CN100435316C Method for forming connecting hole with high depth and width ratio
11/19/2008CN100435315C Trench isolation structure for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same
11/19/2008CN100435314C Adjustable tool holder
11/19/2008CN100435313C Centering and orientation apparatus
11/19/2008CN100435312C Substrate treatment apparatus, substrate holding device, and semiconductor device manufacturing method
11/19/2008CN100435311C Apparatus and method for removing semiconductor chip
11/19/2008CN100435310C Automatic material transport system for semiconductor production
11/19/2008CN100435309C High-temperature bake quartz boat
11/19/2008CN100435308C Improved semiconductor wafer structure and its producing method
11/19/2008CN100435307C Process controls for improved wafer uniformity using integrated or standalone metrology
11/19/2008CN100435306C Method of spot welding for minitype sensor
11/19/2008CN100435305C Method for manufacturing protection assembly for preventing electronic component from static discharge and electronic component of corresponding conformation
11/19/2008CN100435304C Preparation method of electronic power integrated module based on metal ball crimping interconnection technique
11/19/2008CN100435303C Method for aligning the bondhead of a die bonder
11/19/2008CN100435302C Method of fabricating a built-in chip type substrate
11/19/2008CN100435301C Fabrication method of semiconductor integrated circuit device
11/19/2008CN100435300C Chip packing and IC module assembling mode
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