Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/27/2008US20080293188 Reactive solder material
11/27/2008US20080293187 Substrate table and chip manufacturing method
11/27/2008US20080293186 Method of assembling a silicon stack semiconductor package
11/27/2008US20080293185 Semiconductor substrates having useful and transfer layers
11/27/2008US20080293184 Method of Bonding Aluminum Electrodes of Two Semiconductor Substrates
11/27/2008US20080293179 Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
11/27/2008US20080293178 Process For Manufacturing Micromechanical Devices Containing a Getter Material and Devices So Manufactured
11/27/2008US20080293175 Method for mounting anisotropically-shaped members
11/27/2008US20080293174 Method for forming LED array
11/27/2008US20080293171 LIGHT EMITTING DIODES (LEDs) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING
11/27/2008US20080293170 Method for evaluating a gate insulation film characteristic for use in a semiconductor device
11/27/2008US20080293169 Lithography evaluating method, semiconductor device manufacturing method and program medium
11/27/2008US20080293168 Method and system of tape automated bonding
11/27/2008US20080293167 Fabrication method of semiconductor integrated circuit device
11/27/2008US20080293166 Laser processing of light reflective multilayer target structure
11/27/2008US20080293165 Method for manufacturing non-volatile magnetic memory
11/27/2008US20080292992 Writing pattern; data processing; etching masking film; removal segments of photoresists; generating method comprising correcting a first pattern data in accordance with a difference between first film pattern and second mask pattern and difference between first resist pattern and first mask pattern
11/27/2008US20080292991 High fidelity multiple resist patterning
11/27/2008US20080292976 Pattern forming method, pattern formed thereby, mold, processing apparatus, and processing method
11/27/2008US20080292920 Methods of operating fuel cells
11/27/2008US20080292877 Method of Cleaning Gaas Substrate, Method of Producing Gaas Substrate, Method of Fabricating Epitaxial Susbstrate, and Gaas Wafer
11/27/2008US20080292825 Low temperature melt-processing of organic-inorganic hybrid
11/27/2008US20080292535 small refractive index differences and few small angle grain boundaries have a bi-directional scattering distribution function value (BSDF) of less than 1.5*10-6 or 5*10-7.
11/27/2008US20080292446 Handling Device
11/27/2008US20080292445 Wafer carrier and buffer support member thereof
11/27/2008US20080292432 Airflow management for particle abatement in semiconductor manufacturing equipment
11/27/2008US20080292431 Transfer chamber for flat display device manufacturing apparatus
11/27/2008US20080291970 On chip temperature measuring and monitoring circuit and method
11/27/2008US20080291961 Nitride semiconductor light emitting device and method of fabricating nitride semiconductor laser device
11/27/2008US20080291959 Semiconductor device and method for manufacturing the same
11/27/2008US20080291938 Connecting Device for Randomly Connecting a Number of Transmitters and Receivers, Communication Device and Method for Producing Connecting Device
11/27/2008US20080291767 Multiple wafer level multiple port register file cell
11/27/2008US20080291720 Spin torque transfer mram device
11/27/2008US20080291718 Variable resistance memory device with an interfacial adhesion heating layer, systems using the same and methods of forming the same
11/27/2008US20080291655 Wiring substrate, semiconductor device package including the wiring substrate and methods of fabricating the same
11/27/2008US20080291636 Semiconductor device
11/27/2008US20080291437 method of inspecting a semiconductor device and an apparatus thereof
11/27/2008US20080291409 Immersion exposure technique
11/27/2008US20080291350 Electron device using oxide semiconductor and method of manufacturing the same
11/27/2008US20080291107 Antenna structure for integrated circuit die using bond wire
11/27/2008US20080291020 Collectable Cop/Spot Chip
11/27/2008US20080290992 Semiconductor device with integrated coils
11/27/2008US20080290946 Semiconductor integrated circuit device
11/27/2008US20080290865 Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof
11/27/2008US20080290797 Photosensitive semiconductor nanocrystals, photosensitive composition comprising semiconductor nanocrystals and method for forming semiconductor nanocrystal pattern using the same
11/27/2008US20080290737 Semiconductor circuit device and data processing system
11/27/2008US20080290557 Mold with compensating base
11/27/2008US20080290530 Semiconductor device having photo aligning key and method for manufacturing the same
11/27/2008US20080290529 Semiconductor device and process for fabrication thereof
11/27/2008US20080290525 Silicon-on-insulator structures for through via in silicon carriers
11/27/2008US20080290524 Through via in ultra high resistivity wafer and related methods
11/27/2008US20080290523 Semiconductor device including barrier metal and coating film and method for manufacturing same
11/27/2008US20080290522 Carbon containing silicon oxide film having high ashing tolerance and adhesion
11/27/2008US20080290521 Film-forming composition, insulating film with low dielectric constant, formation method thereof, and semiconductor device
11/27/2008US20080290516 Semiconductor device with bonding pad support structure
11/27/2008US20080290515 Properties of metallic copper diffusion barriers through silicon surface treatments
11/27/2008US20080290514 Semiconductor device package and method of fabricating the same
11/27/2008US20080290512 Semiconductor device and fabrication method thereof
11/27/2008US20080290511 Chip Assembly and Method of Manufacturing Thereof
11/27/2008US20080290509 Chip Scale Package and Method of Assembling the Same
11/27/2008US20080290507 Chip embedded printed circuit board and fabricating method thereof
11/27/2008US20080290505 Mold design and semiconductor package
11/27/2008US20080290504 Compliant thermal contactor
11/27/2008US20080290503 Compliant thermal contactor
11/27/2008US20080290502 Integrated circuit package with soldered lid for improved thermal performance
11/27/2008US20080290496 Wafer level system in package and fabrication method thereof
11/27/2008US20080290494 Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same
11/27/2008US20080290490 Semiconductor device and method for manufacturing the same
11/27/2008US20080290488 semiconductor device and a method of manufacturing the same
11/27/2008US20080290487 Lead frame for semiconductor device
11/27/2008US20080290485 Integrated circuit package system with relief
11/27/2008US20080290484 Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component
11/27/2008US20080290482 Method of packaging integrated circuits
11/27/2008US20080290479 Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
11/27/2008US20080290478 Lead-frame array package structure and method
11/27/2008US20080290476 Method for making semiconductor chips having coated portions
11/27/2008US20080290475 Semiconductor integrated circuit
11/27/2008US20080290474 Multi-Layer Circuit Substrate and Method Having Improved Transmission Line Integrity and Increased Routing Density
11/27/2008US20080290473 Method of manufacturing semiconductor device
11/27/2008US20080290472 Semiconductor interlayer-insulating film forming composition, preparation method thereof, film forming method, and semiconductor device
11/27/2008US20080290471 Method For Making a Thin-Film Structure and Resulting Thin-Film Structure
11/27/2008US20080290469 Edge Seal For a Semiconductor Device and Method Therefor
11/27/2008US20080290468 Structure of flexible electronics and optoelectronics
11/27/2008US20080290466 Semiconductor Element
11/27/2008US20080290464 Npn device and method of manufacturing the same
11/27/2008US20080290463 Lateral bipolar transistor and method of production
11/27/2008US20080290462 Protective structure
11/27/2008US20080290461 Deep trench isolation for power semiconductors
11/27/2008US20080290460 Chip Resistor, and Its Manufacturing Method
11/27/2008US20080290459 MIM Capacitors
11/27/2008US20080290457 Bonding pad structure disposed in semiconductor device and related method
11/27/2008US20080290456 Electrical Fuse With Metal Silicide Pipe Under Gate Electrode
11/27/2008US20080290455 Semiconductor device and method of blowing fuse thereof
11/27/2008US20080290454 Semiconductor integrated circuit device and method for manufacturing the same
11/27/2008US20080290453 Semiconductor device and method of fabrication thereof
11/27/2008US20080290452 Trench-constrained isolation diffusion for integrated circuit die
11/27/2008US20080290448 Semiconductor devices and methods of manufacture thereof
11/27/2008US20080290447 Semiconductor device and methods of manufacturing the same
11/27/2008US20080290446 Shallow trench isolation structures for semiconductor devices including wet etch barriers and methods of fabricating same
11/27/2008US20080290445 Method for manufacturing a semiconductor body with a trench and semiconductor body with a trench
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