Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/13/2008US20080282217 Method for creating mask layout data, apparatus for creating mask layout data, and method for manufacturing semiconductor device
11/13/2008US20080282216 Method for designing structured ASICs in silicon processes with three unique masking steps
11/13/2008US20080282210 System And Method For Product Yield Prediction
11/13/2008US20080281541 System and method for estimating reliability of components for testing and quality optimization
11/13/2008US20080280803 Aqueous solution of sulfuric acid, hydrogen peroxide, H2SiF6, HBF4; clean residual polymers from aluminium or aluminium-containing surfaces, during the production of semiconductor elements
11/13/2008US20080280458 Irradiating apparatus, semiconductor device manufacturing apparatus, semiconductor device manufacturing method, and display device manufacturing method
11/13/2008US20080280457 Method of improving initiation layer for low-k dielectric film by digital liquid flow meter
11/13/2008US20080280456 Thermal methods for cleaning post-CMP wafers
11/13/2008US20080280455 Atomic layer deposition systems and methods including metal beta-diketiminate compounds
11/13/2008US20080280454 Wafer recycling method using laser films stripping
11/13/2008US20080280453 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
11/13/2008US20080280452 Method for stripping photoresist
11/13/2008US20080280451 Plasma processing method and plasma processing apparatus
11/13/2008US20080280450 Method of two-step backside etching
11/13/2008US20080280449 Self-aligned dielectric cap
11/13/2008US20080280448 Method for manufacturing gate oxide layer with different thicknesses
11/13/2008US20080280447 Spin on glass (sog) etch improvement method
11/13/2008US20080280446 Method of producing a microscopic hole in a layer and integrated device with a microscopic hole in a layer
11/13/2008US20080280445 Manufacturing method of nitride semiconductor device and nitride semiconductor device
11/13/2008US20080280444 Method of forming micro pattern of semiconductor device
11/13/2008US20080280443 Exposure Mask And Method Of Forming A Contact Hole Of A Semiconductor Device Employing The Same
11/13/2008US20080280442 Method for fabricating semiconductor device
11/13/2008US20080280441 Method of Forming Isolation Layer of Flash Memory Device
11/13/2008US20080280440 Method for forming a pn diode and method of manufacturing phase change memory device using the same
11/13/2008US20080280439 Optimal concentration of platinum in a nickel film to form and stabilize nickel monosilicide in a microelectronic device
11/13/2008US20080280438 Methods for depositing tungsten layers employing atomic layer deposition techniques
11/13/2008US20080280437 Substrate Processing Method and Substrate Processing Apparatus
11/13/2008US20080280436 Method for fabricating an inductor structure or a dual damascene structure
11/13/2008US20080280435 Producing a Covered Through Substrate Via Using a Temporary Cap Layer
11/13/2008US20080280434 Enhanced Mechanical Strength Via Contacts
11/13/2008US20080280433 Method for manufacturing semiconductor device
11/13/2008US20080280432 Barrier Material and Process for Cu Interconnect
11/13/2008US20080280431 Method of fabricating flash memory device
11/13/2008US20080280430 Method of forming films in a trench
11/13/2008US20080280429 Method to control uniformity/composition of metal electrodes, silicides on topography and devices using this method
11/13/2008US20080280428 Method of manufacturing semiconductor device
11/13/2008US20080280427 Low etch pit density (EPD) semi-insulating GaAs wafers
11/13/2008US20080280426 Gallium nitride-on-silicon interface
11/13/2008US20080280425 Beam Homogenizer, and Laser Irradiation Method, Laser Irradiation Apparatus, and Laser Annealing Method of Non-Single Crystalline Semiconductor Film Using the Same
11/13/2008US20080280424 Manufacturing method of SOI substrate and manufacturing method of semiconductor device
11/13/2008US20080280423 Chilled wafer dicing
11/13/2008US20080280422 Ultra Thin Bumped Wafer with Under-Film
11/13/2008US20080280421 Wafer dividing method
11/13/2008US20080280420 Method for manufacturing substrate of semiconductor device
11/13/2008US20080280419 Method for nanostructuring of the surface of a substrate
11/13/2008US20080280418 Method for manufacturing the shallow trench isolation structure
11/13/2008US20080280417 Method for manufacturing semiconductor device
11/13/2008US20080280416 Techniques for Layer Transfer Processing
11/13/2008US20080280415 Method of manufacturing semiconductor memory device
11/13/2008US20080280414 Systems and Methods for Fabricating Vertical Bipolar Devices
11/13/2008US20080280413 Methods for forming a transistor
11/13/2008US20080280412 Method of manufacturing silicon carbide semiconductor device
11/13/2008US20080280411 Method for manufacturing phase change memory device using a patterning process
11/13/2008US20080280410 Self aligned narrow storage elements for advanced memory device
11/13/2008US20080280409 Memory Arrays, Semiconductor Constructions And Electronic Systems; And Methods Of Forming Memory Arrays, Semiconductor Constructions And Electronic Systems
11/13/2008US20080280408 Semiconductor device with improved overlay margin and method of manufacturing the same
11/13/2008US20080280407 Cmos device with dual polycide gates and method of manufacturing the same
11/13/2008US20080280406 Semiconductor device and its manufacturing method
11/13/2008US20080280405 Semiconductor device
11/13/2008US20080280404 Residue free patterned layer formation method applicable to cmos structures
11/13/2008US20080280403 Transistor fabrication method
11/13/2008US20080280402 Manufacturing method of semiconductor device and electronic device
11/13/2008US20080280401 Increasing effective transistor witdth in memory arrays with dual bitlines
11/13/2008US20080280400 Method for manufacturing semiconductor device
11/13/2008US20080280399 Methods for Forming Co-Planar Wafer-Scale Chip Packages
11/13/2008US20080280398 System And Method For Direct Bonding Of Substrates
11/13/2008US20080280397 Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same
11/13/2008US20080280396 Stacked die package for peripheral and center device pad layout device
11/13/2008US20080280395 Semiconducting device with stacked dice
11/13/2008US20080280394 Systems and methods for post-circuitization assembly
11/13/2008US20080280393 Methods for forming package structures
11/13/2008US20080280392 Convex die attachment method
11/13/2008US20080280391 Methods of manufacturing mos transistors with strained channel regions
11/13/2008US20080280389 Camera module and method for assembling same
11/13/2008US20080280387 Layout design and fabrication of SDA micro motor for low driving voltage and high lifetime application
11/13/2008US20080280385 Thin-film transistor, TFT-array substrate, liquid-crystal display device and method of fabricating the same
11/13/2008US20080280384 Solid-state light emitting display and fabrication method thereof
11/13/2008US20080280383 Method of real-time monitoring implantation
11/13/2008US20080280381 Method of forming a fine pattern of a semiconductor device using a resist reflow measurement key
11/13/2008US20080280380 Fluid Storage and Dispensing System Including Dynamic Fluid Monitoring of Fluid Storage and Dispensing Vessel
11/13/2008US20080280379 Method of manufacturing thin film transistor substrate and manufacturing system using the same
11/13/2008US20080280216 Method of forming a hard mask pattern in a semiconductor device
11/13/2008US20080280110 Method of activating a silicon surface for subsequent patterning of molecules onto said surface
11/13/2008US20080280105 Etch Method
11/13/2008US20080280048 Heat treatment in vacuum container; controlling temperature distribution; high heat in center; low heat on edges
11/13/2008US20080280039 Sequential chemical vapor deposition
11/13/2008US20080279656 Transfer apparatus
11/13/2008US20080279445 Pattern defect inspection method and apparatus
11/13/2008US20080279241 Light-emitting element and method for manufacturing the same
11/13/2008US20080279011 Data processing apparatus
11/13/2008US20080278996 Programmable magnetic read only memory (mrom)
11/13/2008US20080278995 Magnetic memory and memory cell thereof and method of manufacturing the memory cell
11/13/2008US20080278990 Resistive-switching nonvolatile memory elements
11/13/2008US20080278989 Resistive memory device and method of manufacturing the same
11/13/2008US20080278886 Increasing the capacitance of a capacitive device by micromasking
11/13/2008US20080278813 Ultraviolet Polarization Beam Splitter with Minimum Apodization
11/13/2008US20080278696 Lithographic apparatus
11/13/2008US20080278649 Liquid crystal display device and manufacturing method therefor
11/13/2008US20080278495 Graph plotting device and graph plotting method, yield analyzing method and yield improvement support system for executing the graph plotting method, program, and computer-readable recording medium
11/13/2008US20080278029 Electroless plating production of nickel and colbalt structures