Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/18/2008US7451941 Dense fluid spray cleaning process and apparatus
11/18/2008US7451936 Module for contactless chip cards or identification systems
11/18/2008US7451805 Pouring apparatus for molten metal and casting method
11/18/2008US7451774 Method and apparatus for wafer cleaning
11/18/2008US7451539 Method of making a conformal electromagnetic interference shield
11/18/2008US7451515 Cleaning processing system and cleaning processing apparatus
11/18/2008CA2441912C High power mosfet semiconductor device
11/18/2008CA2355614C Combination cmp-etch method for forming a thin planar layer over the surface of a device
11/16/2008CA2631046A1 Semiconductor layer for thin film transistor
11/13/2008WO2008137951A2 Plating apparatus and method
11/13/2008WO2008137919A1 Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer
11/13/2008WO2008137811A2 Print processing for patterned conductor, semiconductor and dielectric materials
11/13/2008WO2008137738A2 Method of forming group iv semiconductor junctions using laser processing
11/13/2008WO2008137731A1 Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
11/13/2008WO2008137724A1 Strained channel p-type jfet and fabrication method thereof
11/13/2008WO2008137670A1 Hardmask open and etch profile control with hardmask open
11/13/2008WO2008137627A1 Semiconductor device having a fin structure and fabrication method thereof
11/13/2008WO2008137511A1 Accessing or interconnecting integrated circuits
11/13/2008WO2008137483A1 Double gate jfet and fabrication method therefor
11/13/2008WO2008137480A2 Active area junction isolation structure and junction isolated transistors including igfet, jfet and mos transistors and method for making
11/13/2008WO2008137478A2 Small geometry mos transistor with thin polycrystalline surface contacts and method for making
11/13/2008WO2008137459A2 Agitation of electrolytic solution in electrodeposition
11/13/2008WO2008137441A2 Junction field effect dynamic random access memory cell and applications therefor
11/13/2008WO2008137429A1 Method for forming thermoelectric device from particulate raw materials
11/13/2008WO2008137401A1 Constructions and devices including tantalum oxide layers on niobium nitride and methods for producing the same
11/13/2008WO2008137399A1 Periodic plasma annealing in an ald-type process
11/13/2008WO2008137356A2 Batch process for coating nanoscale features and devices manufactured from same
11/13/2008WO2008137317A1 Semiconductor device having strain-inducing substrate and fabrication methods thereof
11/13/2008WO2008137310A1 Method for applying a stress layer to a semiconductor device and device formed therefrom
11/13/2008WO2008137309A1 Inverted junction field effect transistor and method of forming thereof
11/13/2008WO2008137304A1 Jfet device with improved off-state leakage current and method of fabrication
11/13/2008WO2008137294A1 Jfet device with virtual source and drain link regions and method of fabrication
11/13/2008WO2008137293A1 A jfet having a step channel doping profile and method of fabrication
11/13/2008WO2008137292A1 Transistor providing different threshold voltages and method of fabrication thereof
11/13/2008WO2008137264A1 Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
11/13/2008WO2008137261A1 Mosfet device including a source with alternating p-type and n-type regions
11/13/2008WO2008137245A1 Semiconductor device with multiple tensile stressor layers and method
11/13/2008WO2008137070A1 Tungsten digitlines and methods of forming and operating the same
11/13/2008WO2008137053A1 Cmp compositions containing a soluble peroxometalate complex and methods of use thereof
11/13/2008WO2008137033A1 Stacked polishing pad for high temperature applications
11/13/2008WO2008136895A1 Substrate cleaning techniques employing multi-phase solution
11/13/2008WO2008136874A1 Superjunction devices having narrow surface layout of terminal structures and methods of manufacturing the devices
11/13/2008WO2008136778A1 Apparatus for object processing
11/13/2008WO2008136586A1 Gas supplying apparatus and equipment for etching substrate edge having the same
11/13/2008WO2008136524A1 Solder bump forming method and solder bump forming apparatus
11/13/2008WO2008136505A1 Semiconductor device, thin film transistor and methods for manufacturing the semiconductor device and the thin film transistor
11/13/2008WO2008136504A1 Method for manufacturing group iii nitride semiconductor light-emitting device
11/13/2008WO2008136503A1 Processing device, processing method, method of recognizing processing target body, and storage medium
11/13/2008WO2008136502A1 Valve open/close operation check method, gas treatment device, and storage medium
11/13/2008WO2008136500A1 Silicon wafer and method for manufacturing the same
11/13/2008WO2008136499A1 Water-soluble resin composition for the formation of micropatterns and process for the formation of micropatterns with the same
11/13/2008WO2008136432A1 Surface inspecting apparatus
11/13/2008WO2008136423A1 Semiconductor wafer processing apparatus, reference angular position detecting method and semiconductor wafer
11/13/2008WO2008136419A1 Semiconductor device, semiconductor device manufacturing method and semiconductor device repairing method
11/13/2008WO2008136404A1 Optical member, interferometer system, stage apparatus, exposure apparatus and device manufacturing method
11/13/2008WO2008136372A1 Photoresist base material and photoresist composition containing the same
11/13/2008WO2008136352A1 Method for bonding semiconductor wafers and method for manufacturing semiconductor device
11/13/2008WO2008136311A1 Nonvolatile storage device, method for operating the nonvolatile storage device and method for manufacturing the nonvolatile storage device
11/13/2008WO2008136292A1 Robot arm
11/13/2008WO2008136284A1 Method for manufacturing multilayer film
11/13/2008WO2008136260A1 Ti-film formation method
11/13/2008WO2008136259A1 Schottky electrode in diamond semiconductor element, and process for producing the same
11/13/2008WO2008136240A1 Method for manufacturing semiconductor device
11/13/2008WO2008136228A1 Stage for substrate temperature control unit
11/13/2008WO2008136225A1 Soi substrate and manufacturing method of the same, and semiconductor device
11/13/2008WO2008136181A1 Wafer supporting jig, vertical heat treatment boat including the same, and manufacturing method of wafer supporting jig
11/13/2008WO2008136174A1 Film forming apparatus
11/13/2008WO2008136158A1 Substrate unit for display device, display device and wiring substrate unit
11/13/2008WO2008136126A1 Method of annealing semiconductor device having silicon carbide substrate and semiconductor device
11/13/2008WO2008135948A1 Method of cleaning stannane distribution system
11/13/2008WO2008135812A1 Esd protection device and method of forming an esd protection device
11/13/2008WO2008135804A1 Improved process for preparing cleaned surfaces of strained silicon.
11/13/2008WO2008135554A1 Method for forming a planar stacked gate nonvolatile semiconductor memory device having a floating gate electrode and devices obtained thereof
11/13/2008WO2008135377A1 Transport pod interface
11/13/2008WO2008135345A1 Repair soldering head for a surface-mounted component and method for the operation thereof
11/13/2008WO2008135335A1 Cmos circuits with high-k gate dielectric
11/13/2008WO2008135220A1 Surface gripper unit
11/13/2008WO2008112097A3 Nitride semiconductor structures with interlayer structures and methods of fabricating nitride semiconductor structures with interlayer structures
11/13/2008WO2008106913A3 Automation carrier for substrates in particular for wafers for producing silicon-based solar cells
11/13/2008WO2008101931A3 Low-temperature formation of layers of polycrystalline semiconductor material
11/13/2008WO2008097604A3 Hbt and field effect transistor integration
11/13/2008WO2008076320A3 Processing apparatus, coated article and associated method
11/13/2008WO2008073485A3 Plastic electronic component package
11/13/2008WO2008052017A3 Flexible fingerprint sensor
11/13/2008WO2008027761A3 Method and apparatus for workpiece surface modification for selective material deposition
11/13/2008WO2008027214A3 Methods and apparatus for barrier interface preparation of copper interconnect
11/13/2008WO2008008817A3 Edge inspection and metrology
11/13/2008WO2007142940A3 Circuit configurations to reduce snapback of a transient voltage suppressor
11/13/2008WO2007130912A3 Multi-element led lamp package
11/13/2008WO2007124472A8 Patterning sub-lithographic features with variable widths
11/13/2008WO2007115105B1 Method for making an improved thin film solar cell interconnect using etch and deposition processes
11/13/2008WO2007109346A3 Mass pulse sensor and process-gas system and mehthod
11/13/2008WO2007019494A3 Si ribbon, sio2 ribbon and ultra pure ribbons of other substances
11/13/2008WO2007019023A3 Fin-type field effect transistor
11/13/2008WO2007008677A3 Load port module
11/13/2008WO2006115894A3 Using metal/metal nitride bilayers as gate electrodes in self-aligned aggressively scaled cmos devices
11/13/2008WO2006076087A3 METHOD OF FORMING HfSiN METAL FOR n-FET APPLICATIONS
11/13/2008WO2006047770A3 A buffer zone for the prevention of metal migration
11/13/2008WO2004095524A3 Semiconductor alignment aid
11/13/2008US20080282218 Method for Designing Mask
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