Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/20/2008US20080283831 ZnO-BASED THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
11/20/2008US20080283824 Method and structure for forming strained si for cmos devices
11/20/2008US20080283823 Gallium Nitride-Based Semiconductor Stacked Structure
11/20/2008US20080283821 Method of growing gan crystal on silicon substrate, and light emitting device and method of manufacturing thereof
11/20/2008US20080283816 Semiconductor memory device and method of manufacturing the same
11/20/2008US20080283815 Variable resistance memory device having reduced bottom contact area and method of forming the same
11/20/2008US20080283813 Semiconductor memory device and method of manufacturing the same
11/20/2008US20080283796 Compositions for Dissolution of Low-K Dielectric Films, and Methods of Use
11/20/2008US20080283728 Solid-state image pickup device and a method of manufacturing the same, and image pickup apparatus
11/20/2008US20080283502 Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
11/20/2008US20080283499 Corrosion-Resistant Member, Treatment Apparatus and Sample Treatment Method Using the Member, and Method for Manufacture of Corrosion-Resistant Member
11/20/2008US20080283498 Plasma Processing Device and Plasma Processing Method
11/20/2008US20080283387 programmable; for transferring conductive pieces such as solder balls to electrode pads of a target substrate; includes a transfer substrate; individually addressable electrodes formed on the transfer substrate which selectively attract and hold solder balls during transfer
11/20/2008US20080283120 Method of Manufacturing N-Type Multicrystalline Silicon Solar Cells
11/20/2008US20080283119 Method of Producing a Porous Semiconductor Film on a Substrate
11/20/2008US20080283089 Cleaning apparatus of semiconductor device
11/20/2008US20080283088 Plasma processing apparatus, plasma processing method and cleaning time prediction program
11/20/2008US20080283086 Substrate processing apparatus and cleaning method therefor
11/20/2008US20080282978 Process For Manufacturing A Gallium Rich Gallium Nitride Film
11/20/2008US20080282976 Film formation apparatus and method for using the same
11/20/2008US20080282967 Crystal Growth Method and Apparatus
11/20/2008US20080282574 Method and Device For Drying Circuit Substrates
11/20/2008DE19905220B4 Multichipanordnung Multichip assembly
11/20/2008DE19625661B4 Integrierte Halbleiterschaltung zum Einstellen eines Schaltungselementwerts A semiconductor integrated circuit for adjusting a circuit element value
11/20/2008DE112006003596T5 Folienschneidevorrichtung und Schneideverfahren Foil cutter and cutting method
11/20/2008DE112005003745T5 Aufschlämmzusammensetzung für das chemisch-mechanische Polieren zum Polieren von polykristallinem Siliciumfilm und Verfahren zur Herstellung derselben Aufschlämmzusammensetzung for chemical mechanical polishing for polishing polycrystalline silicon film and method for manufacturing the same
11/20/2008DE112005003671T5 Baugruppe mit einem Mikroprozessor und einem Viert-Level-Cache Assembly with a microprocessor and a fourth level cache
11/20/2008DE102008023711A1 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module
11/20/2008DE102008023519A1 Halbleiterbauteil mit isolierter Steuerelektrode und Verfahren zu seiner Herstellung A semiconductor device comprising insulated gate electrode and method for its preparation
11/20/2008DE102008023474A1 Halbleitervorrichtung mit Super-Junction-Struktur und Verfahren zu deren Fertigung Semiconductor device with super junction structure and process for their production
11/20/2008DE102008022745A1 Waferunterteilungsverfahren Wafer dividing method
11/20/2008DE102008022567A1 Verfahren zum Entwerfen einer Maske A method for designing a mask
11/20/2008DE102008022540A1 Verfahren zum Layout von Masken und Halbleiterbauelement und Verfahren zu dessen Herstellung A method of layout of masks and semiconductor device and process for its preparation
11/20/2008DE102008022539A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
11/20/2008DE102008022502A1 Verfahren zum Herstellen eines Halbleiterelements in einem Substrat A method of fabricating a semiconductor element in a substrate
11/20/2008DE102008022299A1 Verfahren zur Herstellung eines Bildsensors A method for manufacturing an image sensor
11/20/2008DE102008021834A1 Verfahren zur Herstellung einer Kristalleinheit A process for producing a crystal unit
11/20/2008DE102008021396A1 Speicherzelle Memory cell
11/20/2008DE102008010328A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
11/20/2008DE102007048397B3 Semiconductor chip delivering device for automatic assembly of component carrier, has provision plane receiving wafer and arranged above another provision plane, and transfer devices assigned to one of provision planes
11/20/2008DE102007041188A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
11/20/2008DE102007029121B3 Verfahren zur Herstellung eines Halbleiterbauelements, sowie Halbleiterbauelement A process for producing a semiconductor device, and semiconductor device
11/20/2008DE102007023387A1 Verfahren zur Reinigung von Oberflächen eines Werkstückes A method for cleaning surfaces of a workpiece
11/20/2008DE102007022959A1 Semiconductor device manufacturing method, involves coating semiconductor chip with casting compound e.g. thermoplastic material, forming through hole in casting compound, and depositing electric conductive materials in through hole
11/20/2008DE102007022621A1 Verfahren zur Herstellung einer dielektrischen Deckschicht für eine Kupfermetallisierung unter Anwendung einer thermisch-chemischen Behandlung auf Wasserstoffbasis A process for producing a dielectric covering layer for a copper metallization using a thermal-chemical treatment based on hydrogen
11/20/2008DE102007022533A1 Verfahren zum Herstellen eines Halbleiterelements und Halbleiterelement A method of manufacturing a semiconductor element and semiconductor element
11/20/2008DE102007022337A1 Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu Sintered power semiconductor substrate and manufacturing method therefor
11/20/2008DE102007022336A1 Leistungshalbleitersubstrat mit Metallkontaktschicht sowie Herstellungsverfahren hierzu Power semiconductor substrate with metal contact layer and manufacturing method therefor
11/20/2008DE102007021991A1 Method for manufacturing semiconductor component, involves preparing base substrate and designing porous intermediate layer on surface of base substrate
11/20/2008DE102006051607B4 Verfahren und Vorrichtung zum serienmäßigen Aufbringen und Befestigen von elektronischen Bauteilen auf Substraten Method and device for standard application and mounting electronic components on substrates
11/20/2008DE102005062532B4 Halbleiterbauelement und Kontaktstellenherstellungsverfahren A semiconductor device manufacturing method and contact points
11/20/2008DE102004052581B4 Verfahren zur Herstellung einer CMOS-Gatestruktur mit einem vordotierten Halbleitergatematerial A method of manufacturing a CMOS gate structure having a pre-doped semiconductor gate material
11/20/2008DE102004014752B4 Halbleiterbauelement mit kernlosem Wandler und Halbbrücke Semiconductor component with coreless transformer and half-bridge
11/20/2008DE10085212B4 Dielektrische Schicht, integrierte Schaltung und Verfahren zu deren Herstellung Dielectric layer, integrated circuit and methods for their preparation
11/19/2008EP1993150A2 Method for growing semiconductor layer, method for producing semiconductor light-emitting element, semiconductor light-emitting element, and electronic device
11/19/2008EP1993140A1 Nitride-based semiconductor substrate and semiconductor device
11/19/2008EP1993138A2 Device with a strained-channel transistor
11/19/2008EP1993136A1 Multi-gate MOSFET device and method of manufacturing same
11/19/2008EP1993130A2 Semiconductor device and method for manufacturing the same
11/19/2008EP1993129A1 Method for manufacturing air cavities using nanotubes
11/19/2008EP1993128A2 Method for manufacturing soi substrate
11/19/2008EP1993127A2 Manufacturing method of soi substrate and manufacturing method of semiconductor device
11/19/2008EP1993126A2 Manufacturing methods of semiconductor substrate, thin film transistor and semiconductor device
11/19/2008EP1993125A1 Lid unit for thin plate supporting container
11/19/2008EP1993124A1 Mounting method, board with electrical component, and electrical apparatus
11/19/2008EP1993123A2 Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
11/19/2008EP1993122A2 Semiconductor Layer for Thin Film Transistors
11/19/2008EP1993121A1 Exposure apparatus and device manufacturing method
11/19/2008EP1993120A1 Exposure method and apparatus, and device manufacturing method
11/19/2008EP1992991A2 System for laser beam expansion without expanding spatial coherence
11/19/2008EP1992990A1 Treated substratum with hydrophilic region and water-repellent region and process for producing the same
11/19/2008EP1992988A1 Photomask, method for manufacturing such photomask and pattern forming method using such photomask
11/19/2008EP1992949A1 Microchip and soi substrate for manufacturing microchip
11/19/2008EP1992942A1 Quantitative evaluation device and method of atom vacancy existing in silicon wafer
11/19/2008EP1992720A1 Etchant and method for fabricating electric device including thin film transistor using the same
11/19/2008EP1992650A1 Tertiary alcohol derivative, polymer compound and photoresist composition
11/19/2008EP1992489A2 Thermal inkjet printhead processing with silicon etching
11/19/2008EP1992460A2 Method for drilling holes on insulators, fabricating optical windows and adjusting angle of optical window circumferential surface and apparatus for drilling holes on insulators and image detection device module
11/19/2008EP1992020A1 Method for preparing a semiconductor
11/19/2008EP1992014A1 Coating method for enhanced electromigration resistance of copper
11/19/2008EP1992013A2 Method and apparatus for thermal processing structures formed on a substrate
11/19/2008EP1992012A1 Novel structure and method for metal integration
11/19/2008EP1992011A2 Aluminum leadframes for semiconductor qfn/son devices
11/19/2008EP1992010A2 High-throughput printing of chalcogen layer and the use of an inter-metallic material
11/19/2008EP1992009A1 High aspect ratio contacts
11/19/2008EP1992008A1 Device and method for liquid treating disc-like articles
11/19/2008EP1991632A1 Heat reservoir and method for processing a substrate coupled to a heat reservoir
11/19/2008EP1991499A1 Method for metal-free synthesis of epitaxial semiconductor nanowires on si
11/19/2008EP1886261A4 Semiconductor device
11/19/2008EP1725892A4 Method and system for correcting a fault in a semiconductor manufacturing system
11/19/2008EP1651560B1 Stacked structure and production method thereof
11/19/2008EP1570514A4 Integrated circuit and methods of measurement and preparation of measurement structure
11/19/2008EP1559801B1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
11/19/2008EP1546876A4 Method and system for dynamic modeling and recipe optimization of semiconductor etch processes
11/19/2008EP1546681B1 A method of manufacturing integrated circuit sensors
11/19/2008EP1425167B1 Method for producing a ceramic substrate and ceramic substrate
11/19/2008EP1393114B1 Correction of birefringence in cubic crystalline projection lenses and optical systems
11/19/2008EP1246730B2 Thermal transfer of microstructured layers
11/19/2008EP1158579B1 Wire bonding capillary for forming bump electrodes
11/19/2008EP1126752B1 Chip scale packaging on CTE matched printed wiring boards
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