Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/19/2008EP1110242B1 Thermal capacity for electronic component operating in long pulses
11/19/2008EP1042791B1 Improved techniques for etching with a photoresist mask
11/19/2008EP0996967B1 Method for producing layered structures on a semiconductor substrate, semiconductor substrate and semiconductor components produced according to said method
11/19/2008CN201153126Y Revolving gear of etching machine tablet bearing disk
11/19/2008CN201153119Y Light emitting auxiliary alignment positioning apparatus
11/19/2008CN201153118Y Sensing device of vacuum apparatus
11/19/2008CN201153117Y Improvement mechanism of semiconductor machine
11/19/2008CN201152945Y Temperature control apparatus with wide temperature region and high precision
11/19/2008CN201151081Y Guiding ring structure
11/19/2008CN201151023Y Wafer ultraviolet laser dicing saw
11/19/2008CN101310580A Electronic part mounting head, electronic part mounting apparatus, and electronic part mounting method
11/19/2008CN101310572A Soldering apparatus and soldering method
11/19/2008CN101310443A Semiconductor device
11/19/2008CN101310442A Semi-conductor device
11/19/2008CN101310388A MOSFET and method for manufacturing MOSFET
11/19/2008CN101310386A Hybrid substrate technology for high-mobility planar and multiple-gate mosfets
11/19/2008CN101310385A Substrate structure and method for wideband power decoupling
11/19/2008CN101310383A Enhancing shock resistance in semiconductor packages
11/19/2008CN101310379A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/19/2008CN101310378A Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
11/19/2008CN101310377A Transporting apparatus for disc-shaped workpieces
11/19/2008CN101310376A Transfer/alignment method in vacuum processing apparatus, vacuum processing apparatus and computer storage medium
11/19/2008CN101310375A Probe card and method of fabricating the same
11/19/2008CN101310374A Method for advanced solder bumping and system manufactured by said method
11/19/2008CN101310373A Method of mounting electronic circuit constituting member and relevant mounting apparatus
11/19/2008CN101310372A Minimizing interface resistance through thermoelectric device by surface modification of thermoelectric material
11/19/2008CN101310371A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/19/2008CN101310370A Method of forming porous film and computer-readable recording medium
11/19/2008CN101310369A Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
11/19/2008CN101310368A Dielectric media including surface-treated metal oxide particles
11/19/2008CN101310367A Plasma etching method
11/19/2008CN101310366A Plasma treatment device
11/19/2008CN101310365A Polishing fluid for polishing aluminum films and method for polishing aluminum films with the same
11/19/2008CN101310221A Photomask, method for manufacturing such photomask and pattern forming method using such photomask
11/19/2008CN101310041A Vacuum processing apparatus and method
11/19/2008CN101310038A Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film
11/19/2008CN101309993A Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
11/19/2008CN101309863A Semiconductor thin film, method for producing same, thin film transistor and active-matrix-driven display panel
11/19/2008CN101309842A Packaging body
11/19/2008CN101309782A Robotic device
11/19/2008CN101309351A CMOS aps with stacked avalanche multiplication layer and low voltage readout electronics
11/19/2008CN101308892A Manufacture method of light emitting diode encapsulation
11/19/2008CN101308891A Manufacture method of light emitting diode encapsulation having prefocus cup
11/19/2008CN101308886A Light-emitting component construction and manufacturing process
11/19/2008CN101308877A Transparent semiconductor film diode and preparing method thereof
11/19/2008CN101308875A Semiconductor device having super junction structure and method of manufacturing the same
11/19/2008CN101308874A High voltage semiconductor device and method of manufacturing the same
11/19/2008CN101308871A Insulated gate semiconductor device and manufacturing mnethod thereof
11/19/2008CN101308867A Memory device, method of manufacturing the same, and method of operating the same
11/19/2008CN101308866A Flat panel display with improved white balance and manufacture method
11/19/2008CN101308864A Electro-luminescence device and method of manufacturing electro-luminescence device
11/19/2008CN101308862A Image sensor and method for manufacturing the same
11/19/2008CN101308861A Image sensor and method for manufacturing the same
11/19/2008CN101308859A Image sensor and method for manufacturing the same
11/19/2008CN101308857A Image sensor and method for manufacturing the same
11/19/2008CN101308854A Thin film transistor array panel and method of manufacturing the same
11/19/2008CN101308852A Integrated circuit, method for manufacufacturing the circuit, storage module, computer system
11/19/2008CN101308851A Non-gate nonvolatile semiconductor memory and manufacturing method therefor
11/19/2008CN101308850A Storage having surface tape and forming method thereof
11/19/2008CN101308849A Semi-conductor apparatus and forming method thereof
11/19/2008CN101308847A Semiconductor device and manufacturing method thereof
11/19/2008CN101308845A Semiconductor device and method for manufacturing the same
11/19/2008CN101308844A Semiconductor structure and manufacture method thereof
11/19/2008CN101308843A Shallow groove isolation construction and manufacture process the construction
11/19/2008CN101308842A Stacked package, method of manufacturing the same, and memory card having the stacked package
11/19/2008CN101308840A Multi-wafer 3d cam cell and manufacture process
11/19/2008CN101308839A Compact multi-port cam cell implemented in 3d vertical integration
11/19/2008CN101308838A Flip LED integrated chip with high break-over voltage
11/19/2008CN101308835A Semiconductor device and method of manufacturing the same
11/19/2008CN101308833A Circuit substrate, molding semiconductor device, tray and inspection socket
11/19/2008CN101308832A Lead frame for leadless encapsulation, encapsulation construction and manufacture method thereof
11/19/2008CN101308830A Lead frame for semiconductor encapsulation
11/19/2008CN101308829A Semiconductor device and method for manufacturing BOAC/COA
11/19/2008CN101308824A Nonvolatile memory device and method of fabricating the same
11/19/2008CN101308823A Layout structure of nonvolatile semiconductor memory and preparation method thereof
11/19/2008CN101308822A Method of manufacturing cmos devices by the implantation of n- and p-type cluster ions
11/19/2008CN101308821A Method for manufacturing image sensor
11/19/2008CN101308820A Manufacturing method of semiconductor integrated circuit device and probe card
11/19/2008CN101308819A Manufacturing method of semiconductor integrated circuit device and probe card
11/19/2008CN101308818A Method for manufacturing image sensor
11/19/2008CN101308817A Method for manufacturing image sensor
11/19/2008CN101308816A Method for integrating resistor manufacturing process into high-voltage element
11/19/2008CN101308815A Image sensor construction and method for making the same
11/19/2008CN101308814A Metal oxide semiconductor element and manufacturing method therefor
11/19/2008CN101308813A Fabrication methods of component
11/19/2008CN101308812A Method of fabricating semiconductor device having self-aligned contact plug and related device
11/19/2008CN101308811A Method of manufacturing semiconductor device to decrease defect number of plating film
11/19/2008CN101308810A Semiconductor circuit construction and manufacturing process
11/19/2008CN101308809A Manufacture method of aluminum conductive wire
11/19/2008CN101308808A Method for making double-metal inlaid structure
11/19/2008CN101308807A Method of controlling groove depth in shallow groove isolation region
11/19/2008CN101308806A Lift pin module of fpd manufacturing machine
11/19/2008CN101308805A Non-contact silicon chip clamping device
11/19/2008CN101308804A Encapsulation construction of radio frequency module and manufacturing method thereof
11/19/2008CN101308803A 半导体器件 Semiconductor devices
11/19/2008CN101308802A Semiconductor device of sensing type and its manufacture
11/19/2008CN101308801A Cutting method of lamination substrate, semiconductor device and manufacturing method thereof and luminescent device
11/19/2008CN101308800A Method for manufacturing light reflecting metal wall
11/19/2008CN101308799A Wiring board connection method and wiring board
11/19/2008CN101308798A Method of manufacturing semiconductor device
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