Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/18/2008US7452820 Radiation-resistant zone plates and method of manufacturing thereof
11/18/2008US7452819 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
11/18/2008US7452818 Method for selectively etching portions of a layer of material based upon a density or size of semiconductor features located thereunder
11/18/2008US7452817 CMP method providing reduced thickness variations
11/18/2008US7452816 Semiconductor processing method and chemical mechanical polishing methods
11/18/2008US7452815 Methods of forming integrated circuit devices having polished tungsten metal layers therein
11/18/2008US7452814 Method of polishing GaN substrate
11/18/2008US7452813 Method of manufacturing semiconductor device having planarized interlayer insulating film
11/18/2008US7452812 Method to create super secondary grain growth in narrow trenches
11/18/2008US7452811 introducing tantalum amine derivatives onto the insulating layer and a reacting gas selected from the group consisting of H2, NH3, SiH4, and Si2H6 to form a wiring including tantalum nitride; chemical vapor deposition; low temperature
11/18/2008US7452810 Method of forming a barrier layer of a semiconductor device
11/18/2008US7452809 Fabrication method of packaging substrate and packaging method using the packaging substrate
11/18/2008US7452808 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
11/18/2008US7452807 Method of forming a metal wiring in a semiconductor device
11/18/2008US7452806 Method of forming inductor in semiconductor device
11/18/2008US7452805 Aluminum based conductor for via fill and interconnect
11/18/2008US7452804 Single damascene with disposable stencil and method therefore
11/18/2008US7452803 Method for fabricating chip structure
11/18/2008US7452802 Method of forming metal wiring for high voltage element
11/18/2008US7452801 Metal interconnection structure of a semiconductor device having low resistance and method of fabricating the same
11/18/2008US7452800 Bonding a non-metal body to a metal surface using inductive heating
11/18/2008US7452799 Ball film for integrated circuit fabrication and testing
11/18/2008US7452798 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
11/18/2008US7452797 Solder deposition method and solder bump forming method
11/18/2008US7452796 Semi-conductor device with inductive component and method of making
11/18/2008US7452795 Semiconductor device and method for fabricating the same
11/18/2008US7452794 Manufacturing method of a thin film semiconductor device
11/18/2008US7452793 Wafer curvature estimation, monitoring, and compensation
11/18/2008US7452792 Relaxation of layers
11/18/2008US7452791 Crystalline semiconductor film, method of manufacturing the same, and semiconductor device
11/18/2008US7452790 Method of fabricating thin film transistor
11/18/2008US7452789 Method for forming underlayer composed of GaN-based compound semiconductor, GaN-based semiconductor light-emitting element, and method for manufacturing GaN-based semiconductor light-emitting element
11/18/2008US7452788 Method of laser annealing using linear beam having quasi-trapezoidal energy profile for increased depth of focus
11/18/2008US7452787 Fabrication method of semiconductor integrated circuit device
11/18/2008US7452786 Method for manufacturing thin film integrated circuit, and element substrate
11/18/2008US7452785 Method of fabrication of highly heat dissipative substrates
11/18/2008US7452784 Formation of improved SOI substrates using bulk semiconductor wafers
11/18/2008US7452783 Capacitor for a semiconductor device and method of forming the same
11/18/2008US7452782 Image TFT array of a direct X-ray image sensor and method of fabricating the same
11/18/2008US7452781 Method for manufacturing a semiconductor substrate, method for manufacturing a semiconductor device, and the semiconductor device
11/18/2008US7452780 Method of forming a stable transistor by dual source/drain implantation
11/18/2008US7452779 Semiconductor devices having improved gate insulating layers and related methods of fabricating such devices
11/18/2008US7452778 Semiconductor nano-wire devices and methods of fabrication
11/18/2008US7452777 Self-aligned trench MOSFET structure and method of manufacture
11/18/2008US7452776 Integrated circuits with substrate protrusions, including (but not limited to) floating gate memories
11/18/2008US7452775 Non-volatile memory device and manufacturing method and operating method thereof
11/18/2008US7452774 Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
11/18/2008US7452773 Method of manufacturing a flash memory device
11/18/2008US7452771 Method for fabricating a semiconductor device
11/18/2008US7452770 Reduced cell-to-cell shorting for memory arrays
11/18/2008US7452769 Semiconductor device including an improved capacitor and method for manufacturing the same
11/18/2008US7452768 Multiple device types including an inverted-T channel transistor and method therefor
11/18/2008US7452767 Selective implementation of barrier layers to achieve threshold voltage control in CMOS device fabrication with high k dielectrics
11/18/2008US7452766 Finned memory cells and the fabrication thereof
11/18/2008US7452765 Single event upset in SRAM cells in FPGAs with high resistivity gate structures
11/18/2008US7452764 Gate-induced strain for MOS performance improvement
11/18/2008US7452763 Method for a junction field effect transistor with reduced gate capacitance
11/18/2008US7452762 Thin film transistor and method of fabricating the same
11/18/2008US7452761 Hybrid SOI-bulk semiconductor transistors
11/18/2008US7452760 Thin film transistors and semiconductor constructions
11/18/2008US7452759 Carbon nanotube field effect transistor and methods for making same
11/18/2008US7452758 Process for making FinFET device with body contact and buried oxide junction isolation
11/18/2008US7452757 Silicon-on-insulator structures and methods
11/18/2008US7452756 Semiconductor device and manufacturing process thereof
11/18/2008US7452755 Embedded metal heat sink for semiconductor device and method for manufacturing the same
11/18/2008US7452754 Method for manufacturing flexible printed circuit boards
11/18/2008US7452753 Method of processing a semiconductor wafer for manufacture of semiconductor device
11/18/2008US7452752 Production method of semiconductor chip
11/18/2008US7452751 Semiconductor device and method of manufacturing the same
11/18/2008US7452750 Capacitor attachment method
11/18/2008US7452749 Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method
11/18/2008US7452748 Strap assembly comprising functional block deposited therein and method of making same
11/18/2008US7452747 Semiconductor package with contact support layer and method to produce the package
11/18/2008US7452745 Photodetecting device
11/18/2008US7452744 Method of manufacturing solid image pickup apparatus
11/18/2008US7452743 Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
11/18/2008US7452742 Solid-state imaging device, camera and method of producing the solid-state imaging device
11/18/2008US7452741 Process for manufacturing an apparatus that protects features during the removal of sacrificial materials
11/18/2008US7452740 Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
11/18/2008US7452739 Method of separating semiconductor dies
11/18/2008US7452738 Method of manufacturing organic electroluminescent device and organic electroluminescent device
11/18/2008US7452737 Molded lens over LED die
11/18/2008US7452736 Surface emitting device, manufacturing method thereof and projection display device using the same
11/18/2008US7452734 Method of making a monitoring pattern to measure a depth and a profile of a shallow trench isolation
11/18/2008US7452733 Method of increasing reliability of packaged semiconductor integrated circuit dice
11/18/2008US7452732 Comparing identifying indicia formed using laser marking techniques to an identifying indicia model
11/18/2008US7452659 nanofabricated system enables monitoring of the addition or removal of molecular species or proteins from a junction by monitoring the electronic properties of the junction; to utilize films of a single molecule in thickness for patterning a surface
11/18/2008US7452584 Method of increasing the area of a useful layer of material transferred onto a support
11/18/2008US7452571 coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin; andthen curing; board is subjected to preliminary treatment with a treatment agent comprising an acid anhydride group-containing alkoxysilane or a partial hydrolysis-condensation product thereof
11/18/2008US7452481 Polishing slurry and method of reclaiming wafers
11/18/2008US7452478 Method for converting and purifying materials for modifying surfaces of semiconductor nanoparticles
11/18/2008US7452477 Procedure for etching of materials at the surface with focussed electron beam induced chemical reaction at said surface
11/18/2008US7452443 Vacuum plasma generator
11/18/2008US7452438 Method of fixing a probe needle to a needle fixture of a probe card in semiconductor inspection equipment
11/18/2008US7452426 Process solutions containing surfactants used as post-chemical mechanical planarization treatment
11/18/2008US7452423 Diffusion system
11/18/2008US7452215 Ball grid array rework using a continuous belt furnace
11/18/2008US7452174 Load-lock and semiconductor device manufacturing equipment comprising the same
11/18/2008US7452128 On chip temperature measuring and monitoring circuit and method
11/18/2008US7452016 Non-contact carrying device