Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2008
11/25/2008US7456488 Porogen material
11/25/2008US7456486 Semiconductor integrated circuit device and process for manufacturing the same
11/25/2008US7456484 Semiconductor device having IGBT and diode
11/25/2008US7456481 Semiconductor device and manufacturing method of the same
11/25/2008US7456476 Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication
11/25/2008US7456474 Semiconductor device having insulating film
11/25/2008US7456467 Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure
11/25/2008US7456466 NAND flash memory device and method of manufacturing the same
11/25/2008US7456464 Semiconductor device including insulated gate type transistor and insulated gate type variable capacitance, and method of manufacturing the same
11/25/2008US7456461 Stacked capacitor array and fabrication method for a stacked capacitor array
11/25/2008US7456456 Semiconductor device and method of manufacturing the same
11/25/2008US7456454 Ferroelectric semiconductor device and method of manufacturing the same
11/25/2008US7456449 Semiconductor apparatus, LED print head, and printer
11/25/2008US7456446 Semiconductor device
11/25/2008US7456444 Field effect transistor
11/25/2008US7456443 Transistors having buried n-type and p-type regions beneath the source region
11/25/2008US7456442 Super lattice modification of overlying transistor
11/25/2008US7456430 Semiconductor device and method for fabricating the same
11/25/2008US7456428 Manufacturing method of semiconductor film and image display device
11/25/2008US7456427 Insulated gate field effect semiconductor devices and method of manufacturing the same
11/25/2008US7456401 Projection electron microscope, electron microscope, specimen surface observing method and micro device producing method
11/25/2008US7456371 Laser apparatus and laser annealing method
11/25/2008US7456248 Polyarylethersulfone compositions exhibiting reduced yellowness and high light transmittance properties and articles made therefrom
11/25/2008US7456140 Stripping formulation for photoresists containing ammonium difluoride or ammonium fluoride, a sulfone or sulfoxide solvent and a basic amine
11/25/2008US7456116 Gap-fill depositions in the formation of silicon containing dielectric materials
11/25/2008US7456115 Method for forming semiconductor devices having reduced gate edge leakage current
11/25/2008US7456113 Cleaning method and solution for cleaning a wafer in a single wafer process
11/25/2008US7456112 Method of fabricating micro-needle array
11/25/2008US7456111 Plasma etching method and plasma etching apparatus
11/25/2008US7456110 Method and apparatus for controlling etch selectivity
11/25/2008US7456109 Method for cleaning substrate processing chamber
11/25/2008US7456108 Manufacturing method for a semiconductor device
11/25/2008US7456107 Compositions and methods for CMP of low-k-dielectric materials
11/25/2008US7456106 Method for producing a silicon wafer
11/25/2008US7456105 CMP metal polishing slurry and process with reduced solids concentration
11/25/2008US7456104 Semiconductor device and manufacturing method thereof
11/25/2008US7456103 Etch-resistant film, forming method thereof, surface-modified resist pattern, forming method thereof, semiconductor device and manufacturing method thereof
11/25/2008US7456102 Electroless copper fill process
11/25/2008US7456101 Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds
11/25/2008US7456100 Top layers of metal for high performance IC's
11/25/2008US7456099 Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices
11/25/2008US7456098 Building metal pillars in a chip for structure support
11/25/2008US7456097 System and method for faceting via top corners to improve metal fill
11/25/2008US7456095 Method and apparatus for forming nickel silicide with low defect density in FET devices
11/25/2008US7456094 LDMOS transistor
11/25/2008US7456093 Method for improving a semiconductor device delamination resistance
11/25/2008US7456092 Self-releasing spring structures and methods
11/25/2008US7456091 Semiconductor device and method of manufacturing the same
11/25/2008US7456090 Method to reduce UBM undercut
11/25/2008US7456089 Semiconductor device and method of manufacturing the semiconductor device
11/25/2008US7456088 Integrated circuit package system including stacked die
11/25/2008US7456087 Semiconductor device and method of fabricating the same
11/25/2008US7456086 Semiconductor having structure with openings
11/25/2008US7456085 Method for introducing impurities
11/25/2008US7456084 Method of using a setter having a recess in manufacturing a net-shape semiconductor wafer
11/25/2008US7456083 Semiconductor device and manufacturing method of the same
11/25/2008US7456082 Method for producing silicon single crystal and silicon single crystal
11/25/2008US7456081 In-place bonding of microstructures
11/25/2008US7456080 Semiconductor on glass insulator made using improved ion implantation process
11/25/2008US7456079 EPI wafer and method of making the same
11/25/2008US7456078 Thin-film capacitor and method for fabricating the same, electronic device and circuit board
11/25/2008US7456077 Method for interconnecting anodes and cathodes in a flat capacitor
11/25/2008US7456076 Techniques for forming passive devices during semiconductor back-end processing
11/25/2008US7456075 Resistance dividing circuit and manufacturing method thereof
11/25/2008US7456074 Increasing an electrical resistance of a resistor by nitridization
11/25/2008US7456073 Wet electrolytic capacitors
11/25/2008US7456072 Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
11/25/2008US7456071 Method for forming a strongly-conductive buried layer in a semiconductor substrate
11/25/2008US7456070 Method of fabricating a bipolar transistor with high breakdown voltage collector
11/25/2008US7456069 Method in the fabrication of an integrated injection logic circuit
11/25/2008US7456068 Forming ultra-shallow junctions
11/25/2008US7456067 Method with high gapfill capability for semiconductor devices
11/25/2008US7456066 Variable width offset spacers for mixed signal and system on chip devices
11/25/2008US7456065 Fabricating method of DRAM cylindrical capacitor
11/25/2008US7456064 High K dielectric material and method of making a high K dielectric material
11/25/2008US7456063 Layout method of power line for semiconductor integrated circuit and semiconductor integrated circuit manufactured by the layout method
11/25/2008US7456062 Method of forming a semiconductor device
11/25/2008US7456061 Method to reduce boron penetration in a SiGe bipolar device
11/25/2008US7456060 Nonvolatile memory device and method for fabricating the same
11/25/2008US7456059 Thin film device supply body, method of fabricating thin film device, method of transfer, method of fabricating semiconductor device, and electronic equipment
11/25/2008US7456058 Stressed MOS device and methods for its fabrication
11/25/2008US7456057 Germanium on glass and glass-ceramic structures
11/25/2008US7456056 Semiconductor device and method for fabricating the same
11/25/2008US7456055 Process for forming an electronic device including semiconductor fins
11/25/2008US7456054 Gated lateral thyristor-based random access memory cell (GLTRAM)
11/25/2008US7456053 Packaging method for segregating die paddles of a leadframe
11/25/2008US7456052 Thermal intermediate apparatus, systems, and methods
11/25/2008US7456051 Photoelectric device grinding process and device grinding process
11/25/2008US7456050 System and method for controlling integrated circuit die height and planarity
11/25/2008US7456049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same
11/25/2008US7456048 Semiconducting device with folded interposer
11/25/2008US7456047 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
11/25/2008US7456046 Method to create flexible connections for integrated circuits
11/25/2008US7456045 Low temperature melt-processing of organic-inorganic hybrid
11/25/2008US7456044 Method for manufacturing image sensor
11/25/2008US7456043 Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereof
11/25/2008US7456042 Microelectromechanical systems having stored charge and methods for fabricating and using same
11/25/2008US7456041 Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
11/25/2008US7456040 Method for producing semiconductor optical device
11/25/2008US7456039 Method for manufacturing semiconductor optical device
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