Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/02/2008US7459324 Metal nanoparticle photonic bandgap device in SOI method
12/02/2008US7459323 Method of manufacturing a thin film transistor array panel
12/02/2008US7459322 Method for disposing material by droplet ejection, display device, method for manufacturing display device, and electronic apparatus
12/02/2008US7459321 Method of storing a data bit in a fast-write alloy
12/02/2008US7459320 Method for producing a photovoltaic device
12/02/2008US7459319 Method and apparatus for characterizing features formed on a substrate
12/02/2008US7459318 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same
12/02/2008US7459267 Sacrificial compositions and methods of fabricating a structure using sacrificial compositions
12/02/2008US7459266 Insulating layer formed on a first electrode layer, the insulating layer having a first opening, a stencil layer formed on the insulating layer, and having a second opening formed in an area of the first opening, a phase-change material layer formed on a surface of the first electrode layer
12/02/2008US7459265 Pattern forming method, semiconductor device manufacturing method and exposure mask set
12/02/2008US7459246 Method for manufacturing a semiconductor device, stencil mask and method for manufacturing a the same
12/02/2008US7459244 Mask, method for forming a pattern, and method for evaluating pattern line width
12/02/2008US7459242 Method and system for repairing defected photomasks
12/02/2008US7459215 Transporting flat panel displays without absorption of radiant thermal energy using a device having a carbon-fiber reinforced composite body with attached electroconductive polymer and reflective metal films covering top and bottom surfaces and covered with glass fiber epoxy resin layers
12/02/2008US7459187 Uniform thickness achieved by rotating the rotor around the axis almost perpendicular to the base material-conveying direction in the state where it faces, via a narrow gap; gas is dragged into gap by rotation of the rotor and blown out onto the base material surface.
12/02/2008US7459177 Liquid droplet discharge of a solution of coloring materials constituting the colored layers onto the functional region of a substrate and of just the solvent (optionally containing some coloring material) onto the nonfunctional region; capable of forming pixel patterns having a uniform film thickness
12/02/2008US7459175 Creating a dynamic model of monolayer deposition processing system and incorporating virtual sensors in the dynamic model; includes using intelligent set points, dynamic models, and/or virtual sensors; depositing a film on a substrate in a semiconductor device
12/02/2008US7459099 Quartz-based nanoresonators and method of fabricating same
12/02/2008US7459098 Dry etching apparatus, dry etching method, and plate and tray used therein
12/02/2008US7459094 Method for making a surface acoustic wave device package
12/02/2008US7459057 Substrate retainer
12/02/2008US7459056 Pad conditioning head for CMP process
12/02/2008US7459055 Bonding structure with buffer layer and method of forming the same
12/02/2008US7459046 Film-shaped adhesive application apparatus
12/02/2008US7459036 Containing Zr; average roughness of an erosion face of 0.01-2 mu m.; favorable deposition property and deposition speed, generates few particles, and suitable for forming a high dielectric gate insulation film such as HfO or HfON film
12/02/2008US7459029 Cleaning method, cleaning apparatus and electro optical device
12/02/2008US7459025 Methods for transferring a layer onto a substrate
12/02/2008US7458879 Dressing apparatus and substrate holding apparatus
12/02/2008US7458818 Electric connector and electrical connecting apparatus using the same
12/02/2008US7458762 Apparatus and method for positioning semiconductor substrate
12/02/2008US7458499 Apparatus and method for filling a ball grid array template
12/02/2008US7458498 Semiconductor device and a wire bonding method
12/02/2008US7458472 Re-usable carrier structure
12/02/2008US7458335 Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils
12/02/2008US7458123 Apparatuses and methods for cleaning test probes
11/2008
11/27/2008WO2008144742A1 Printed circuits and method for making same
11/27/2008WO2008144670A1 Load lock fast pump vent
11/27/2008WO2008144668A1 Side opening substrate carrier and load port
11/27/2008WO2008144664A1 Compact substrate transport system with fast swap robot
11/27/2008WO2008144631A1 Trench isolation structure and method of manufacture
11/27/2008WO2008144629A1 Raised source/drain regions in mos device
11/27/2008WO2008144625A1 Method for integrating silicon germanium and carbon doped silicon within a strained cmos flow
11/27/2008WO2008144621A1 Silicon oxide interface layer formed during silicon carbide etch stop deposition
11/27/2008WO2008144459A1 Apparatus for connecting integrated circuit chip to power and ground circuits
11/27/2008WO2008144206A1 Semiconductor device having tipless epitaxial source/drain regions
11/27/2008WO2008144169A2 Faced fiber insulation batt and method of making same
11/27/2008WO2008144153A1 Integrated circuit packages, methods of forming integrated circuit packages, and methods of assembling integrated circuit packages
11/27/2008WO2008144007A1 Chip package with pin stabilization layer
11/27/2008WO2008143909A1 Process for treatment of substrates with water vapor or steam
11/27/2008WO2008143885A2 Protection layer for fabricating a solar cell
11/27/2008WO2008143837A1 Durable, heat-resistant multi-layer coatings and coated articles
11/27/2008WO2008143766A2 Adaptor for cluster tool chambers
11/27/2008WO2008143742A1 Variable volume plasma processing chamber and associated methods
11/27/2008WO2008143663A1 Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity
11/27/2008WO2008143518A1 Device and method for exposing wafers to a liquid
11/27/2008WO2008143476A1 Apparatus and method for drying substrates
11/27/2008WO2008143475A1 Semiconductor device vision inspecting system
11/27/2008WO2008143471A1 Semiconductor package inspecting system
11/27/2008WO2008143461A2 Wafer level chip scale package of an image sensor by means of through hole interconnection and method for manufacturing the same
11/27/2008WO2008143420A1 Method and apparatus for multi-mode plasma generation
11/27/2008WO2008143405A1 Plasma generating apparatus
11/27/2008WO2008143404A1 Plasma generating apparatus
11/27/2008WO2008143359A1 Electronic circuit device
11/27/2008WO2008143358A1 Electric device, connecting method and adhesive film
11/27/2008WO2008143337A1 Monolithic, non-contact six degree-of-freedom stage apparatus
11/27/2008WO2008143313A1 Semiconductor device
11/27/2008WO2008143302A1 Composition for forming resist lower layer film
11/27/2008WO2008143301A1 Method for pattern formation and resin composition for use in the method
11/27/2008WO2008143278A1 Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method
11/27/2008WO2008143260A1 Work processing device
11/27/2008WO2008143259A1 Slit coater
11/27/2008WO2008143228A1 Wafer end surface inspecting apparatus
11/27/2008WO2008143211A1 Display device
11/27/2008WO2008143197A1 Method and apparatus for production of metal oxide thin film
11/27/2008WO2008143187A1 Substrate cleaning solution for semiconductor device and method for manufacturing semiconductor device
11/27/2008WO2008143115A1 Tunnel type magnetic detection element
11/27/2008WO2008143088A1 Plasma-processing device and method of manufacturing adhesion-preventing member
11/27/2008WO2008143083A1 Gas injection means for laser processing apparatus
11/27/2008WO2008143029A1 Polishing pad manufacturing method
11/27/2008WO2008143024A1 Thin film forming apparatus
11/27/2008WO2008143017A1 Method of removing resist and apparatus therefor
11/27/2008WO2008143004A1 Dry etching method
11/27/2008WO2008142975A1 Dicing apparatus and dicing method
11/27/2008WO2008142970A1 Method for crystallizing thin film, process for producing thin-film semiconductor device, process for producing elctronic equipment, and process for producing display device
11/27/2008WO2008142969A1 Semiconductor device
11/27/2008WO2008142965A1 Tunnel type magnetic detector element
11/27/2008WO2008142960A1 Resin bleeding inhibitor and method of preventing resin bleeding
11/27/2008WO2008142958A1 Imprinting method
11/27/2008WO2008142934A1 Apparatus and method for attaching sheet
11/27/2008WO2008142923A1 Substrate processing apparatus and substrate processing method
11/27/2008WO2008142916A1 Measuring system, measuring method and program
11/27/2008WO2008142911A1 Semiconductor device and method for manufacturing the same
11/27/2008WO2008142895A1 Device for taking out granular body
11/27/2008WO2008142873A1 Semiconductor device and its manufacturing method
11/27/2008WO2008142857A1 Semiconductor integrated circuit
11/27/2008WO2008142839A1 Semiconductor chip and semiconductor device
11/27/2008WO2008142784A1 Inprint equipment
11/27/2008WO2008142764A1 Stacked package and method of forming stacked package
11/27/2008WO2008142763A1 Stacked package and method of forming stacked package
11/27/2008WO2008142739A1 Semiconductor element