Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/25/2014CN203674243U 太阳能板全自动排片机 Solar panels automatic discharge machine
06/25/2014CN203674241U 一种提升硅片扩散方阻均匀性的装置 A way to improve the uniformity of silicon diffusion barrier means
06/25/2014CN203674240U 一种用于湿法刻蚀装置的汇流挡板 A wet etching apparatus bus baffle
06/25/2014CN203674239U 一种湿法刻蚀的切水装置 Cut water wet etching apparatus
06/25/2014CN203674211U 阵列基板及显示装置 Array substrate and a display device
06/25/2014CN203674193U 封装结构 Package structure
06/25/2014CN203674190U 集成电路盖膜撕除机构 IC cover film tear-off mechanism
06/25/2014CN203674189U 一种真空吸笔 A vacuum suction pen
06/25/2014CN203674188U 震动盘进料筛选装置 Vibration plate feed screening device
06/25/2014CN203674187U 一种引线框架升降机构 A lead frame for lifting and lowering mechanism
06/25/2014CN203674186U 硅片盒 Wafer Box
06/25/2014CN203674185U 一种承载硅片的石墨框装置 One kind of graphite wafer carrier box device
06/25/2014CN203674184U 用于铜片预氧化的陶瓷支架 For copper pre-oxidized ceramic brackets
06/25/2014CN203674183U 一种顶针及半导体芯片制造设备 One kind of thimble and semiconductor chip manufacturing equipment
06/25/2014CN203674182U 注塑机废料接收机构 Injection molding machines scrap receiving institution
06/25/2014CN203674181U 自动拾板、擦板、固晶一体机 Automatic pickup plate, rub board, solid crystal machine
06/25/2014CN203674180U 一种晶元加工装置 A crystalline element processing unit
06/25/2014CN203674179U 碱槽转轴 Base groove shaft
06/25/2014CN203674178U 一种基板传送腔体 A substrate transfer cavity
06/25/2014CN203674177U 气相蚀刻装置 Vapor etching apparatus
06/25/2014CN203674176U 塑封同轴向二极管铜电极引线过渡盘装填机 Plastic coaxial copper electrode leads to the diode transition plate Loaders
06/25/2014CN203674175U 一种键合机在线配套装置 A bonded machine online supporting devices
06/25/2014CN203674174U 一种改善湿法刻蚀机台滴液的装置 A dripping wet etching machine means to improve
06/25/2014CN203674173U 晶片擦洗机 Wafer scrubbing machines
06/25/2014CN203674172U 防尘罩 Dust
06/25/2014CN203673219U 一种基板检测修复系统 A substrate to check and repair system
06/25/2014CN203664279U 一种晶圆清洗刷 One kind of wafer cleaning brush
06/25/2014CN1774842B 高级微电子接插组件及其制造方法 Advanced microelectronic connector assembly and method of manufacturing
06/25/2014CN1400673B 电光装置和电子设备 An electro-optical device and electronic equipment
06/25/2014CN103891417A 具有腔室壁温度控制的等离子体反应器 Having a chamber wall temperature control of plasma reactor
06/25/2014CN103891114A 位移装置及其制造、使用和控制方法 Displacement of the device and its manufacture, use and control method
06/25/2014CN103890981A 发光二极管、发光二极管的制造方法、发光二极管灯和照明装置 Light-emitting diodes, a method of manufacturing a light emitting diode, LED lamps and lighting fixtures
06/25/2014CN103890974A 使用外延剥离和冷焊结合的半导体太阳能电池的集成太阳能收集器 Stripping and cold welding using a combination of epitaxial semiconductor solar cell integrated solar collector
06/25/2014CN103890953A 半导体元件 Semiconductor components
06/25/2014CN103890952A 碳化硅半导体器件及其制造方法 The silicon carbide semiconductor device and its manufacturing method
06/25/2014CN103890951A 用于制造半导体器件的方法和半导体器件 The method of manufacturing a semiconductor device and a semiconductor device is used
06/25/2014CN103890945A 包括金刚石层的器件 Device including a diamond layer,
06/25/2014CN103890943A 基于异质结氧化物的忆阻元件 Memristor-based element oxide heterostructures
06/25/2014CN103890940A 包括结合使用双镶嵌型方案制造的微细间距背侧金属再分布线的穿硅过孔的3d互连结构 Includes a combination of dual damascene metal fine pitch backside redistribution type for manufacturing lines through silicon vias 3d interconnect structure
06/25/2014CN103890939A 包括与穿硅过孔组合的细间距单镶嵌后侧金属再分布线的3d互连结构 Including through silicon vias combination with fine-pitch single damascene interconnect structure 3d metal back side redistribution lines
06/25/2014CN103890935A 树脂封装型半导体装置及其制造方法 A resin sealing type semiconductor device and its manufacturing method
06/25/2014CN103890931A 半导体装置及半导体模块 A semiconductor device and a semiconductor module
06/25/2014CN103890930A 用于嵌入式dram的替代栅多栅晶体管 Replacement gate for embedded dram of multi-gate transistor
06/25/2014CN103890929A 半导体集成电路装置 The semiconductor integrated circuit device
06/25/2014CN103890928A 静电夹盘 The electrostatic chuck
06/25/2014CN103890927A 交流驱动静电吸盘 AC drive electrostatic chuck
06/25/2014CN103890926A 装载端口、efem Loading port, efem
06/25/2014CN103890925A 经由激光衍射测量3d半导体结构的温度的设备及方法 3d diffraction measurement apparatus and method of the semiconductor laser via the temperature of the structure
06/25/2014CN103890924A 具有用于接触厚布线或条片的金属成型体的功率半导体芯片及其制造方法 Having a power semiconductor chip and a method of manufacturing a thick wiring for contacting a metal sheet or strip shaped body
06/25/2014CN103890923A 半导体器件 Semiconductor devices
06/25/2014CN103890922A 制造半导体器件的方法 The method of manufacturing a semiconductor device
06/25/2014CN103890921A 制造碳化硅半导体器件的方法 The method of manufacturing a silicon carbide semiconductor device
06/25/2014CN103890920A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
06/25/2014CN103890919A 半导体接合保护用玻璃复合物、半导体装置的制造方法以及半导体装置 Bonding a semiconductor protective glass composite, a method of manufacturing a semiconductor device and a semiconductor device
06/25/2014CN103890918A 高选择性氮化物蚀刻工艺 Highly selective nitride etch process
06/25/2014CN103890917A 半导体处理中的边缘环的热管理 Thermal management of semiconductor processing edge ring
06/25/2014CN103890916A 双室结构的脉冲等离子体室 Pulsed plasma chamber dual chamber structure
06/25/2014CN103890915A 阳极电池材料及其制备方法 Battery anode material and preparation method
06/25/2014CN103890914A 半导体元件及其制造方法 Semiconductor device and manufacturing method
06/25/2014CN103890913A 用于激光处理设备的多重光束组合器 Multiple beam combiner for laser processing apparatus
06/25/2014CN103890912A 用于提供均匀气流的设备与方法 Provide uniform air flow device and method for
06/25/2014CN103890911A 气体分散设备 Gas dispersion device
06/25/2014CN103890910A 等离子体活化保形电介质膜沉积 Plasma activated deposition of a conformal dielectric film
06/25/2014CN103890909A 具有机械停止件的非接触磁驱动组件 Mechanical stop member having a non-contact magnetic drive assembly
06/25/2014CN103890908A 固相键合晶片的支承基板的剥离方法及半导体装置的制造方法 The method of manufacturing the solid-phase method for stripping the bonded wafer and the supporting substrate of a semiconductor device
06/25/2014CN103890907A 生产透明soi片的方法 The method of production of a transparent sheet soi
06/25/2014CN103890906A 用于生产机械柔性的硅基底的方法 Method for producing a mechanical flexibility of the silicon substrate
06/25/2014CN103890905A FinFET结构和用于调整FinFET结构中的阈值电压的方法 FinFET structure and method for adjusting the FinFET structure of the threshold voltage
06/25/2014CN103890904A 包含绝缘体上硅的半导体封装体 Semiconductor package comprising a silicon-on-insulator
06/25/2014CN103890897A 用于先进等离子体能量处理系统的离子能量控制系统 Advanced plasma ion energy is used to control the energy processing system
06/25/2014CN103890855A 自旋霍尔效应磁性设备、方法及应用 Spin Hall effect magnetic devices, methods and applications
06/25/2014CN103890642A 基板处理装置 The substrate processing apparatus
06/25/2014CN103890625A 透镜阵列与光子芯片的光学耦合 Optical coupling lens array chip with photonic
06/25/2014CN103890549A 传感器单元和用于传感器单元的带端编程的方法 Sensor unit and a sensor unit with side programming method
06/25/2014CN103890233A 铜微蚀刻剂及其补充液、以及电路板的制造方法 Copper micro-etchant and Replenisher, and circuit board manufacturing method
06/25/2014CN103890232A 铜钼合金膜的蚀刻液组合物 Etchant composition copper-molybdenum alloy film
06/25/2014CN103890229A 等离子体成膜装置 The plasma film forming apparatus
06/25/2014CN103890127A 研磨剂浆料及研磨方法 Abrasive slurry and polishing method
06/25/2014CN103890114A 研磨用组合物、使用了其的研磨方法和基板的制造方法 The polishing composition, the use of the manufacturing method thereof and a substrate polishing method
06/25/2014CN103890107A 用于在半导体基底中形成掺杂区域的掺杂剂油墨组合物，以及用于制造掺杂剂油墨组合物的方法 For forming doped regions in a semiconductor substrate a dopant of the ink composition, and a method for manufacturing the ink composition of dopant
06/25/2014CN103889656A 具有复合塑胶部分的载体头部 A carrier having a head portion of a composite plastic
06/25/2014CN103889655A 双面研磨方法 Double-sided polishing method
06/25/2014CN103889602A 清洗装置及方法 Cleaning apparatus and method
06/25/2014CN103889588A 用于基片的表面处理的装置 Means for processing the substrate surface
06/25/2014CN103889376A 生物相容性电极部件及其制造方法 Biocompatible electrode member and its manufacturing method
06/25/2014CN103889168A 承载电路板、承载电路板的制作方法及封装结构 Bearer circuit board carrying the circuit board manufacturing method and package structure
06/25/2014CN103887403A 发光模组的校正方法 LED modules of the correction method
06/25/2014CN103887371A 一种InP基面阵器件均匀刻蚀的工艺方法 One kind of InP-based planar array uniform etching process for device
06/25/2014CN103887346A 一种肖特基二极管及其制造方法 One kind of the Schottky diode and the manufacturing method
06/25/2014CN103887345A 一种氧化物薄膜晶体管及其制造方法 An oxide thin film transistor and manufacturing method thereof
06/25/2014CN103887344A Igzo薄膜晶体管及改善igzo薄膜晶体管电学性能的方法 Igzo thin film transistor and method for improving the electrical properties of the thin film transistor igzo
06/25/2014CN103887343A 薄膜晶体管及其制作方法、阵列基板和显示装置 Thin film transistor and manufacturing method, the array substrate and display device
06/25/2014CN103887342A 沟槽mosfet及其制作方法 Trench mosfet and its production methods
06/25/2014CN103887341A 一种场效应晶体管的制备方法 Preparation method of a field effect transistor,
06/25/2014CN103887339A 一种晶体管、晶体管的散热结构以及晶体管的生产方法 Method for producing a transistor, a heat dissipation structure of the transistor and the transistor of
06/25/2014CN103887338A 一种适用于深槽超结器件的结终端及其制备方法 One for ultra-deep trench junction terminal junction device and its preparation method
06/25/2014CN103887337A 半导体结构及其制作工艺 Semiconductor structure and fabrication process
06/25/2014CN103887336A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
06/25/2014CN103887335A 一种提升频率特性的赝配高电子迁移率晶体管及制作方法 A way to improve the frequency characteristics of the pseudomorphic high electron mobility transistor and manufacturing method
06/25/2014CN103887334A GaN高电子迁移率晶体管和GaN二极管 GaN high electron mobility transistors and GaN diode
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