Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/26/2014WO2014098987A1 Ion implantation of dopants for forming spatially located diffusion regions of solar cells
06/26/2014WO2014098975A1 Semiconductor devices with germanium-rich active layers & doped transition layers
06/26/2014WO2014098969A1 Perpendicular spin transfer torque memory (sttm) device with enhanced stability and method to form same
06/26/2014WO2014098965A1 Bumpless build-up layer package including a release layer
06/26/2014WO2014098771A1 Wafer dicing apparatus and wafer dicing method
06/26/2014WO2014098577A1 Curing a heat-curable material in an embedded curing zone
06/26/2014WO2014098488A1 Dry etching apparatus, nozzle for generating high-speed particle beam for dry etching, and dry etching method using high-speed particle beam
06/26/2014WO2014098487A1 Dry separation apparatus, nozzle for generating high-speed particle beam for dry separation, and dry separation method using high-speed particle beam
06/26/2014WO2014098486A1 Substrate treatment apparatus, and method for controlling temperature of heater
06/26/2014WO2014098364A1 Nozzle, device, and method for high-speed generation of uniform nanoparticles
06/26/2014WO2014098345A1 Apparatus and method for detecting cracks in contact part of electronic device
06/26/2014WO2014098321A1 Semiconductor substrate and method for manufacturing same
06/26/2014WO2014098224A1 Sample holder
06/26/2014WO2014098220A1 Evaluation method and device, processing method, and exposure system
06/26/2014WO2014098200A1 Substrate holder and production method for substrate having film formed over entire surface thereof using same
06/26/2014WO2014098174A1 Flip-chip bonder and method for correcting flatness and deformation amount of bonding stage
06/26/2014WO2014098076A1 Composition for forming silicon-containing resist underlayer film having cyclic diester group
06/26/2014WO2014098050A1 Semiconductor device
06/26/2014WO2014098025A1 Bottom layer film-forming composition of self-organizing film containing styrene structure
06/26/2014WO2014097993A1 Bottom layer film-formation composition of self-organizing film containing polycyclic organic vinyl compound
06/26/2014WO2014097931A1 Gallium nitride substrate, and method for producing nitride semiconductor crystal
06/26/2014WO2014097898A1 Component-fixing method, circuit substrate, and display panel
06/26/2014WO2014097897A1 Tantalum sputtering target and method for producing same
06/26/2014WO2014097887A1 Substrate wettability-promoting composition, polishing composition containing same, and method for producing substrates using same
06/26/2014WO2014097859A1 Substrate processing device, device manufacturing system and method for manufacturing device
06/26/2014WO2014097845A1 METHOD FOR MANUFACTURING SiC SUBSTRATE
06/26/2014WO2014097836A1 Chip component mounting structure, and module component
06/26/2014WO2014097770A1 Method for manufacturing crystal semiconductor film
06/26/2014WO2014097761A1 Resist composition for imprinting
06/26/2014WO2014097760A1 Silicon carbide semiconductor device
06/26/2014WO2014097714A1 Method for manufacturing semiconductor device
06/26/2014WO2014097633A1 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
06/26/2014WO2014097595A1 Photosensitive resin composition, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
06/26/2014WO2014097577A1 Member for constituting discharge space, and method for regenerating same
06/26/2014WO2014097576A1 Grid assembly and ion beam etching apparatus
06/26/2014WO2014097526A1 Field effect transistor and method for producing same
06/26/2014WO2014097524A1 Semiconductor device
06/26/2014WO2014097520A1 Oxidation treatment device, oxidation method, and method for producing electronic device
06/26/2014WO2014097510A1 Method for manufacturing magnetoresistance effect element
06/26/2014WO2014097488A1 Semiconductor device
06/26/2014WO2014097463A1 Die supply device
06/26/2014WO2014097448A1 Method for manufacturing silicon carbide semiconductor device
06/26/2014WO2014097425A1 Semiconductor device
06/26/2014WO2014097369A1 Transistor having nitride semiconductor used therein and method for manufacturing transistor having nitride semiconductor used therein
06/26/2014WO2014097362A1 Semiconductor device and method for controlling same
06/26/2014WO2014097360A1 Resin composition for semiconductor integrated circuit device packaging tray and semiconductor integrated circuit device packaging tray
06/26/2014WO2014097280A1 Methods of low temperature deposition of ceramic thin films
06/26/2014WO2014097112A1 Fabricating thin-film optoelectronic devices with added potassium
06/26/2014WO2014096443A1 Method for doping semiconductor substrates, and doped semiconductor substrate
06/26/2014WO2014096218A1 Device and method for limiting force
06/26/2014WO2014096215A1 Method of producing a removable wafer connection and carrier for wafer support
06/26/2014WO2014095668A1 Method for applying a temporary bonding layer
06/26/2014WO2014095596A1 Method for pre-soldering metal surfaces onto metallised substrates using a metallic gauze, metallised substrates with a solder layer which has a superficial structure of a gauze
06/26/2014WO2014095503A1 Method for producing a compound semiconductor, and thin-film solar cell
06/26/2014WO2014095373A1 Substrates for semiconductor devices
06/26/2014WO2014095355A1 Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
06/26/2014WO2014095313A1 Method for testing a sensor circuit
06/26/2014WO2014094810A1 Method for monitoring the filling properties of a copper electrolyte
06/26/2014WO2014094730A1 Tool for producing a friction-welded connection between a wire and a substrate, having a pocket-shaped recess
06/26/2014WO2014094538A1 Deep silicon etch method
06/26/2014WO2014094450A1 Transistor, heat dissipation structure of transistor, and production method for transistor
06/26/2014WO2014094436A1 Gold/silicon eutectic chip soldering method and transistor
06/26/2014WO2014071352A3 Formulations of solutions and processes for forming a substrate including an arsenic dopant
06/26/2014WO2014070091A3 Through substrate vias and device
06/26/2014WO2014066268A3 Cross-linked organic polymer compositions
06/26/2014WO2014052476A3 Methods for wafer bonding, and for nucleating bonding nanophases
06/26/2014WO2014040033A3 Temperature control of semiconductor processing chambers by modulating plasma generation energy
06/26/2014WO2013033381A8 High definition heater and method of operation
06/26/2014US20140180469 Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
06/26/2014US20140179374 Switch Circuit and Method of Switching Radio Frequency Signals
06/26/2014US20140179124 Three-Dimensional Writable Printed Memory
06/26/2014US20140179123 Site-Isolated Rapid Thermal Processing Methods and Apparatus
06/26/2014US20140179122 Method of depositing a film
06/26/2014US20140179121 Method of depositing a film
06/26/2014US20140179120 Method of depositing a film
06/26/2014US20140179119 ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES
06/26/2014US20140179118 Surface treatment method for semiconductor device
06/26/2014US20140179117 Method for forming a layer on a substrate at low temperatures
06/26/2014US20140179116 Improvement of reverse recovery using oxygen-vacancy defects
06/26/2014US20140179115 Methods of Forming Patterns
06/26/2014US20140179114 Radical source design for remote plasma atomic layer deposition
06/26/2014US20140179113 Surface Treatment Methods and Systems for Substrate Processing
06/26/2014US20140179112 High Productivity Combinatorial Techniques for Titanium Nitride Etching
06/26/2014US20140179111 Selective titanium nitride etching
06/26/2014US20140179110 Methods and apparatus for processing germanium containing material, a iii-v compound containing material, or a ii-vi compound containing material disposed on a substrate using a hot wire source
06/26/2014US20140179109 Method of controlling trench microloading using plasma pulsing
06/26/2014US20140179108 Wafer Edge Protection and Efficiency Using Inert Gas and Ring
06/26/2014US20140179107 Etching Silicon Nitride Using Dilute Hydrofluoric Acid
06/26/2014US20140179106 In-situ metal residue clean
06/26/2014US20140179105 Heteroleptic (allyl)(pyrroles-2-aldiminate) metal-containing precursors, their synthesis and vapor deposition thereof to deposit metal-containing films
06/26/2014US20140179104 Method of depositing a film
06/26/2014US20140179103 Semiconductor devices having through-vias and methods for fabricating the same
06/26/2014US20140179102 Semiconductor device with air gaps and method for fabricating the same
06/26/2014US20140179101 Semiconductor device with air gap and method for fabricating the same
06/26/2014US20140179100 Method to Control Depth Profiles of Dopants Using a Remote Plasma Source
06/26/2014US20140179099 Methods and structure for carrier-less thin wafer handling
06/26/2014US20140179098 Semiconductor device and method of manufacturing semiconductor device
06/26/2014US20140179097 Deposition apparatus and method
06/26/2014US20140179096 Method of manufacturing semiconductor device
06/26/2014US20140179095 Methods and Systems for Controlling Gate Dielectric Interfaces of MOSFETs
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