| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/19/2014 | US20140166533 Packaging for substrates and packaging unit having such packaging |
| 06/19/2014 | US20140166461 Three-dimensional inter-chip contact through vertical displacement mems |
| 06/19/2014 | US20140166206 Non-plasma dry etching apparatus |
| 06/19/2014 | US20140166050 Chuck for Mounting a Semiconductor Wafer for Liquid Immersion Processing |
| 06/19/2014 | US20140165988 Resin-coated saw wire and cut article |
| 06/19/2014 | US20140165915 Thermal radiation barrier for substrate processing chamber components |
| 06/19/2014 | US20140165389 Integrated circuit packaging system with routable grid array lead frame |
| 06/18/2014 | EP2744307A2 Apparatus for plasma generation, method for manufacturing rotating electrodes for plasma generation apparatus, method for plasma treatment of substrate, and method for forming thin film of mixed structure using plasma |
| 06/18/2014 | EP2743981A1 Method of manufacturing an integrated semiconductor substrate structure |
| 06/18/2014 | EP2743977A1 Oxide tft array substrate, manufacturing method therefor, and electronic device |
| 06/18/2014 | EP2743976A1 Process for producing a hybrid semiconductor wafer soi/bulk |
| 06/18/2014 | EP2743975A1 End-effector device and substrate transport robot provided with said end-effector device |
| 06/18/2014 | EP2743974A1 Damper, cooling circuit and apparatus for vibration-sensitive substrate treatment apparatus |
| 06/18/2014 | EP2743973A2 Method for contacting a semiconductor element by welding a contact element to a sintered layer on the semiconductor element and semiconductor component with increased stability against thermomechanical influence |
| 06/18/2014 | EP2743972A1 Method for bonding semiconductor substrates and devices obtained thereby |
| 06/18/2014 | EP2743971A1 Heat treatment device |
| 06/18/2014 | EP2743970A1 Apparatus, method and program for manufacturing nitride film |
| 06/18/2014 | EP2743969A1 Etching method and method for performing surface processing on solid material for solar cell |
| 06/18/2014 | EP2743968A1 Composition for polishing compound semiconductor |
| 06/18/2014 | EP2743967A1 Composition that forms n-type diffusion layer, n-type diffusion layer manufacturing method and solar cell element manufacturing method |
| 06/18/2014 | EP2743966A1 Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same |
| 06/18/2014 | EP2743965A1 Method for manufacturing semiconductor devices |
| 06/18/2014 | EP2743754A1 Method for manufacturing a thin liquid crystal panel |
| 06/18/2014 | EP2743382A1 Method for peeling group 13 element nitride film |
| 06/18/2014 | EP2743371A1 Deposition apparatus, method of forming thin film using the same and method of manufacturing organic light emitting display apparatus |
| 06/18/2014 | EP2743283A1 Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition |
| 06/18/2014 | EP2743249A1 Cyclic compound, method for producing same, composition, and method for forming resist pattern |
| 06/18/2014 | EP2742541A1 Nanocrystal coated flexible substrates with improved thermoelectric efficiency |
| 06/18/2014 | EP2742527A1 Apparatus and method for bonding substrates |
| 06/18/2014 | EP2742526A2 Wafer carrier |
| 06/18/2014 | EP2742525A2 Aion coated substrate with optional yttria overlayer |
| 06/18/2014 | EP2742524A2 Thin film structures and devices with integrated light and heat blocking layers for laser patterning |
| 06/18/2014 | EP2742523A2 Perfluoroalkyl sulfonamides surfactants for photoresist rinse solutions |
| 06/18/2014 | EP2742016A1 Method for connecting components and composite structure |
| 06/18/2014 | DE112012003981T5 Finfet-Struktur und Verfahren zum Anpassen der Schwellenspannung in einer Finfet-Struktur FinFET structure and method of adjusting the threshold voltage in a FinFET structure |
| 06/18/2014 | DE112012000510B4 Verfahren zum Herstellen eines FET mit verspanntem Kanal mit Source/Drain-Puffern und FET A method for producing a strained channel FET with source / drain buffers and FET |
| 06/18/2014 | DE102013225362A1 Erhöhen der durchbruchsspannung einer metalloxidhalbleitereinrichtung Increasing the breakdown voltage of a metalloxidhalbleitereinrichtung |
| 06/18/2014 | DE102013224856A1 Schottky-Sperrschichtdiode und Verfahren zur Herstellung derselben Schottky barrier diode and method of manufacturing the same |
| 06/18/2014 | DE102013216003A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/18/2014 | DE102013114346A1 Systeme und verfahren für integrierte bootstrap-schaltungselementein leistungstransistoren und anderen bauelementen Systems and methods for integrated bootstrap schaltungselementein power transistors and other components |
| 06/18/2014 | DE102013114218A1 Verfahren zum herstellen einer halbleitervorrichtung und halbleiterwerkstück A method of manufacturing a semiconductor device and semiconductor workpiece |
| 06/18/2014 | DE102013114059A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 06/18/2014 | DE102013113917A1 Verfahren zum Fertigen eines Schichtstapels A method of fabricating a layer stack |
| 06/18/2014 | DE102013113770A1 Verfahren zum Überprüfen von Halbleiterchips oder Halbleiterchipmodulen A method for controlling a semiconductor chip or semiconductor chip modules |
| 06/18/2014 | DE102013113767A1 Halbleitervorrichtung mit einer Identifikationskennzeichnung A semiconductor device with an identification marking |
| 06/18/2014 | DE102013113751A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 06/18/2014 | DE102013112715A1 Inspektionsverfahren und Inspektionshalterung für Ritzlinien eines Wafers Inspection procedures and inspection support for scribe lines of a wafer |
| 06/18/2014 | DE102013105765A1 FinFET mit eingebautem MOS-Varaktor und Verfahren zu seiner Herstellung FinFET with integrated MOS varactor and process for its preparation |
| 06/18/2014 | DE102013103503A1 Resistiver Direktzugriffsspeicher (RRAM) und Verfahren zu seiner Herstellung Resistive Random Access Memory (RRAM), and process for its preparation |
| 06/18/2014 | DE102012223556A1 Method for manufacturing hetero junction type solar cell, involves forming metal interconnects on surface of solar cell by local application of conductive paste and by sintering with laser radiation |
| 06/18/2014 | DE102012223404A1 Handling device for handling structural component, has several separate suction sections for forming several suction chambers are provided between supports and are acted upon by negative pressure or overpressure |
| 06/18/2014 | DE102012223060A1 Oven arrangement for thermal processing of e.g. semiconductor wafer, has closed industrial furnace that is provided with elongate process zone that accommodates workpiece that is processed using process gas passed via discharge opening |
| 06/18/2014 | DE102012222012A1 Power semiconductor device e.g. insulated gate bipolar transistor (IGBT) for use in power semiconductor module, has power semiconductor component whose lateral edges are arranged on conductor line, adjacent to non-conductive insulator |
| 06/18/2014 | DE102012112316A1 Verfahren und Vorrichtung zur Herstellung eines Strahlung emittierenden Halbleiterbauelements und Strahlung emittierendes Halbleiterbauelement Method and apparatus for manufacturing a radiation-emitting semiconductor component and radiation-emitting semiconductor component |
| 06/18/2014 | DE102010051259B4 Verfahren zum Aufbringen einer elektrisch leitfähigen und optisch transparenten Metallschicht, ein Substrat mit dieser Metallschicht sowie dessen Verwendung A method of applying an electrically conductive and optically transparent metal layer, a substrate having the metal layer and the use thereof |
| 06/18/2014 | DE102007034402B4 Halbleiterpackung und Herstellungsverfahren dafür A semiconductor package and fabrication method thereof |
| 06/18/2014 | DE102004059505B4 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe von Testinseln Arrangement for testing embedded circuits using test Islands |
| 06/18/2014 | DE10164494B4 Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung An encapsulated device with a small overall height and methods for preparing |
| 06/18/2014 | CN203659921U 适用于led支架emc封装的料片排料和投料装置 Blank nesting and feeding device for led bracket emc package |
| 06/18/2014 | CN203659908U 太阳能电池片栅线清除装置 Solar cells gate line cleaning device |
| 06/18/2014 | CN203659906U 一种硅晶片表面晶格结构损伤处理用混酸供应装置 A silicone wafer surface lattice structure damage was treated with mixed acid supply unit |
| 06/18/2014 | CN203659900U 晶体硅电池片印刷半成品的转运柜 Crystalline silicon solar cells printed semi-transporter cabinet |
| 06/18/2014 | CN203659899U 太阳能电池用制绒花篮缓冲垫 Solar cell texturing baskets cushion |
| 06/18/2014 | CN203659873U 一种提高正向耐压的可控硅台面结构 A way to improve the forward voltage of the thyristor mesa structure |
| 06/18/2014 | CN203659849U 半导体装置 Semiconductor device |
| 06/18/2014 | CN203659834U 一种等离子刻蚀用硅片夹具 A plasma etching of a silicon wafer jig |
| 06/18/2014 | CN203659833U 晶舟固定弹片 Crystal boat fixed shrapnel |
| 06/18/2014 | CN203659832U 桥片料片 Bridge flakes sheet |
| 06/18/2014 | CN203659831U 框架条料片 Frame strip sheet |
| 06/18/2014 | CN203659830U 基于封装热压头的精确移动装置 Mobile device package based on precise thermal head |
| 06/18/2014 | CN203659829U 一种夹紧预压装置 A preload device clamped |
| 06/18/2014 | CN203659828U 蓝膜定位装置 Blue film positioning device |
| 06/18/2014 | CN203659827U 芯片校正爪 Chip correction claw |
| 06/18/2014 | CN203659826U 传输硅片花篮的90°旋转机构 Transfer silicon baskets 90 ° rotation mechanism |
| 06/18/2014 | CN203659825U Led封装的焊台传送机构 Led package soldering station transport mechanism |
| 06/18/2014 | CN203659824U Led封装焊台中的芯片焊接搬送装置 Led chip package soldering station soldering conveying device |
| 06/18/2014 | CN203659823U 芯片定位供给机构 Chip supply mechanism positioning |
| 06/18/2014 | CN203659822U 瓦形石英舟 W-shaped quartz boat |
| 06/18/2014 | CN203659821U 一种用于硅片扩散和氧化的石英舟 A quartz boat wafer diffusion and oxidation |
| 06/18/2014 | CN203659820U 用于烧结炉内的二次集成电路支架结构 Secondary IC support structure for sintering furnace |
| 06/18/2014 | CN203659819U 防止稀释剂反向喷淋的晶元边缘光刻胶清除装置 Prevent reverse spray thinner photoresist removal device wafer edge |
| 06/18/2014 | CN203659818U 洗净设备 Wash Equipment |
| 06/18/2014 | CN203659817U 一种提高半导体封装良率的系统 A way to improve the yield of semiconductor packaging systems |
| 06/18/2014 | CN203659816U 一种用于测试sem实验中的硅片保护装置 A method for testing a silicon wafer sem protection experiment |
| 06/18/2014 | CN203659815U 一种蓝宝石晶体定向检测旋转平台 One kind of sapphire crystal orientation detection rotating platform |
| 06/18/2014 | CN203659814U 晶边缺陷检测装置 Crystal edge defect detection device |
| 06/18/2014 | CN203659813U 一种干刻设备的电极和干刻设备 One kind of dry etching and dry etching apparatus of an electrode device |
| 06/18/2014 | CN203659812U 一种可在惰性气氛中生长掺杂有机晶体的装置 An organic transistor can be installed in an inert atmosphere to grow the doped |
| 06/18/2014 | CN203657947U 一种静电卡盘基本性能检测装置 An electrostatic chuck basic performance detection device |
| 06/18/2014 | CN103875077A Insulating film and production method for same |
| 06/18/2014 | CN103875073A Semiconductor device, method for manufacturing same, and power supply apparatus |
| 06/18/2014 | CN103875069A High-voltage-resistance semiconductor device |
| 06/18/2014 | CN103875068A Through-wafer via device and method of manufacturing the same |
| 06/18/2014 | CN103875067A Method for providing a connection between metal moulded bodies and a power semi-conductor which is used to join thick wires or strips |
| 06/18/2014 | CN103875066A Substrate processing device and robot controller |
| 06/18/2014 | CN103875065A Underfill composition |
| 06/18/2014 | CN103875064A Drive circuit substrate and manufacturing method therefor, display device, and electronic device |
| 06/18/2014 | CN103875063A Semiconductor device, method for manufacturing same, and electronic component |
| 06/18/2014 | CN103875062A Double layer transfer method |
| 06/18/2014 | CN103875061A Method for reclaiming peeled-off wafer |