| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/03/2014 | US20140183699 Phase changing on-chip thermal heat sink |
| 07/03/2014 | US20140183688 Modified via bottom for beol via efuse |
| 07/03/2014 | US20140183662 Deep trench isolation with tank contact grounding |
| 07/03/2014 | US20140183661 FinFET Device Structure and Methods of Making Same |
| 07/03/2014 | US20140183655 High performance isolated vertical bipolar junction transistor and method for forming in a cmos integrated circuit |
| 07/03/2014 | US20140183653 High-k metal gate |
| 07/03/2014 | US20140183651 Semiconductor device with metal gate and high-k materials and method for fabricating the same |
| 07/03/2014 | US20140183648 Semiconductor Structures and Methods of Forming the Same |
| 07/03/2014 | US20140183645 Complimentary Metal-Oxide-Semiconductor (CMOS) With Low Contact Resistivity and Method of Forming Same |
| 07/03/2014 | US20140183643 Transistors with Wrapped-Around Gates and Methods for Forming the Same |
| 07/03/2014 | US20140183638 Methods of using a trench salicide routing layer |
| 07/03/2014 | US20140183636 Method for manufacturing semiconductor substrate, substrate for forming semiconductor substrate, stacked substrate, semiconductor substrate, and electronic device |
| 07/03/2014 | US20140183634 Thin Film Transistor Short Channel Patterning by Substrate Surface Energy Manipulation |
| 07/03/2014 | US20140183631 Low cost transistors |
| 07/03/2014 | US20140183627 Semiconductor device and associated method for manufacturing |
| 07/03/2014 | US20140183617 Non-volatile semiconductor memory device and its manufacturing method |
| 07/03/2014 | US20140183610 Decoupling Capacitor for FinFET Compatible Process |
| 07/03/2014 | US20140183602 Alternating tap-cell strategy in a standard cell logic block for area reduction |
| 07/03/2014 | US20140183601 Method for transferring a layer of a semiconductor and substrate comprising a confinement structure |
| 07/03/2014 | US20140183561 Semiconductor device and method for manufacturing the same |
| 07/03/2014 | US20140183559 Semiconductor device and method for fabricating the same |
| 07/03/2014 | US20140183557 Semiconductor device structure for ohmic contact and method for fabricating the same |
| 07/03/2014 | US20140183554 Schottky barrier diode and method of manufacturing the same |
| 07/03/2014 | US20140183551 BLANKET EPI SUPER STEEP RETROGRADE WELL FORMATION WITHOUT Si RECESS |
| 07/03/2014 | US20140183536 Thin film transistor panel and method for manufacturing the same |
| 07/03/2014 | US20140183534 Thin-wafer current sensors |
| 07/03/2014 | US20140183531 METHOD FOR PRODUCING P-TYPE ZnO BASED COMPOUND SEMICONDUCTOR LAYER, METHOD FOR PRODUCING ZnO BASED COMPOUND SEMICONDUCTOR ELEMENT, AND AN N-TYPE ZnO BASED COMPOUND SEMICONDUCTOR LAMINATE STRUCTURE |
| 07/03/2014 | US20140183450 CATALYST FREE SYNTHESIS OF VERTICALLY ALIGNED CNTs ON SiNW ARRAYS |
| 07/03/2014 | US20140183443 Engineered substrates having epitaxial formation structures with enhanced shear strength and associated systems and methods |
| 07/03/2014 | US20140183172 Laser crystallization system and method of manufacturing display apparatus using the same |
| 07/03/2014 | US20140182788 Apparatus for Stressing Semiconductor Substrates |
| 07/03/2014 | US20140182786 Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer |
| 07/03/2014 | US20140182776 Methods For Producing Rectangular Seeds For Ingot Growth |
| 07/03/2014 | US20140182762 Securing mechanism and method for wafer bonder |
| 07/03/2014 | US20140182761 Bonding apparatus and bonding process method |
| 07/03/2014 | US20140182689 Gas supply systems for substrate processing chambers and methods therefor |
| 07/03/2014 | US20140182636 Method and apparatus for processing wafer-shaped articles |
| 07/03/2014 | US20140182632 Substrate cleaning apparatus and substrate cleaning method |
| 07/03/2014 | US20140182631 Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system |
| 07/03/2014 | US20140182628 Substrate cleaning apparatus and substrate cleaning method |
| 07/03/2014 | US20140182626 Substrate treating method for treating substrates with treating liquids |
| 07/03/2014 | US20140182619 High dose implantation strip (hdis) in h2 base chemistry |
| 07/03/2014 | US20140182515 Substrate processing apparatus, method of manufacturing semiconductor device and vaporization system |
| 07/03/2014 | US20140182513 Hybrid screening nozzle |
| 07/03/2014 | DE112012004307T5 Halbleitervorrichtung Semiconductor device |
| 07/03/2014 | DE112012004193T5 Siliziumcarbid-Einkristallsubstrat und Polierlösung Silicon carbide single crystal substrate and polishing solution |
| 07/03/2014 | DE112012004076T5 Halbleitervorrichtung Semiconductor device |
| 07/03/2014 | DE112012003959T5 Struktur und Verfahren zum Verringern von vertikaler Rissausbreitung Structure and method for reducing the vertical crack propagation |
| 07/03/2014 | DE112012003918T5 Drahtbondwerkzeug Wire bonding tool |
| 07/03/2014 | DE112009004405B4 Filmausbildevorrichtung und Filmausbildeverfahren Film forming apparatus and film forming method |
| 07/03/2014 | DE102013227069A1 Metalloxidhalbleitereinrichtungen und herstellungsverfahren Metalloxidhalbleitereinrichtungen and manufacturing processes |
| 07/03/2014 | DE102013207829A1 Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren dafür Chip antenna, electronic component, and manufacturing method thereof |
| 07/03/2014 | DE102013114938A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 07/03/2014 | DE102013114842A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 07/03/2014 | DE102013114719A1 Organische lichtemittierende Anzeigevorrichtung An organic light emitting display device |
| 07/03/2014 | DE102013113469A1 Flip-chip-wafer-level-baueinheit und diesbezügliche verfahren Flip-chip wafer-level assembly and related methods |
| 07/03/2014 | DE102013109531A1 Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device |
| 07/03/2014 | DE102013104721A1 System und Verfahren für einen verbesserten Anschluss mit geringem Mittenabstand System and method for an improved connection with low pitch |
| 07/03/2014 | DE102013100016A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial A process for producing an electrically conductive pattern on a non-conductive carrier material, and for this purpose a particular additive and support material |
| 07/03/2014 | DE102012224537A1 Lithographieverfahren und Lithographievorrichtung für Bauteile und Schaltungen mit Strukturabmessungen im Mikro- und Nanobereich Lithography process and lithography apparatus for components and circuits with feature sizes in the micro- and nanoscale |
| 07/03/2014 | DE102012224500A1 Diffusion chamber, useful for thermal treatment of substrate of copper indium gallium selenide thin film solar cell, comprises vacuum chamber, and two half-shells arranged within vacuum chamber |
| 07/03/2014 | DE102012209512B4 Metall-Gate-Stapelbildung in Austausch-Gate-Technologie Metal gate stack formation in exchange gate technology |
| 07/03/2014 | DE102011006445B4 Halbleitermodul und Verfahren zum Herstellen desselben The same semiconductor module and method of producing |
| 07/03/2014 | DE102009059304B4 Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels Silicon chip with a cable and attached thereto Procedure for attachment of the cable |
| 07/03/2014 | DE102008050010B4 Herstellungsverfahren für eine Halbleitervorrichtung Manufacturing method of a semiconductor device |
| 07/03/2014 | DE102007001130B4 Verfahren zum Herstellen einer Durchkontaktierung in einer Schicht und Anordnung mit einer Schicht mit Durchkontaktierung A method of manufacturing a via in a layer and with a layer arrangement with through-hole plating |
| 07/03/2014 | DE102006062821B4 Verfahren zur Fertigung einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 07/03/2014 | DE102006033492B4 Halbleiterwafer-Behandlungsvorrichtung A semiconductor wafer treatment apparatus |
| 07/03/2014 | DE102006020513B4 Hochleistungs-Standard-Gerät zum flexiblen Transportieren und Handhaben verschieden großer Halbleiterbauelemente High-standard device for flexible transporting and handling of different sized semiconductor devices |
| 07/03/2014 | DE102004048529B4 Elektronisches Gerät mit Halbleiterchip, der über eine Lötmittelschicht mit einem metallischen Leiterteil flächig verbunden ist An electronic device having the semiconductor chip, which is connected via a solder layer surface with a metallic conductor portion |
| 07/02/2014 | EP2750202A1 Light receiving element, semiconductor epitaxial wafer, detecting apparatus, and light receiving element manufacturing method |
| 07/02/2014 | EP2750199A2 Semiconductor device and method for manufacturing the same |
| 07/02/2014 | EP2750198A1 SiC SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF |
| 07/02/2014 | EP2750189A1 Package on package device |
| 07/02/2014 | EP2750185A1 Improved method for manufacturing a contact structure |
| 07/02/2014 | EP2750182A1 Electronic device sealing for a downhole tool |
| 07/02/2014 | EP2750180A2 Integrated circuit including a clock tree cell |
| 07/02/2014 | EP2750179A2 Integrated circuit including a clock tree cell |
| 07/02/2014 | EP2750178A1 Organic thin-film transistor array substrate and manufacturing method thereof, and display device |
| 07/02/2014 | EP2750177A2 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane |
| 07/02/2014 | EP2750176A2 Formation of through-wafer electrical interconnections and other structures using an etch stop layer |
| 07/02/2014 | EP2750175A1 Noncontact conveyance device |
| 07/02/2014 | EP2750174A2 Bonding apparatus and bonding process method |
| 07/02/2014 | EP2750173A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| 07/02/2014 | EP2750172A1 Wiring substrate |
| 07/02/2014 | EP2750171A1 Silicon carbide semiconductor device and method for manufacturing same |
| 07/02/2014 | EP2750170A1 Method for forming spacers of a transistor gate |
| 07/02/2014 | EP2750169A2 Method for etching a porous dielectric material |
| 07/02/2014 | EP2750168A2 Anisotropic etching method |
| 07/02/2014 | EP2750167A1 Method for tuning the effective work function of a gate structure in a semiconductor device |
| 07/02/2014 | EP2750166A1 Surface treatment by chlorinated plasma in a bonding process |
| 07/02/2014 | EP2750165A1 Electron beam lithography device and lithographic method |
| 07/02/2014 | EP2750164A1 Reflective mask and method for manufacturing same |
| 07/02/2014 | EP2750162A2 Radio-frequency sputtering system with rotary target for fabricating solar cells |
| 07/02/2014 | EP2749948A1 Interference exposure device and method |
| 07/02/2014 | EP2748856A2 Semiconductor device structures including vertical transistor devices, arrays of vertical transistor devices, and methods of fabrication |
| 07/02/2014 | EP2748849A2 Wafer structure for electronic integrated circuit manufacturing |
| 07/02/2014 | EP2748848A1 Wafer structure for electronic integrated circuit manufacturing |
| 07/02/2014 | EP2748847A1 Wafer structure for electronic integrated circuit manufacturing |
| 07/02/2014 | EP2748846A1 Wafer structure for electronic integrated circuit manufacturing |