Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/02/2014CN102820252B 一种基于键合工艺的高迁移率双沟道材料的制备方法 Based on the bonding process of preparation of high-mobility channel materials Shuang'gou
07/02/2014CN102810512B 一种柔性显示器件的制造方法 A method of manufacturing a flexible display device
07/02/2014CN102770578B 成膜装置以及成膜方法 Deposition apparatus and film forming method
07/02/2014CN102738074B 半导体结构的形成方法 The method for forming a semiconductor structure
07/02/2014CN102738030B 一种pn结结深测算方法 Calculation method for deep pn junction knot
07/02/2014CN102723309B 一种阵列基板及其制造方法和显示装置 One kind of a method of manufacturing the array substrate and a display device
07/02/2014CN102693934B 互连结构的制作方法 The method of making an interconnect structure
07/02/2014CN102683318B 硅电容器内部多层电极连接结构及连接方法 Connection structure and connection method silicon multilayer electrode inside a capacitor
07/02/2014CN102683272B 一种用于45纳米及以下技术节点的金属前介质集成工艺 Metal former media integrated technology for 45nm and below technology nodes
07/02/2014CN102655117B 阵列基板及制造方法、显示装置 An array substrate and a method of manufacturing a display device
07/02/2014CN102654702B Tft阵列基板、tft阵列基板制造方法及显示装置 Tft array substrate, tft array substrate manufacturing method, and a display device
07/02/2014CN102646626B 一种导电插塞的形成方法 A conductive plug forming method
07/02/2014CN102645811B 电子纸有源基板及其制造方法和电子纸显示屏 Active electronic paper substrate and manufacturing method, and electronic paper display
07/02/2014CN102637584B 一种图形化石墨烯的转移制备方法 A graphical method for the preparation of graphene transfer
07/02/2014CN102629552B 应用于非制冷红外焦平面的硅锗薄膜平行转移方法 SiGe film transfer method is applied parallel uncooled infrared focal plane
07/02/2014CN102623505B 基于垂直双栅的抗辐照晶体管的制备方法 Preparation based anti-radiation vertical double-gate transistors
07/02/2014CN102623372B 一种湿硅片自动分片装置 A moisture-automatic wafer slicing apparatus
07/02/2014CN102605373B 使用用于去除导电材料的组合物制造阵列基板的方法 The method of using the composition for removing conductive material of the substrate producing an array of
07/02/2014CN102592974B 一种高k介质薄膜的制备方法 A high-k dielectric thin film preparation
07/02/2014CN102569392B Ldmos晶体管、布局方法和制作方法 Ldmos transistors, layout methods and production methods
07/02/2014CN102569251B 三维封装用金属间化合物填充的垂直通孔互连结构及制备方法 Three-dimensional package with vertical through-hole interconnection structure and preparation of intermetallic compounds filled
07/02/2014CN102569074B 环栅场效应晶体管的制备方法 Preparation of ring-gate field-effect transistor
07/02/2014CN102566155B Tft-lcd的阵列基板及其制造方法 Tft-lcd array substrate and manufacturing method
07/02/2014CN102543890B 一种利用应变硅技术提高sonos的擦写速度的方法 A strained silicon technology to improve sonos erase speeds Methods
07/02/2014CN102543868B 切割半导体结构的方法 Method for cutting a semiconductor structure
07/02/2014CN102543784B 一种使用镍微针锥的固态热压缩低温键合方法 A method of using a nickel cone solid microneedles low thermal compression bonding method
07/02/2014CN102522337B 一种顶栅氧化锌薄膜晶体管的制备方法 Method for preparing a top-gate zinc oxide thin film transistors
07/02/2014CN102509720B 一种有源矩阵有机发光显示器阵列基板数据线的修复方法 A method of repairing an active matrix organic light emitting display array substrate of the data line
07/02/2014CN102487013B 形成栅极的方法 Forming a gate way
07/02/2014CN102486998B 形成栅极的方法 Forming a gate way
07/02/2014CN102479814B 晶体管及其制作方法 Transistor and manufacturing method thereof
07/02/2014CN102468218B 形成双镶嵌结构的方法、半导体器件 The method of forming a dual damascene structure, a semiconductor device
07/02/2014CN102468151B 金属栅电极的制作方法 The method of making a metal gate electrode,
07/02/2014CN102459415B 含三嗪环的聚合物及包含其的成膜组合物 Triazine ring-containing polymer and the film-forming composition comprising the same
07/02/2014CN102456690B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/02/2014CN102456538B 含未钝化金属层结构的塑封器件的开封方法 No plastic device containing metal passivation layer structure of Kaifeng method
07/02/2014CN102422396B 基板处理方法和结晶性碳化硅(sic)基板的制造方法 A substrate processing method and a method of manufacturing a crystalline silicon carbide (sic) of the substrate
07/02/2014CN102420213B 具有低k材料的三维集成电路结构 A three-dimensional integrated circuit structure having a low k material
07/02/2014CN102420149B 树脂密封型半导体装置的制造方法、树脂密封型半导体装置及该半导体装置用的引线框架 The method of manufacturing a resin sealing type semiconductor device, lead frame and the resin sealing type semiconductor device of the semiconductor device in accordance with
07/02/2014CN102414820B 关于具有浮动主体的存储器单元的方法、装置及系统 Memory cell having a floating body on the method, apparatus and system for
07/02/2014CN102403302B 在基板上形成SiC结晶以实现GAN和Si电子器件集成的机理 Mechanism of the formation of crystalline SiC on Si substrates in order to achieve GAN and electronics integration
07/02/2014CN102388438B 用于处理基板的方法、用于生产半导体芯片的方法和用于生产具有树脂粘结剂层的半导体芯片的方法 The method of processing a substrate for the production of semiconductor chips and a method for producing a semiconductor chip having the adhesive resin layer is a method for
07/02/2014CN102381681B 一种微机械结构与集成电路单片集成的加工方法 A micro mechanical structure monolithically integrated with the integrated circuit processing methods
07/02/2014CN102376623B 低压下的分子粘附键合方法 Molecular adhesion bonding method under low pressure
07/02/2014CN102365724B 部件的布置方法 Layout of components
07/02/2014CN102347265B 防止存储器穿通电压降低的方法及存储器 The method for preventing punch-through voltage is decreased memory and a memory
07/02/2014CN102237332B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
07/02/2014CN102236228B 液晶显示装置及其制造方法 The liquid crystal display device and manufacturing method
07/02/2014CN102169902B 一种深槽和深注入型超结器件 One kind of ultra-deep grooves and deep injection junction devices
07/02/2014CN102163565B 芯片焊接装置 Chip welding device
07/02/2014CN102163555B 制造多成分薄膜的方法 The method of manufacturing a multi-component thin films
07/02/2014CN102157370B 清洗方法及制造电子器件的方法 The cleaning method and a method of manufacturing an electronic device
07/02/2014CN102150258B 堆叠式装置中的信号传递 Signal transmission in a stacked device
07/02/2014CN102105259B 用于构建用于薄层太阳能电池组件的基底的激光划切系统 Laser used to build the base for a thin layer of the solar cell module of dicing system
07/02/2014CN102049729B 一种研磨方法 A polishing method
07/02/2014CN102037092B 氨基酸产生剂和含有氨基酸产生剂的聚硅氧烷组合物 Amino acid-producing agent and a polysiloxane composition comprising the amino acid generating agent
07/02/2014CN102024755B Cmos图像传感器及其形成方法 Cmos image sensor and method of forming
07/02/2014CN102015050B 含有氟代烯烃的组合物和方法 The compositions and methods comprising fluoroolefin
07/02/2014CN101996479B 制造半导体装置的设备及方法 Apparatus and method for manufacturing a semiconductor device
07/02/2014CN101978489B 集成的基于氮化物和碳化硅的器件以及制造集成的基于氮化物的器件的方法 The integrated device based on nitride of a nitride and silicon carbide devices and manufacturing integrated
07/02/2014CN101930979B 控制器件阈值电压的CMOSFETs结构及其制造方法 CMOSFETs structure and manufacturing method of controlling the device threshold voltage
07/02/2014CN101930966B 电路布局结构及缩小集成电路布局的方法 Circuit layout structure and reduce the IC layout methods
07/02/2014CN101803025B 半导体装置及其制造方法、半导体设备以及计算系统 Semiconductor device and manufacturing method of a semiconductor device and a computing system
07/02/2014CN101746717B 形成碳纳米管的方法 The method of forming carbon nanotubes
07/02/2014CN101743624B 研磨用组合物 The polishing composition
07/02/2014CN101728317B 导电结构及焊盘的形成方法 Structure and method for forming a conductive pad
07/02/2014CN101527284B El显示装置的制造方法 El display device manufacturing method
07/02/2014CN101238553B 带有介电间隔环的边缘环组件 With a dielectric spacer ring edge ring assembly
07/01/2014US8767782 Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device
07/01/2014US8767454 Memory cell having nonmagnetic filament contact and methods of operating and fabricating the same
07/01/2014US8767438 Memelectronic device
07/01/2014US8767411 Electronic device with aerogel thermal isolation
07/01/2014US8767299 Embedded vertical optical grating for heterogeneous integration
07/01/2014US8767168 Immersion exposure apparatus and method that detects residual liquid on substrate held by substrate table after exposure
07/01/2014US8766734 Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same
07/01/2014US8766658 Probe
07/01/2014US8766458 Surface depressions for die-to-die interconnects and associated systems and methods
07/01/2014US8766454 Integrated circuit with self-aligned line and via
07/01/2014US8766452 Semiconductor device including conductive lines and pads
07/01/2014US8766447 Dense seed layer and method of formation
07/01/2014US8766446 Semiconductor memory device
07/01/2014US8766441 Methods and apparatus for solder on slot connections in package on package structures
07/01/2014US8766424 Thin substrate PoP structure
07/01/2014US8766417 Integrated circuit chip with reduced IR drop
07/01/2014US8766416 Semiconductor package and fabrication method thereof
07/01/2014US8766414 Deposited semiconductor structure to minimize N-type dopant diffusion and method of making
07/01/2014US8766409 Method and structure for through-silicon via (TSV) with diffused isolation well
07/01/2014US8766408 Semiconductor device and manufacturing method thereof
07/01/2014US8766406 Self-aligned implants to reduce cross-talk of imaging sensors
07/01/2014US8766404 Device design for partially oriented rutile dielectrics
07/01/2014US8766402 Inductive element with interrupter region
07/01/2014US8766398 Discrete semiconductor device and method of forming sealed trench junction termination
07/01/2014US8766393 Low-noise semiconductor photodetectors
07/01/2014US8766391 Photodetector array having array of discrete electron repulsive elements
07/01/2014US8766385 Filtering matrix structure, associated image sensor and 3D mapping device
07/01/2014US8766379 Multi-layer scavenging metal gate stack for ultra-thin interfacial dielectric layer
07/01/2014US8766377 Field effect transistor devices with dopant free channels and back gates
07/01/2014US8766375 Composite semiconductor device with active oscillation prevention
07/01/2014US8766374 One-time programmable semiconductor device
07/01/2014US8766373 Semiconductor memory and method of manufacturing the same