Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/18/2014CN103871968A Manufacturing method of MOS (metal oxide semiconductor) transistor
06/18/2014CN103871967A Forming method of CMOS (complementary metal oxide semiconductor) transistor
06/18/2014CN103871966A Method for restraining fluorosilicone glass crystal defects
06/18/2014CN103871965A Method for forming stepped contact holes
06/18/2014CN103871964A Interconnecting wire structure and forming method thereof
06/18/2014CN103871963A Filming method of low-dielectric-constant film
06/18/2014CN103871962A Interconnection structure and manufacturing method for same
06/18/2014CN103871961A Interconnection structure and manufacturing method for same
06/18/2014CN103871960A Copper etching method
06/18/2014CN103871959A Interconnection structure and manufacturing method for same
06/18/2014CN103871958A Manufacturing method of semiconductor device
06/18/2014CN103871957A Conductive interconnection method
06/18/2014CN103871956A Silicon deep via etching method
06/18/2014CN103871955A Method for controlling thickness of gate dielectric equivalent oxide layer
06/18/2014CN103871954A Method for optimizing shallow-trench isolation etching line width
06/18/2014CN103871953A Shallow groove filling method
06/18/2014CN103871952A Method of Manufacturing a Semiconductor Device and a Semiconductor Workpiece
06/18/2014CN103871951A Channel filling method
06/18/2014CN103871950A Shallow trench isolation structure and manufacturing method thereof
06/18/2014CN103871949A DFM (design for manufacturability) method for territory
06/18/2014CN103871948A Double-row straight insertion tube shell fixture
06/18/2014CN103871947A Clamping device and plasma processing device
06/18/2014CN103871946A Mini-sized target substrate-based large-area graphene transfer support frame and method
06/18/2014CN103871945A Device for peeling substrate, method for peeling substrate and method for producing electronic device
06/18/2014CN103871944A Wafer machining method
06/18/2014CN103871943A Electrostatic adsorption device
06/18/2014CN103871942A High-temperature-resistant rubber suction nozzle
06/18/2014CN103871941A Intermittent linear conveying device
06/18/2014CN103871940A Oxidizing furnace insulation bucket for semiconductor manufacturing and oxidizing method
06/18/2014CN103871939A Sorting method used for patterned sapphire substrate production
06/18/2014CN103871938A Rinse tank for rinsing semiconductor wafer
06/18/2014CN103871937A Overflow groove structure for cleaning silicon wafer
06/18/2014CN103871936A Device for separating top electrode and cooling disk
06/18/2014CN103871935A Chip back gluing and packaging device
06/18/2014CN103871934A Method for monitoring conditions of equipment machine table
06/18/2014CN103871933A Parameter monitoring method
06/18/2014CN103871932A Light resistance reinforcement equipment and particulate pollutant eliminating method
06/18/2014CN103871931A Cutting device and cutting method
06/18/2014CN103871930A Semiconductor manufacturing apparatus having control function of powder generation
06/18/2014CN103871929A Method and apparatus for processing wafer-shaped articles
06/18/2014CN103871928A Semiconductor device and heater thereof
06/18/2014CN103871927A Structure of vertical diffusion oxidation furnace quartz process pipe
06/18/2014CN103871926A Device and operating method for preventing silicon wafer from offset and cracking in cavity transporting process
06/18/2014CN103871925A Method for detecting influence of source-drain ion implantation on dislocation defect
06/18/2014CN103871924A Test structure and method for monitoring electricity leakage of grid electrode
06/18/2014CN103871923A Structure for monitoring IPD substrate resistance value
06/18/2014CN103871922A Method for detecting polycrystalline silicon grid etching defect by adopting voltage contrast test structure
06/18/2014CN103871921A Wafer defect monitoring analysis method based on server
06/18/2014CN103871920A Inspection method and inspection fixture for scribing lines of wafer
06/18/2014CN103871919A Solar energy silicon chip and cell sheet defect detection system
06/18/2014CN103871918A Method for defect locating in wafer
06/18/2014CN103871917A Method for preparing semiconductor failure analysis sample
06/18/2014CN103871916A Method for bonding semiconductor substrates and devices obtained thereby
06/18/2014CN103871915A Manual BGA ball mounting machine
06/18/2014CN103871914A Method of Fabricating a Layer Stack
06/18/2014CN103871913A Recessed discrete component mounting on organic substrate
06/18/2014CN103871912A Semiconductor manufacturing process and structure thereof
06/18/2014CN103871911A Method for processing device wafer
06/18/2014CN103871910A Glue coating crystal solidifying equipment
06/18/2014CN103871909A A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
06/18/2014CN103871908A Method for encapsulating copper pillar bump
06/18/2014CN103871907A Manufacturing technology of ultra-thin substrate
06/18/2014CN103871906A Electrical interconnect formed through buildup process
06/18/2014CN103871905A Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (wlp) packages
06/18/2014CN103871904A Method of Forming Substrate
06/18/2014CN103871903A Transistor and manufacturing method thereof
06/18/2014CN103871902A Semiconductor treatment technology and semiconductor device preparation method
06/18/2014CN103871901A Groove power device and manufacturing method thereof
06/18/2014CN103871900A Groove field effect transistor and forming method thereof
06/18/2014CN103871899A Preparation method of FinFET (fin-field effect transistor) structure
06/18/2014CN103871898A High-voltage transistor preparation technology
06/18/2014CN103871897A Chemical mechanical grinding method applied to FinFET (fin field-effect transistor) structure
06/18/2014CN103871896A Semiconductor structure and manufacturing method
06/18/2014CN103871895A Method for fabricating a field effect transistor device
06/18/2014CN103871894A Semiconductor device and forming method thereof
06/18/2014CN103871893A BULK FIN FET WITH SUPER STEEP RETROGRADE WELL and manufacturing method of same
06/18/2014CN103871892A Method for fabricating trench type transistor
06/18/2014CN103871891A Thin film transistor (TFT) growing process
06/18/2014CN103871890A MOS (metal oxide semiconductor) transistor and forming method thereof
06/18/2014CN103871889A PMOS (P-channel metal oxide semiconductor) transistor and forming method thereof
06/18/2014CN103871888A Semiconductor device and forming method thereof
06/18/2014CN103871887A PMOS (P-channel metal oxide semiconductor) transistor, NMOS (N-channel metal oxide semiconductor) transistor and respective manufacturing methods thereof
06/18/2014CN103871886A Forming method for transistor
06/18/2014CN103871885A Method for making fin field effect transistors
06/18/2014CN103871884A Method for making fin field effect transistors
06/18/2014CN103871883A \Manufacturing method of high-frequency horizontal double-diffusion structure semiconductor device
06/18/2014CN103871882A Semiconductor device and manufacturing method thereof
06/18/2014CN103871881A Groove of P type LDMOS device and manufacture method of groove
06/18/2014CN103871880A Shallow slot isolation structure manufacturing method
06/18/2014CN103871879A Transistor structure and forming method thereof
06/18/2014CN103871878A Method for forming thick-field oxygen below IGBT tube grid
06/18/2014CN103871877A Insulated gate bipolar transistor and manufacturing method thereof
06/18/2014CN103871876A Method for preparing reverse conducting IGBT
06/18/2014CN103871875A Manufacturing method and structure of low-temperature-coefficient silicon voltage reference diode
06/18/2014CN103871874A Manufacturing method and structure of high-power silicon transient voltage suppressor diode
06/18/2014CN103871873A Radiation-proof strengthening method for bipolar device based on geometric structure of emitter region
06/18/2014CN103871872A Fixing method for silicon slice thermal treatment constant-temperature region
06/18/2014CN103871871A Method for removing metallic purities of silicon chip
06/18/2014CN103871870A Method for removing wafer bonding edge defect
06/18/2014CN103871869A Non-photosensitive polyimide passivation layer manufacturing method
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