Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/25/2014CN103887183A 金/硅共晶芯片焊接方法及晶体管 Gold / silicon eutectic die bonding method and transistors
06/25/2014CN103887182A 引线框架加工方法 Lead frame processing method
06/25/2014CN103887181A 引线框架加工方法 Lead frame processing method
06/25/2014CN103887180A 引线框架加工方法 Lead frame processing method
06/25/2014CN103887179A 引线框架加工方法 Lead frame processing method
06/25/2014CN103887178A 一种应变垂直mos器件的制造方法 A method of manufacturing a vertical strain mos device
06/25/2014CN103887177A 鳍式有源区的制备方法 Preparation fin active region
06/25/2014CN103887176A 一种降低源漏外延生长缺陷的方法 A source-drain epitaxial growth method for reducing defects
06/25/2014CN103887175A 带有自对准有源接触的基于高密度沟槽的功率mosfet及其制备方法 Active self-aligned contact trench-based high-density power mosfet with its preparation method
06/25/2014CN103887174A 用于负载开关和直流-直流器件的高密度mosfet的器件结构及其制备方法 For load switching and DC - DC devices, high-density mosfet device structure and preparation method
06/25/2014CN103887173A 利用耗尽p-屏蔽的低输出电容的高频开关mosfet The use of depleted p- shielded low output capacitance of high frequency switching mosfet
06/25/2014CN103887172A 全衬底隔离finfet晶体管 Full transistor substrate isolation finfet
06/25/2014CN103887171A 一种基于第二钝化层钝化方式的双极器件抗辐照加固方法 A bipolar device the way the second passivation layer passivation method based on radiation hardened
06/25/2014CN103887170A 半导体装置的制造方法及半导体装置 The method of manufacturing a semiconductor device and a semiconductor device
06/25/2014CN103887169A 一种具有提高抗浪涌电流能力的半导体装置的制备方法 A process for improving the anti-surge current capability of the semiconductor device having
06/25/2014CN103887168A 萧特基整流元件的制造方法及形成方法 Schottky Rectifier manufacturing method and a method of forming elements
06/25/2014CN103887167A 一种半导体芯片台面的钝化方法 A semiconductor chip passivation process mesa
06/25/2014CN103887166A 一种氧化物替代式图形衬底的制备方法 Alternative Preparation of an oxide substrate graphics
06/25/2014CN103887165A 一种膜层的干法刻蚀方法 One kind of layer dry etching method
06/25/2014CN103887164A 一种深硅刻蚀方法 A dark silicon etching method
06/25/2014CN103887163A 用于SiC基MOS器件栅介质薄膜的制备方法 Preparation of SiC-based MOS devices for gate dielectric film
06/25/2014CN103887162A 一种高介电SiON栅介质的制备方法 A method for preparing high dielectric SiON gate dielectric
06/25/2014CN103887161A 一种抑制掺杂原子在栅介质中扩散的方法 A method of doping atoms in the gate dielectric diffusion suppression
06/25/2014CN103887160A 控制栅极刻蚀方法 Control gate etching method
06/25/2014CN103887159A 一种对晶圆表面金属进行钝化及合金化处理的方法 A wafer and method for passivating a metal surface alloying treatment
06/25/2014CN103887158A 一种钛硅化合物的非原位制程方法 Non-situ process method of titanium silicon compound
06/25/2014CN103887157A 光学掩膜板和激光剥离装置 Optical mask and laser peeling device
06/25/2014CN103887156A 高裸芯片强度的半导体晶圆加工方法和系统 High strength die method and system for semiconductor wafer processing
06/25/2014CN103887155A 一种基于基区离子注入方式的双极型器件抗位移辐照加固方法 Based on ion implantation base bipolar devices Radiation Hardened anti-displacement method
06/25/2014CN103887154A 一种基于钝化层离子注入方式的双极型器件的抗电离辐照加固方法 Anti-ionizing radiation a passivation layer injection method based on ion bipolar devices reinforcement methods
06/25/2014CN103887153A 一种Al-Ga复合扩散掺杂方法 One kind of Al-Ga composite diffusion doping methods
06/25/2014CN103887152A 一种半导体中异价金属离子掺杂的方法 A semiconductor iso-valent metal ion doping method
06/25/2014CN103887151A 一种构图装置和构图方法 One kind of patterning devices and patterning method
06/25/2014CN103887150A 一种测试样品的制备方法 A method of preparing a test sample
06/25/2014CN103887149A 一种降低镍管道缺陷的方法 A method of reducing nickel pipeline defects methods
06/25/2014CN103887148A 去除金属硬掩膜的方法和组合物 Removing the metal hard mask, the methods and compositions
06/25/2014CN103887147A 用于多晶硅化学机械研磨制程中缺陷检测晶圆的制作方法 Chemical mechanical polishing the polysilicon production method of a wafer defect inspection process for the
06/25/2014CN103887146A 利用可切换功率发生器的高深宽比微结构刻蚀方法 Switchable power generator utilizing high aspect ratio etching microstructures
06/25/2014CN103887138A 一种刻蚀设备的边缘环 A ring edge etching equipment
06/25/2014CN103887137A 反应腔室及具有其的等离子体设备 The reaction chamber of the plasma equipment, and has its
06/25/2014CN103887136A 一种适用于金属干法刻蚀半导体设备的刻蚀腔室 A suitable metal etch chamber dry etching of semiconductor devices
06/25/2014CN103887135A 离子注入系统 Ion implantation system
06/25/2014CN103886933A 包含固化膜和导电膜的可分离的各向异性导电膜 Comprising the cured film and the conductive film of the anisotropic conductive film of the separable
06/25/2014CN103885428A 离线机台利用率计算系统及计算方法 Offline computing systems and machine utilization calculation method
06/25/2014CN103885423A 一种晶圆级电性测试统计过程控制系统及方法 One kind of wafer-level electrical testing statistical process control system and method
06/25/2014CN103885262A Tft-lcd阵列基板及其数据线断线的修复方法 Fix Tft-lcd array substrate and data lines disconnected
06/25/2014CN103885261A 像素结构、阵列基板、显示装置及像素结构的制造方法 Pixel structure, the array substrate, a display device manufacturing method and the pixel structure
06/25/2014CN103885259A 阵列基板及其制造方法、显示面板 The method of manufacturing the array substrate and a display panel
06/25/2014CN103885231A 显示面板标记装置和显示面板标记方法 The display panel marking device and the display panel labeling methods
06/25/2014CN103882411A 成膜方法 Film forming method
06/25/2014CN103882408A 成膜方法 Film forming method
06/25/2014CN103882400A Tft基板的防静电方法 Anti-static method Tft board
06/25/2014CN103881837A 半导体工业清洗剂及其应用 Cleaning agent and its application in the semiconductor industry
06/25/2014CN103880001A 一种图形化石墨烯的制备方法 Preparation method of patterned graphene
06/25/2014CN103879927A 一种硅片周转叉车限位机构 Turnover silicon wafers truck stop mechanism
06/25/2014CN103878141A 半导体晶圆清洗装置 The semiconductor wafer cleaning device
06/25/2014CN102842564B 集成开关电源的倒装封装装置及其倒装封装方法 Flip-flip-packaged device and method of packaging an integrated switching power supply
06/25/2014CN102840425B 支撑脚装置 Support leg means
06/25/2014CN102814359B 集成芯片引线框架校平装置 Integrated chip lead frame leveling device
06/25/2014CN102768990B 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing a display device
06/25/2014CN102768017B 线宽量测装置及其方法 Linewidth measurement apparatus and method
06/25/2014CN102709237B 薄膜场效应晶体管阵列基板及其制造方法、电子器件 Thin-film transistor array substrate and a manufacturing method of an electronic device
06/25/2014CN102664148B 湿法腐蚀NiCrSi膜的方法 NiCrSi film wet etching method
06/25/2014CN102646584B 工件分割装置及工件分割方法 Apparatus and workpiece workpiece segmentation Segmentation
06/25/2014CN102640021B Euv光刻用光学构件及带反射层的euv光刻用衬底的制造方法 Euv lithography method for producing an optical member and euv lithography with a reflective layer of the substrate
06/25/2014CN102610564B Tft阵列基板的制作方法 The method of manufacturing an array substrate Tft
06/25/2014CN102610491B 基板处理方法及基板处理装置 Substrate processing method and substrate processing apparatus
06/25/2014CN102576690B 半导体装置 Semiconductor device
06/25/2014CN102574390B 使用热辊压印和有图案的板的印刷装置，用于微流体传感器的膜层压装置，以及使用该装置的印刷方法 Using a hot embossing roll and a plate having a pattern printing device for pressing means of the microfluidic sensor film, and a printing method using the apparatus
06/25/2014CN102569272B 一种基板的多层隔片式ic芯片堆叠封装件及其生产方法 A multilayer board spacer type ic chip stack package and its production method
06/25/2014CN102569088B 半导体器件结构和制作该半导体器件结构的方法 The semiconductor device structure and a method of making the semiconductor device structure
06/25/2014CN102556604B 集成电路测试封装翻转送料装置 IC packaging and testing flip feeding device
06/25/2014CN102544040B 利用TSV技术实现GaAs图像传感器的圆片级封装方法 TSV wafer level packaging method uses image sensor technology for GaAs
06/25/2014CN102543825B 半导体沟渠与双沟渠的制造方法及用以隔离元件的结构 Semiconductor manufacturing method and double ditches and canals to isolate elements of structure
06/25/2014CN102522351B 配置横贯堆叠半导体装置的合并垂直信号路径的方法 Stacked configuration of the semiconductor device across the vertical signal paths combined method
06/25/2014CN102509713B 用于湿法腐蚀及清洗工艺的兆声波换能装置 Megasonic wet etching and cleaning processes for transducer device
06/25/2014CN102489876B 一种采用激光辅助加热的激光退火方法及装置 A laser annealing method and apparatus using laser-assisted heating
06/25/2014CN102477585B 电浆蚀刻设备、晶圆治具及设置晶圆的方法 Plasma etching equipment, wafer fixture and method for setting the wafer
06/25/2014CN102471465B 高分子化合物及其制造方法 The polymer compound and a method of manufacturing
06/25/2014CN102468165B 晶体管及其制造方法 Transistor and its manufacturing method
06/25/2014CN102468155B 等离子体处理装置 The plasma processing apparatus
06/25/2014CN102456549B 磷化铟晶片及其表面清洗方法 InP wafer and surface cleaning method
06/25/2014CN102446811B 金属互连结构及金属层间通孔和互连金属线的形成方法 Between the metal interconnect structure and method of forming the metal layer vias and interconnect metal lines
06/25/2014CN102414806B 管芯连接监控系统及方法 Die attach monitoring system and method
06/25/2014CN102411239B 液晶显示装置及其制造方法 The liquid crystal display device and manufacturing method
06/25/2014CN102386109B 一种igbt的组装工艺流程 One kind igbt assembly process
06/25/2014CN102386088B 用于去除半导体器件结构上的光致抗蚀剂层的方法 Method for removing a photoresist layer on a semiconductor device structure
06/25/2014CN102356700B 固定嵌入部、电极组件和等离子处理室 Fixing the fitting portion, the electrode assembly and the plasma processing chamber
06/25/2014CN102326248B 电容器制造方法、电容器制造装置 The method of manufacturing a capacitor, the capacitor manufacturing apparatus
06/25/2014CN102292466B 利用cvd 涂覆基板的器件和方法 The use of devices and methods cvd coated substrate
06/25/2014CN102270585B 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board
06/25/2014CN102262324B 阵列基板及其制造方法、液晶面板和液晶显示器 The method of manufacturing the array substrate and the liquid crystal panel and a liquid crystal display
06/25/2014CN102217043B 在加速/减速系统中降低电应力的技术 Reduce electrical stress during acceleration / deceleration system technology
06/25/2014CN102210196B 用于等离子腔室部件的抗等离子涂层 And other anti-plasma chamber for plasma coating member
06/25/2014CN102197005B 玻璃基板层叠装置及层叠玻璃基板的制造方法 The method of manufacturing a glass substrate lamination device and a laminated glass substrate
06/25/2014CN102190156B 托盘式基板输送系统、成膜方法和电子装置的制造方法 The method of manufacturing a substrate transport system tray, the film forming method, and an electronic device
06/25/2014CN102187453B 用硬掩模及两次曝光形成半导体元件的接触及导通孔 Contact vias and forming a semiconductor device with a hard mask and the two exposures
06/25/2014CN102184970B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/25/2014CN102171788B 利用混合激光投影构图(lpp)和半加成构图(sap)的同层微电子电路构图 The use of hybrid laser projection patterning (lpp) and semi-additive patterning (sap) in the same layer patterning of microelectronic circuits
06/25/2014CN102163594B 树脂密封型电子控制装置及其制造方法 Apparatus and method for manufacturing a resin sealed type electronic control
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