Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/24/2014US8759200 Methods and apparatus for selective epitaxy of Si-containing materials and substitutionally doped crystalline Si-containing material
06/24/2014US8759199 Method of selectively growing semiconductor carbon nanotubes using light irradiation
06/24/2014US8759198 Accelerated furnace ramp rates for reduced slip
06/24/2014US8759197 Multi-step and asymmetrically shaped laser beam scribing
06/24/2014US8759196 Method for preparing a substrate by implantation and irradiation
06/24/2014US8759195 Optical device wafer processing method
06/24/2014US8759194 Device structures compatible with fin-type field-effect transistor technologies
06/24/2014US8759193 Method of fabricating semiconductor device
06/24/2014US8759192 Semiconductor device having wiring and capacitor made by damascene method and its manufacture
06/24/2014US8759191 Tunable semiconductor component provided with a current barrier
06/24/2014US8759190 Current steering element and non-volatile memory element incorporating current steering element
06/24/2014US8759189 Reprocessing method of a semiconductor device
06/24/2014US8759188 Radiation hardened bipolar injunction transistor
06/24/2014US8759187 Method of manufacturing silicon carbide semiconductor device
06/24/2014US8759185 Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same
06/24/2014US8759184 FinFETs and the methods for forming the same
06/24/2014US8759183 Methods of forming semiconductor devices using electrolyzed sulfuric acid (ESA)
06/24/2014US8759182 Manufacturing method for semiconductor device
06/24/2014US8759181 Methods for reduced gate resistance FINFET
06/24/2014US8759180 Methods for fabricating step gate electrode structures for field-effect transistors
06/24/2014US8759179 Method of forming gate pattern and semiconductor device
06/24/2014US8759178 Method for manufacturing semiconductor device and semiconductor device
06/24/2014US8759177 Pattern forming method
06/24/2014US8759176 Patterning of submicron pillars in a memory array
06/24/2014US8759175 Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof
06/24/2014US8759174 Selective removal of a silicon oxide layer
06/24/2014US8759173 Finlike structures and methods of making same
06/24/2014US8759172 Etch stop layer formation in metal gate process
06/24/2014US8759171 Field controlled diode with positively biased gate
06/24/2014US8759170 Hafnium tantalum oxynitride dielectric
06/24/2014US8759169 Method for producing silicon semiconductor wafers comprising a layer for integrating III-V semiconductor components
06/24/2014US8759168 MOSFET with thin semiconductor channel and embedded stressor with enhanced junction isolation and method of fabrication
06/24/2014US8759166 Method for manufacturing thin film transistor device
06/24/2014US8759165 Manufacturing method of array substrate
06/24/2014US8759164 Method for manufacturing integral imaging device
06/24/2014US8759163 Layout of a MOS array edge with density gradient smoothing
06/24/2014US8759162 Nonvolatile semiconductor memory device and method of manufacturing the same
06/24/2014US8759161 Surface coating method, semiconductor device, and circuit board package
06/24/2014US8759159 Integrated circuit packaging system with electrical interface and method of manufacture thereof
06/24/2014US8759158 Assembly jig for a semiconductor device and assembly method for a semiconductor device
06/24/2014US8759157 Heat dissipation methods and structures for semiconductor device
06/24/2014US8759156 Method of producing laminated device
06/24/2014US8759154 TCE compensation for package substrates for reduced die warpage assembly
06/24/2014US8759153 Method for making a sensor device using a graphene layer
06/24/2014US8759152 Configurable interposer
06/24/2014US8759151 Fixture to constrain laminate and method of assembly
06/24/2014US8759150 Approach for bonding dies onto interposers
06/24/2014US8759149 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
06/24/2014US8759148 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
06/24/2014US8759147 Semiconductor packages and methods of fabricating the same
06/24/2014US8759146 Methods of forming germanium-antimony-tellurium materials and methods of forming a semiconductor device structure including the same
06/24/2014US8759144 Fabrication of contacts for silicon solar cells including printing burn through layers
06/24/2014US8759143 Semiconductor constructions, memory arrays, methods of forming semiconductor constructions and methods of forming memory arrays
06/24/2014US8759142 Method for producing thin-film light-absorbing layer and method for manufacturing thin-film solar cell including the same
06/24/2014US8759141 Backside depletion for backside illuminated image sensors
06/24/2014US8759137 Methods of fabricating CMOS image sensors
06/24/2014US8759135 Method of manufacturing camera module by breaking insulating film
06/24/2014US8759133 Back panel for flat panel display apparatus, flat panel display apparatus comprising the same, and method of manufacturing the back panel
06/24/2014US8759132 Method for manufacturing semiconductor device
06/24/2014US8759131 Light-emitting device and method for manufacturing light-emitting device
06/24/2014US8759130 Method for making light emitting diode
06/24/2014US8759129 Method of making diode having reflective layer
06/24/2014US8759128 Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabrication
06/24/2014US8759127 Gold micromask for roughening to promote light extraction in an LED
06/24/2014US8759126 Image display device and the method for manufacturing the same
06/24/2014US8759125 Light-emitting dies incorporating wavelength-conversion materials and related methods
06/24/2014US8759123 Method of manufacturing LED lamp
06/24/2014US8759122 Method for manufacturing light emitting chip
06/24/2014US8759120 Silicon solar cell
06/24/2014US8759119 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
06/24/2014US8759118 Plating process and structure
06/24/2014US8759117 Method of fabricating array substrate for organic electroluminescent device and method of repairing the same
06/24/2014US8758984 Method of forming gate conductor structures
06/24/2014US8758864 Photosensitive semiconductor nanocrystals, photosensitive composition comprising semiconductor nanocrystals and method for forming semiconductor nanocrystal pattern using the same
06/24/2014US8758848 Method for applying liquid material, device therefor, and program therefor
06/24/2014US8758638 Copper oxide removal techniques
06/24/2014US8758636 Method for producing a medical functional element comprising a selfsupporting lattice structure
06/24/2014US8758581 Combinatorial process system
06/24/2014US8758551 Substrate processing apparatus and electrode structure
06/24/2014US8758550 Shower head and plasma processing apparatus having same
06/24/2014US8758546 Buffer film for multi-chip packaging
06/24/2014US8758514 Cluster type semiconductor processing apparatus
06/24/2014US8757962 System and method for adjusting a shroud block in a casing
06/24/2014US8757250 Advanced thermal control interface
06/24/2014US8757180 Substrate processing apparatus
06/24/2014US8757178 Method and apparatus for removing photoresist
06/24/2014US8757177 Multi-stage substrate cleaning method and apparatus
06/24/2014US8756996 Micromechanical system
06/24/2014US8756799 Substrate accommodating tray pallet
06/19/2014WO2014093967A1 Thermal processing utilizing independently controlled reactant vapor pressures and/or indirect cooling
06/19/2014WO2014093938A1 Fabrication of three-dimensional high surface area electrodes
06/19/2014WO2014093891A1 Methods for achieving metal fill in small features
06/19/2014WO2014093644A1 Use disposable gate cap to form transistors, and split gate charge trapping memory cells
06/19/2014WO2014093555A1 Reducing leakage current in semiconductor devices
06/19/2014WO2014093536A1 Improved ion implant for defect control
06/19/2014WO2014093532A1 Method of reducing contact resistance
06/19/2014WO2014093527A1 Transfer chamber and method of using transfer chamber
06/19/2014WO2014093501A1 Mask alignment system for semiconductor processing
06/19/2014WO2014093355A1 Optical component with blocking surface and method thereof
06/19/2014WO2014093309A1 Substrate support assembly having metal bonded protective layer