Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/25/2014CN103887331A 高压igbt器件的vld终端及其制备方法 Vld high-voltage terminal and its preparation method igbt devices
06/25/2014CN103887330A 一种基于发射极电极接触方式的抗辐照双极器件及该双极器件的制备方法 A method of preparing an emitter electrode contact method based anti-radiation bipolar device and the bipolar device
06/25/2014CN103887328A 薄膜晶体管阵列基板、液晶显示装置及制造方法 Apparatus and a method of manufacturing a thin film transistor array substrate, a liquid crystal display
06/25/2014CN103887326A 高电阻低位错GaN薄膜及制备方法 High resistance and low dislocation GaN film preparation
06/25/2014CN103887325A 一种提高器件耐压能力的半导体装置及其制备方法 A breakdown voltage semiconductor device and its ability to improve the preparation method
06/25/2014CN103887322A 有机发光显示装置及其制造方法 The organic light emitting display device and manufacturing method thereof
06/25/2014CN103887315A 柔性显示装置及其制造方法 Method of manufacturing a flexible display device and
06/25/2014CN103887314A 柔性显示器及其制造方法 Method of manufacturing a flexible display and
06/25/2014CN103887313A 一种半浮栅器件及其制备方法 A semi-floating gate device and its preparation method
06/25/2014CN103887311A 非易失性存储器件及其制造方法 Non-volatile memory device and manufacturing method thereof
06/25/2014CN103887310A 非挥发性记忆体及其制作方法 Non-volatile memory and its production method
06/25/2014CN103887309A 半导体器件、制造半导体器件的方法、电源及高频放大器 A semiconductor device, a method of manufacturing a semiconductor device, and high frequency power amplifier
06/25/2014CN103887308A 集成肖特基二极管的超势垒整流器及其制备方法 Integrated Schottky barrier rectifier diode ultra its preparation method
06/25/2014CN103887302A 用于集成电路的静电放电器件 The electrostatic discharge device for an integrated circuit
06/25/2014CN103887292A 堆叠式双芯片封装结构及其制备方法 Stacked dual-chip package structure and preparation method
06/25/2014CN103887291A 三维扇出型PoP封装结构及制造工艺 Three fan-out PoP package structure and manufacturing process
06/25/2014CN103887290A 具有接合中介层的集成电路器件 Joining the interposer having an integrated circuit device
06/25/2014CN103887289A 高密度互连器件及方法 High density interconnect devices and methods
06/25/2014CN103887287A 半导体装置和半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
06/25/2014CN103887283A 多晶硅残留监测结构 Polysilicon residue monitoring structure
06/25/2014CN103887281A 改善嵌入式管芯封装中管芯背膜上激光标记对比度的方法 Improvement in the embedded die package die backing film contrast laser marking method
06/25/2014CN103887279A 三维扇出型晶圆级封装结构及制造工艺 Three fan-out wafer level packaging structure and manufacturing process
06/25/2014CN103887278A 封装和电介质或各向异性导电（acf）构造层 Packaging and dielectric or anisotropic conductive (acf) structural layer
06/25/2014CN103887277A 封装结构及其组装方法 Package structure and method of assembly
06/25/2014CN103887276A 防止凸点侧向刻蚀的凸点结构及成型方法 Bump bump structure to prevent lateral etching and molding method
06/25/2014CN103887275A 使用柔性基板实现三维层间垂直互连的结构及其制造方法 Use a flexible substrate to achieve vertical interconnects between three layers of structure and manufacturing method
06/25/2014CN103887272A 电子模块以及其制造方法 And a manufacturing method of the electronic module
06/25/2014CN103887265A 具有印刷电路层的集成电路封装及其制作方法 IC package and method of making a printed circuit layers
06/25/2014CN103887264A 预空间变换器、空间变换器、以及半导体装置检查设备 Pre space transformer, the space transformer, and a semiconductor device inspecting apparatus
06/25/2014CN103887263A 封装结构及其制作方法 Package structure and production methods
06/25/2014CN103887262A 堆叠式封装件与其制造方法 Stacked package and its manufacturing method
06/25/2014CN103887261A 一种柔性显示器及其制备方法 A flexible display its preparation method
06/25/2014CN103887260A 芯片接合结构及其制作方法 Chip bonding structure and production methods
06/25/2014CN103887259A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
06/25/2014CN103887251A 扇出型晶圆级封装结构及制造工艺 Fan-out wafer level package structure and manufacturing process
06/25/2014CN103887249A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/25/2014CN103887248A 一种igbt结构及其制备方法 One kind of structure and preparation method igbt
06/25/2014CN103887247A 功率模块封装件 Power Module package
06/25/2014CN103887245A 一种阵列基板的制造方法 A method of manufacturing an array substrate
06/25/2014CN103887244A 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, a display device
06/25/2014CN103887243A 利用简化的一次顶部接触沟槽刻蚀制备mosfet与肖特基二极管集成的方法 Using a simplified top contact trench etch the Schottky diode integrated mosfet Preparation Method
06/25/2014CN103887242A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method
06/25/2014CN103887241A 一种适用于锗基阱的制备方法 One for the preparation of a germanium-well
06/25/2014CN103887240A 一种逆导型igbt器件的制备方法 Preparation method of inverse conductivity type igbt devices
06/25/2014CN103887239A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and a method of manufacturing
06/25/2014CN103887238A 一种完成bga封装之后的晶圆的切割分粒方法 Cutting method for classifying the wafer after the completion of the package bga
06/25/2014CN103887237A 一种阵列基板及其制备方法、有机电致发光显示装置 One kind of array substrate and its preparation method, an organic electroluminescent display device
06/25/2014CN103887236A 阵列基板及其制造方法、显示装置 Array substrate and a method of manufacturing a display device
06/25/2014CN103887235A 一种阵列基板及其制造方法、显示装置 One kind of a method of manufacturing the array substrate, a display device
06/25/2014CN103887234A 一种tft阵列基板及其制造方法 One kind of a method of manufacturing the array substrate tft
06/25/2014CN103887233A 集成电路用低介电常数薄膜层的制备工艺 Integrated process for preparing a low dielectric constant film layer
06/25/2014CN103887232A 改善tsv金属填充均匀性的方法 Improve the uniformity of tsv metal filling method
06/25/2014CN103887231A 用于tsv背面漏孔及介质层与tsv的自对准工艺 For tsv back of the leak and the self-aligned process of dielectric layers and tsv
06/25/2014CN103887230A 等离子体刻蚀AlSi的方法 Plasma etching method AlSi
06/25/2014CN103887229A 一种改善厚栅氧化物形貌的方法 A method of improving the appearance of a thick gate oxide
06/25/2014CN103887228A 金属与n型锗接触的制备方法与应用 Preparation of metal in contact with the n-type germanium and Applications
06/25/2014CN103887227A 通过热处理和/或溶剂处理恢复多孔电介质k值 Recovery of the porous dielectric by heat treatment the value of k and / or a solvent treatment
06/25/2014CN103887226A 晶圆堆叠结构及其制作方法与晶圆的制作方法 Wafer stack structure and method of making and wafer fabrication method
06/25/2014CN103887225A 基于铝合金引线框架的半导体器件及制备方法 Based on a semiconductor device and a method for preparing an aluminum alloy lead frame
06/25/2014CN103887224A 一种形成浅沟槽隔离的方法 A method of forming a shallow trench isolation
06/25/2014CN103887223A 降低炉管工艺金属污染的方法 Reduce metal contamination process furnace tube method
06/25/2014CN103887222A 一种利用弹簧张紧和电机驱动的力反馈晶圆夹持装置 A use of spring tension and motor-driven force feedback wafer clamping device
06/25/2014CN103887221A 一种晶片升降销装置 A wafer lift pins device
06/25/2014CN103887220A 一种设有过载传感器的晶片机械手 One kind with overload sensor wafer robot
06/25/2014CN103887219A 自对准拾取头和用于利用自对准拾取头制造装置的方法 Pickup head and use self-alignment pickup head apparatus for producing self-aligned method for
06/25/2014CN103887218A 一种GaN基白光倒装芯片的制备方法 A process for producing GaN-based white flip chip
06/25/2014CN103887217A 形成膜层图案的方法 The method of forming a patterned film
06/25/2014CN103887216A 一种设有安全挡板的oht系统 One kind of a safety system baffles oht
06/25/2014CN103887215A 用于解决干法蚀刻边缘效应的盖板及其制备方法 Cover and preparation method for solving the dry etching edge effects
06/25/2014CN103887214A 一种用于半导体刻蚀设备的温度控制系统及方法 A temperature control apparatus for a semiconductor etching system and method
06/25/2014CN103887213A 一种调整检测频率的缺陷检测方法 A method for adjusting the frequency of the defect detection method for detecting
06/25/2014CN103887212A 全自动太阳能硅片清洗机 Automatic solar wafer cleaning machine
06/25/2014CN103887211A 一种干燥区间排气门的控制方法和装置及干燥区间设备 A method and apparatus for controlling the exhaust valve and the drying section drying section apparatus
06/25/2014CN103887210A 基板位置检测装置、基板处理装置和成膜装置 A substrate position detection apparatus, the substrate processing apparatus and a film forming apparatus
06/25/2014CN103887209A 液处理装置和液处理方法 Liquid processing apparatus and liquid processing method
06/25/2014CN103887208A 一种防止晶片碎裂的检测装置 A detection device to prevent chipping of the wafer
06/25/2014CN103887207A 防止晶圆重叠的清洗槽出货机构及其出货方法 Cleaning tank to prevent shipping agencies and shipping methods wafer overlap
06/25/2014CN103887206A 化学机械平坦化终点检测方法及装置 Chemical mechanical planarization endpoint detection method and device
06/25/2014CN103887205A 位错缺陷的检测方法及其应用 Dislocation defect detection method and its application
06/25/2014CN103887204A 一种与激光退火工艺问题相关的排除硅片质量因素的方法 A related problem of exclusion and laser annealing method for wafer quality factors
06/25/2014CN103887203A 一种扫描机台程式使用浮动阈值进行晶圆检测的方法 A scanning machine program using the floating threshold method for wafer inspection
06/25/2014CN103887202A 监测方法 Monitoring Methods
06/25/2014CN103887201A 用于检测p型源漏离子注入导致位错缺陷的方法 The dislocation of the method for detecting defects in the p-type source and drain ion implantation
06/25/2014CN103887200A 一种检测光阻层阻挡能力的方法 A photoresist layer is used to detect the ability to block
06/25/2014CN103887199A 采用暗场硅片检测机台检测光阻损伤的方法 Darkfield wafer using the method detection machine detects resist damage
06/25/2014CN103887198A 对没有重复分界的存储区域进行扫描的方法 Boundaries of storage area does not duplicate scanning method
06/25/2014CN103887197A 一种量测键合器件结构上非键合区域尺寸的方法 A measurement of the non-bonding region bonded to the size of the device structure, the method
06/25/2014CN103887196A 采用小窗口图形测试结构检测多晶硅底部桥连缺陷的方法 Graphics test structures using the method to detect defects in the polysilicon bottom bridging small window
06/25/2014CN103887195A 采用离子击穿检测多晶硅底部刻蚀不足缺陷的方法 The method of ion etching bottom polysilicon shortage breakdown detection of defects
06/25/2014CN103887194A 并行测试器件 Parallel test devices
06/25/2014CN103887193A 用于三维集成电路测试的装置 3D IC testing apparatus for
06/25/2014CN103887192A 用于在衬底上安装半导体芯片的热压结合方法及装置 Thermocompression bonding method and apparatus for mounting a semiconductor chip on a substrate for
06/25/2014CN103887191A 半导体器件和制作无凸块倒装芯片互连结构的方法 Semiconductor devices and making no bump flip chip interconnect structure approach
06/25/2014CN103887190A 组件端子周边内具有周边凹部的引线框架 Within the component having a lead frame perimeter around the terminal portion of the recess
06/25/2014CN103887189A 用于制造芯片布置的方法和芯片布置 The method for manufacturing the chip layout and chip layout
06/25/2014CN103887188A 大电流半导体器件的封装工艺 Packaging process large current semiconductor devices
06/25/2014CN103887187A 半导体封装结构的形成方法 The method for forming a semiconductor package structure
06/25/2014CN103887186A 包括在器件上组装的分立天线的封装结构 Including in the device package structure of the antenna assembly of discrete
06/25/2014CN103887185A 一种用于芯片封装的引线框架的制备方法 A method of preparing a lead frame chip package for
06/25/2014CN103887184A 新型高密度高性能多层基板内对称结构及制作方法 Structure and production methods in the new high-density high-performance multi-layer substrate symmetry
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