Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/25/2014CN102163591B 一种球型光栅阵列ic芯片封装件及其生产方法 One kind of ball-type grating array ic chip package and production method
06/25/2014CN102163581B 半导体模块 Semiconductor Modules
06/25/2014CN102163564B 接合结构体及接合结构体的制造方法 Manufacturing method of a structure body, and the engagement structure engaging
06/25/2014CN102144281B 原位腔室处理与沉积工艺 In situ processing and deposition process chambers
06/25/2014CN102127752B 气体处理系统 Gas treatment system
06/25/2014CN102119439B 减少基材上粒子污染的平台及其方法 A platform and a method to reduce particle contamination on the substrate
06/25/2014CN102119243B 利用氢化物气相外延(HVPE)生长平面非极性的{1-100}m面和半极性的{11-22}氮化镓 Using a hydride vapor phase epitaxy (HVPE) growth plane non-polar {1-100} m side and semi-polar {11-22} GaN
06/25/2014CN102059222B 测试分选机用开放装置 Test sorting machine with an open device
06/25/2014CN102046357B 纳米压印用模具、其制造方法及表面具有微细凹凸结构的树脂成形体以及线栅型偏振器的制造方法 The mold for nanoimprinting, its manufacturing method and manufacturing method of the surface of a resin molded product having a fine concavo-convex structure and the wire-grid polarizer
06/25/2014CN102034665B 一种离子植入装置和一种通过植入氢化硼簇离子制造半导体的方法 And a method of manufacturing a semiconductor device by the implantation of boron hydride cluster ions of an ion implantation
06/25/2014CN101924053B 检测晶片的系统和方法 System and method for detecting a wafer
06/25/2014CN101877304B 等离子处理装置和等离子处理方法 The plasma processing apparatus and plasma processing method
06/25/2014CN101848605B 电子元器件接合方法及电子元器件 The method of joining electronic components and electronic components
06/25/2014CN101800249B 晶体管及该晶体管的制造方法 The method of manufacturing a transistor, and the transistor
06/25/2014CN101728435B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/25/2014CN101689540B 制造集成电路的方法 The method of manufacturing an integrated circuit
06/25/2014CN101673679B 薄型半导体晶片和减薄半导体晶片的方法 The method of thinning a semiconductor wafer and a thin semiconductor wafer
06/25/2014CN101615764B 半导体元件及其制造方法 Semiconductor device and manufacturing method
06/25/2014CN101542691B 在超高纵横比电介质刻蚀中减少扭曲 Reduce distortions in the ultra-high aspect ratio dielectric etching
06/25/2014CN101465282B 制造半导体器件的方法 The method of manufacturing a semiconductor device
06/25/2014CN101393888B 栈式1T-n存储单元结构 Stacker 1T-n memory cell structure
06/25/2014CN101378035B 半导体装置的制造方法 The method of manufacturing a semiconductor device
06/25/2014CN101029289B 清洗组合物和使用该清洗组合物的方法和系统 The cleaning composition of the cleaning composition and the use of a method and system for
06/25/2014CN101009310B 有机发光显示器及其制造方法 The organic light emitting display and a method of manufacturing
06/25/2014CN101002506B 用作电荷传输物质的三芳胺化合物 Used as a charge transport material triarylamine compound
06/24/2014US8761842 Encapsulated integrated-circuit device with thin-film battery
06/24/2014US8760643 Apparatus and method for inspecting defect in object surface
06/24/2014US8760593 Thin film transistor and method for manufacturing thereof
06/24/2014US8760571 Alignment of lens and image sensor
06/24/2014US8760559 Miniaturization image capturing module and method of manufacturing the same
06/24/2014US8760545 Solid-state imaging device, manufacturing method therefor, solid-state imaging apparatus, and image capturing apparatus
06/24/2014US8760373 Pixel circuit, display device, and method of driving pixel circuit
06/24/2014US8759989 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
06/24/2014US8759987 Semiconductor device and method of manufacturing the semiconductor device
06/24/2014US8759984 Semiconductor memory device
06/24/2014US8759979 Semiconductor memory device having dummy conductive patterns on interconnection
06/24/2014US8759972 Semiconductor device and method of forming composite bump-on-lead interconnection
06/24/2014US8759970 Semiconductor device having copper interconnect for bonding
06/24/2014US8759964 Wafer level package structure and fabrication methods
06/24/2014US8759951 Method for manufacturing semiconductor device, and semiconductor device
06/24/2014US8759949 Wafer backside structures having copper pillars
06/24/2014US8759947 Back-side MOM/MIM devices
06/24/2014US8759942 Semiconductor device comprising an isolation trench including semiconductor islands
06/24/2014US8759941 Semiconductor integrated circuit device and method for designing the same
06/24/2014US8759934 Backside illuminated image sensor with stressed film
06/24/2014US8759933 Solid-state image pickup element, method of manufacturing the same, and electronic apparatus using the same
06/24/2014US8759925 Method for reducing thickness of interfacial layer, method for forming high dielectric constant gate insulating film, high dielectric constant gate insulating film, high dielectric constant gate oxide film, and transistor having high dielectric constant gate oxide film
06/24/2014US8759922 Full silicidation prevention via dual nickel deposition approach
06/24/2014US8759921 Semiconductor memory device and method of manufacturing the same
06/24/2014US8759920 Semiconductor device and method of forming the same
06/24/2014US8759915 Semiconductor field-effect transistor, memory cell and memory device
06/24/2014US8759909 Power MOSFET structure and method
06/24/2014US8759907 Memory device having buried bit line and vertical transistor and fabrication method thereof
06/24/2014US8759902 Non-volatile memory device with vertical memory cells
06/24/2014US8759893 Horizontal interdigitated capacitor structure with vias
06/24/2014US8759891 Semiconductor device comprising capacitor and method of fabricating the same
06/24/2014US8759872 Transistor with threshold voltage set notch and method of fabrication thereof
06/24/2014US8759859 Light-emitting element, self-scanning light-emitting element array, optical writing head, and image forming apparatus
06/24/2014US8759844 Semiconductor device having elevated source and drain
06/24/2014US8759842 Semiconductor device and method for manufacturing the same
06/24/2014US8759838 Package and fabrication method of the same
06/24/2014US8759834 Display panel
06/24/2014US8759831 Thin film transistor array structure and manufacturing method thereof
06/24/2014US8759821 Transparent organic electroluminescent element and production method therefor
06/24/2014US8759809 Integrated circuitry comprising nonvolatile memory cells having platelike electrode and ion conductive material layer
06/24/2014US8759669 Barrier and planarization layer for thin-film photovoltaic cell
06/24/2014US8759234 Deposited material and method of formation
06/24/2014US8759233 Method for fabricating semiconductor device
06/24/2014US8759232 Compressive stress transfer in an interlayer dielectric of a semiconductor device by providing a bi-layer of superior adhesion and internal stress
06/24/2014US8759231 Silicon texture formulations with diol additives and methods of using the formulations
06/24/2014US8759230 Treatment of a substrate with a liquid medium
06/24/2014US8759229 Method for manufacturing epitaxial wafer
06/24/2014US8759228 Chemistry and compositions for manufacturing integrated circuits
06/24/2014US8759227 Method for processing a target object
06/24/2014US8759226 Method for minimizing contamination in semiconductor processing chamber
06/24/2014US8759225 Method to form a CMOS image sensor
06/24/2014US8759224 Method of forming a pattern structure for a semiconductor device
06/24/2014US8759223 Double patterning etching process
06/24/2014US8759222 Method for fabrication of semiconductor device
06/24/2014US8759221 Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages
06/24/2014US8759220 Patterning process
06/24/2014US8759219 Planarization method applied in process of manufacturing semiconductor component
06/24/2014US8759218 Chemical mechanical polishing process
06/24/2014US8759217 Method for forming interlayer connectors to a stack of conductive layers
06/24/2014US8759216 Compositions and methods for polishing silicon nitride materials
06/24/2014US8759215 Method for forming bumps in substrates with through vias
06/24/2014US8759214 Method of etching a semiconductor wafer
06/24/2014US8759213 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof
06/24/2014US8759212 Semiconductor device and method of manufacturing semiconductor device
06/24/2014US8759211 Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
06/24/2014US8759210 Control of silver in C4 metallurgy with plating process
06/24/2014US8759209 Semiconductor device and method of forming a dual UBM structure for lead free bump connections
06/24/2014US8759208 Method for manufacturing contact holes in CMOS device using gate-last process
06/24/2014US8759207 Semiconductor structure and method for making same
06/24/2014US8759206 Semiconductor device and method for manufacturing the same
06/24/2014US8759205 Semiconductor device and method for manufacturing semiconductor device
06/24/2014US8759204 Method for manufacturing semiconductor substrate
06/24/2014US8759203 Growing III-V compound semiconductors from trenches filled with intermediate layers
06/24/2014US8759202 Semiconductor device and manufacturing method
06/24/2014US8759201 Method of forming high growth rate, low resistivity germanium film on silicon substrate