Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/25/2014 | CN102163591B 一种球型光栅阵列ic芯片封装件及其生产方法 One kind of ball-type grating array ic chip package and production method |
06/25/2014 | CN102163581B 半导体模块 Semiconductor Modules |
06/25/2014 | CN102163564B 接合结构体及接合结构体的制造方法 Manufacturing method of a structure body, and the engagement structure engaging |
06/25/2014 | CN102144281B 原位腔室处理与沉积工艺 In situ processing and deposition process chambers |
06/25/2014 | CN102127752B 气体处理系统 Gas treatment system |
06/25/2014 | CN102119439B 减少基材上粒子污染的平台及其方法 A platform and a method to reduce particle contamination on the substrate |
06/25/2014 | CN102119243B 利用氢化物气相外延(HVPE)生长平面非极性的{1-100}m面和半极性的{11-22}氮化镓 Using a hydride vapor phase epitaxy (HVPE) growth plane non-polar {1-100} m side and semi-polar {11-22} GaN |
06/25/2014 | CN102059222B 测试分选机用开放装置 Test sorting machine with an open device |
06/25/2014 | CN102046357B 纳米压印用模具、其制造方法及表面具有微细凹凸结构的树脂成形体以及线栅型偏振器的制造方法 The mold for nanoimprinting, its manufacturing method and manufacturing method of the surface of a resin molded product having a fine concavo-convex structure and the wire-grid polarizer |
06/25/2014 | CN102034665B 一种离子植入装置和一种通过植入氢化硼簇离子制造半导体的方法 And a method of manufacturing a semiconductor device by the implantation of boron hydride cluster ions of an ion implantation |
06/25/2014 | CN101924053B 检测晶片的系统和方法 System and method for detecting a wafer |
06/25/2014 | CN101877304B 等离子处理装置和等离子处理方法 The plasma processing apparatus and plasma processing method |
06/25/2014 | CN101848605B 电子元器件接合方法及电子元器件 The method of joining electronic components and electronic components |
06/25/2014 | CN101800249B 晶体管及该晶体管的制造方法 The method of manufacturing a transistor, and the transistor |
06/25/2014 | CN101728435B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
06/25/2014 | CN101689540B 制造集成电路的方法 The method of manufacturing an integrated circuit |
06/25/2014 | CN101673679B 薄型半导体晶片和减薄半导体晶片的方法 The method of thinning a semiconductor wafer and a thin semiconductor wafer |
06/25/2014 | CN101615764B 半导体元件及其制造方法 Semiconductor device and manufacturing method |
06/25/2014 | CN101542691B 在超高纵横比电介质刻蚀中减少扭曲 Reduce distortions in the ultra-high aspect ratio dielectric etching |
06/25/2014 | CN101465282B 制造半导体器件的方法 The method of manufacturing a semiconductor device |
06/25/2014 | CN101393888B 栈式1T-n存储单元结构 Stacker 1T-n memory cell structure |
06/25/2014 | CN101378035B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
06/25/2014 | CN101029289B 清洗组合物和使用该清洗组合物的方法和系统 The cleaning composition of the cleaning composition and the use of a method and system for |
06/25/2014 | CN101009310B 有机发光显示器及其制造方法 The organic light emitting display and a method of manufacturing |
06/25/2014 | CN101002506B 用作电荷传输物质的三芳胺化合物 Used as a charge transport material triarylamine compound |
06/24/2014 | US8761842 Encapsulated integrated-circuit device with thin-film battery |
06/24/2014 | US8760643 Apparatus and method for inspecting defect in object surface |
06/24/2014 | US8760593 Thin film transistor and method for manufacturing thereof |
06/24/2014 | US8760571 Alignment of lens and image sensor |
06/24/2014 | US8760559 Miniaturization image capturing module and method of manufacturing the same |
06/24/2014 | US8760545 Solid-state imaging device, manufacturing method therefor, solid-state imaging apparatus, and image capturing apparatus |
06/24/2014 | US8760373 Pixel circuit, display device, and method of driving pixel circuit |
06/24/2014 | US8759989 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
06/24/2014 | US8759987 Semiconductor device and method of manufacturing the semiconductor device |
06/24/2014 | US8759984 Semiconductor memory device |
06/24/2014 | US8759979 Semiconductor memory device having dummy conductive patterns on interconnection |
06/24/2014 | US8759972 Semiconductor device and method of forming composite bump-on-lead interconnection |
06/24/2014 | US8759970 Semiconductor device having copper interconnect for bonding |
06/24/2014 | US8759964 Wafer level package structure and fabrication methods |
06/24/2014 | US8759951 Method for manufacturing semiconductor device, and semiconductor device |
06/24/2014 | US8759949 Wafer backside structures having copper pillars |
06/24/2014 | US8759947 Back-side MOM/MIM devices |
06/24/2014 | US8759942 Semiconductor device comprising an isolation trench including semiconductor islands |
06/24/2014 | US8759941 Semiconductor integrated circuit device and method for designing the same |
06/24/2014 | US8759934 Backside illuminated image sensor with stressed film |
06/24/2014 | US8759933 Solid-state image pickup element, method of manufacturing the same, and electronic apparatus using the same |
06/24/2014 | US8759925 Method for reducing thickness of interfacial layer, method for forming high dielectric constant gate insulating film, high dielectric constant gate insulating film, high dielectric constant gate oxide film, and transistor having high dielectric constant gate oxide film |
06/24/2014 | US8759922 Full silicidation prevention via dual nickel deposition approach |
06/24/2014 | US8759921 Semiconductor memory device and method of manufacturing the same |
06/24/2014 | US8759920 Semiconductor device and method of forming the same |
06/24/2014 | US8759915 Semiconductor field-effect transistor, memory cell and memory device |
06/24/2014 | US8759909 Power MOSFET structure and method |
06/24/2014 | US8759907 Memory device having buried bit line and vertical transistor and fabrication method thereof |
06/24/2014 | US8759902 Non-volatile memory device with vertical memory cells |
06/24/2014 | US8759893 Horizontal interdigitated capacitor structure with vias |
06/24/2014 | US8759891 Semiconductor device comprising capacitor and method of fabricating the same |
06/24/2014 | US8759872 Transistor with threshold voltage set notch and method of fabrication thereof |
06/24/2014 | US8759859 Light-emitting element, self-scanning light-emitting element array, optical writing head, and image forming apparatus |
06/24/2014 | US8759844 Semiconductor device having elevated source and drain |
06/24/2014 | US8759842 Semiconductor device and method for manufacturing the same |
06/24/2014 | US8759838 Package and fabrication method of the same |
06/24/2014 | US8759834 Display panel |
06/24/2014 | US8759831 Thin film transistor array structure and manufacturing method thereof |
06/24/2014 | US8759821 Transparent organic electroluminescent element and production method therefor |
06/24/2014 | US8759809 Integrated circuitry comprising nonvolatile memory cells having platelike electrode and ion conductive material layer |
06/24/2014 | US8759669 Barrier and planarization layer for thin-film photovoltaic cell |
06/24/2014 | US8759234 Deposited material and method of formation |
06/24/2014 | US8759233 Method for fabricating semiconductor device |
06/24/2014 | US8759232 Compressive stress transfer in an interlayer dielectric of a semiconductor device by providing a bi-layer of superior adhesion and internal stress |
06/24/2014 | US8759231 Silicon texture formulations with diol additives and methods of using the formulations |
06/24/2014 | US8759230 Treatment of a substrate with a liquid medium |
06/24/2014 | US8759229 Method for manufacturing epitaxial wafer |
06/24/2014 | US8759228 Chemistry and compositions for manufacturing integrated circuits |
06/24/2014 | US8759227 Method for processing a target object |
06/24/2014 | US8759226 Method for minimizing contamination in semiconductor processing chamber |
06/24/2014 | US8759225 Method to form a CMOS image sensor |
06/24/2014 | US8759224 Method of forming a pattern structure for a semiconductor device |
06/24/2014 | US8759223 Double patterning etching process |
06/24/2014 | US8759222 Method for fabrication of semiconductor device |
06/24/2014 | US8759221 Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages |
06/24/2014 | US8759220 Patterning process |
06/24/2014 | US8759219 Planarization method applied in process of manufacturing semiconductor component |
06/24/2014 | US8759218 Chemical mechanical polishing process |
06/24/2014 | US8759217 Method for forming interlayer connectors to a stack of conductive layers |
06/24/2014 | US8759216 Compositions and methods for polishing silicon nitride materials |
06/24/2014 | US8759215 Method for forming bumps in substrates with through vias |
06/24/2014 | US8759214 Method of etching a semiconductor wafer |
06/24/2014 | US8759213 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof |
06/24/2014 | US8759212 Semiconductor device and method of manufacturing semiconductor device |
06/24/2014 | US8759211 Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method |
06/24/2014 | US8759210 Control of silver in C4 metallurgy with plating process |
06/24/2014 | US8759209 Semiconductor device and method of forming a dual UBM structure for lead free bump connections |
06/24/2014 | US8759208 Method for manufacturing contact holes in CMOS device using gate-last process |
06/24/2014 | US8759207 Semiconductor structure and method for making same |
06/24/2014 | US8759206 Semiconductor device and method for manufacturing the same |
06/24/2014 | US8759205 Semiconductor device and method for manufacturing semiconductor device |
06/24/2014 | US8759204 Method for manufacturing semiconductor substrate |
06/24/2014 | US8759203 Growing III-V compound semiconductors from trenches filled with intermediate layers |
06/24/2014 | US8759202 Semiconductor device and manufacturing method |
06/24/2014 | US8759201 Method of forming high growth rate, low resistivity germanium film on silicon substrate |