Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/18/2014CN103875060A Multi-die semiconductor package with one or more embedded die pads
06/18/2014CN103874961A Positive photosensitive resin composition, method for producing cured product, method for producing resin pattern, cured product, and optical member
06/18/2014CN103874569A Method and device for encapsulating electronic components using a reduction material which undergoes a phase change
06/18/2014CN103874550A Ultrasonic cleaning apparatus and power control method employed therein
06/18/2014CN103874314A Inductively coupled plasma device
06/18/2014CN103872201A Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same
06/18/2014CN103872196A Substrate and recycling and reusing method thereof
06/18/2014CN103872192A Manufacturing method for LED (Light Emitting Diode) chip
06/18/2014CN103872183A Single face polishing method
06/18/2014CN103872180A Gettering method through implantation of carbon ions
06/18/2014CN103872173A Stacking-inserting conversion system and method
06/18/2014CN103872168A Photoelectric detector for use in silicon-based photoelectric integrated circuit chip and manufacturing method thereof
06/18/2014CN103872154A Molybdenum film containing sodium and preparation method and application thereof
06/18/2014CN103872147A Schottky barrier diode and method of manufacturing the same
06/18/2014CN103872144A Soft fast recovery diode and manufacturing method thereof
06/18/2014CN103872143A Metal oxide semiconductor diode element with terminal structure and manufacturing method for metal oxide semiconductor diode element
06/18/2014CN103872142A Pixel structure and manufacturing method therefor
06/18/2014CN103872141A Semiconductor device and manufacturing method thereof
06/18/2014CN103872140A Planar ring gate transistor based on nanowire and preparation method thereof
06/18/2014CN103872139A Thin film transistor, manufacturing method of thin film transistor, array substrate and display device
06/18/2014CN103872138A Transistors, methods of manufacturing transistors, and electronic devices including transistors
06/18/2014CN103872136A Power transistor of double-gate MOS structure and manufacturing method of power transistor
06/18/2014CN103872135A Metal oxide semiconductor device with increased breakdown voltage
06/18/2014CN103872134A Power semiconductor device and method of manufacturing the same
06/18/2014CN103872132A Metal-oxide-semiconductor transistor (MOS) and method of fabricating same
06/18/2014CN103872131A Multi-Fin FinFETs with Epitaxially-Grown Merged Source/Drains and methods of manufacturing the same
06/18/2014CN103872130A Semiconductor device and method for fabricating the same
06/18/2014CN103872129A Semiconductor device and fabrication method thereof
06/18/2014CN103872128A Vertical type semiconductor device and fabrication method thereof
06/18/2014CN103872125A Channel-type grid metal oxide semiconductor field effect transistor and manufacturing method thereof
06/18/2014CN103872123A N-channel radio frequency LDMOS (Lateral Double-diffused Metal Oxide Semiconductor field effect transistor) device and manufacturing method
06/18/2014CN103872122A Trench gate transistor and manufacturing method thereof
06/18/2014CN103872120A Semiconductor device and method of manufacturing the semiconductor device
06/18/2014CN103872119A High electron mobility transistor and manufacturing method thereof
06/18/2014CN103872118A Field effect transistor and preparing method thereof
06/18/2014CN103872117A Semiconductor device and method of manufacturing the same
06/18/2014CN103872114A Groove type IGBT and manufacturing method thereof
06/18/2014CN103872113A Tunneling type reverse guide IGBT and manufacturing method thereof
06/18/2014CN103872112A Semiconductor structure and operation method thereof
06/18/2014CN103872111A IGBT and manufacturing method thereof
06/18/2014CN103872110A Back surface structure of reverse conducting IGBT and manufacturing method thereof
06/18/2014CN103872108A IGBT structure and preparation method thereof
06/18/2014CN103872107A Heterojunction bipolar transistor, power amplifier including the same, and method for fabricating heterojunction bipolar transistor
06/18/2014CN103872106A Radiation resistant bipolar device and manufacturing method thereof
06/18/2014CN103872105A Reinforced bipolar transistor resistant to radiation and method for preparing reinforced bipolar transistor resistant to radiation
06/18/2014CN103872102A FinFET with Embedded MOS Varactor and Method of Making Same
06/18/2014CN103872101A Insulated gate field effect transistor and manufacture method thereof
06/18/2014CN103872100A Low-leak-current semiconductor thin film heterojunction and preparing method thereof
06/18/2014CN103872099A Semiconductor Device with Step-Shaped Edge Termination, and Method for Manufacturing a Semiconductor Device
06/18/2014CN103872097A Power semiconductor device and method for manufacturing the same
06/18/2014CN103872096A Semiconductor structure and forming method thereof
06/18/2014CN103872095A Groove of P-type LDMOS (laterally diffused metal oxide semiconductor) device and process method
06/18/2014CN103872094A Semiconductor device and formation method thereof
06/18/2014CN103872078A Organic light emitting diode device and method for fabricating the same
06/18/2014CN103872070A Organic light emitting diode display device having built-in touch panel and method of manufacturing same
06/18/2014CN103872062A Semiconductor device and manufacturing method thereof
06/18/2014CN103872061A Array substrate and method of fabricating the same
06/18/2014CN103872060A Array substrate and method of fabricating the same
06/18/2014CN103872059A P-type channel flash memory and manufacturing method thereof
06/18/2014CN103872057A Non-volatile memory device and method of fabricating the same
06/18/2014CN103872056A Three-dimensional gate structure with horizontal extension portions and manufacturing method of three-dimensional grid structure with horizontal extension portions
06/18/2014CN103872055A Vertical channel type three dimensional semiconductor memory device and preparation method thereof
06/18/2014CN103872054A Integrated device, manufacturing method thereof, discrete device, and CDMOS (Complementary and Double-Diffusion MOS)
06/18/2014CN103872050A Semiconductor pressure sensor and fabrication method thereof
06/18/2014CN103872049A Semiconductor device and method for manufacturing same
06/18/2014CN103872048A Integrated circuit and forming method thereof
06/18/2014CN103872046A Method of forming an esd device and structure therefor
06/18/2014CN103872045A GaN-based ultra-thin barrier enhancement/depletion mode inverter, ring oscillator and manufacture method of GaN-based ultra-thin barrier enhancement/exhaust mode inverter
06/18/2014CN103872044A GaN-based ultra-thin barrier enhancement mode inverter, ring oscillator and manufacture method of GaN-based ultra-thin barrier enhancement mode inverter
06/18/2014CN103872043A Display device and manufacturing method thereof
06/18/2014CN103872040A Thin film transistor array base plate and manufacturing method thereof
06/18/2014CN103872039A Electrostatic discharge protection circuit and manufacturing method thereof
06/18/2014CN103872037A Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
06/18/2014CN103872036A Semiconductor module and method of manufacturing the same
06/18/2014CN103872035A Satellite navigation three-dimensional chip and manufacture method thereof
06/18/2014CN103872028A Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
06/18/2014CN103872023A Structure and method for testing performances of inter-layer dielectric layer
06/18/2014CN103872019A Photoetching mark applied to epitaxial process and manufacturing method for photoetching mark
06/18/2014CN103872016A Semiconductor testing structure, and testing method and manufacturing method thereof
06/18/2014CN103872009A Integrated circuits including integrated passive devices and methods of manufacture thereof
06/18/2014CN103872005A Semiconductor device and method of manufacturing the same
06/18/2014CN103872003A Lug structure for improving reliability of products and preparation method thereof
06/18/2014CN103872002A Stretchable and foldable electronic devices
06/18/2014CN103872000A Bump structure for semiconductor package
06/18/2014CN103871998A Single Layer Coreless Substrate
06/18/2014CN103871996A Package structure and manufacturing method thereof
06/18/2014CN103871995A Double-base-island seven-pin structure of integrated circuit (IC) and rib cutting die
06/18/2014CN103871993A Semiconductor device and manufacturing method of the same
06/18/2014CN103871992A Method and apparatus for manufacturing chip package
06/18/2014CN103871991A Methods and Apparatus for Package with Interposers
06/18/2014CN103871990A Package structure and package method
06/18/2014CN103871988A Annular coherent and bridge layout structures and verification method for wire open circuit and short circuit
06/18/2014CN103871979A Semiconductor device and method of manufacturing the same
06/18/2014CN103871977A SEMICONDUCTOR DEVICE and production method thereof
06/18/2014CN103871976A Improved encapsulation structure of high-temperature SQUID (Superconductivity Quantum Interference Device) and method
06/18/2014CN103871974A Semiconductor Device and Method of Producing the Same
06/18/2014CN103871973A Carrier tape, package tape and series of electronic components
06/18/2014CN103871971A Surface treatment method for flexible substrate
06/18/2014CN103871970A BCD integration process
06/18/2014CN103871969A Electrically erasable programmable read-only memory as well as forming method and erasure method thereof
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