Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/19/2014US20140170836 Chip Comprising a Fill Structure
06/19/2014US20140170835 Method for Wafer Dicing and Composition Useful Thereof
06/19/2014US20140170834 Method for manufacturing a hybrid soi/bulk semiconductor wafer
06/19/2014US20140170822 Cross-point diode arrays and methods of manufacturing cross-point diode arrays
06/19/2014US20140170820 Method of fabricating hybrid impact-ionization semiconductor device
06/19/2014US20140170818 Nanorod thin-film transistors
06/19/2014US20140170816 Copper Post Solder Bumps on Substrates
06/19/2014US20140170814 Ball grid array semiconductor device and its manufacture
06/19/2014US20140170812 Method and apparatus for manufacturing chip package
06/19/2014US20140170811 Method of fabricating a 3d integrated electronic device structure including increased thermal dissipation capabilities
06/19/2014US20140170801 Methods of fabricating a photovoltaic module, and related system
06/19/2014US20140170783 Mask alignment system for semiconductor processing
06/19/2014US20140170782 Scanner overlay correction system and method
06/19/2014US20140170781 Double side polisher with platen parallelism control
06/19/2014US20140170780 Method of Low-K Dielectric Film Repair
06/19/2014US20140170567 Resist underlayer film-forming composition for euv lithography containing condensation polymer
06/19/2014US20140170383 Ordered superstructures of octapod-shaped nanocrystals, their process of fabrication and use thereof
06/19/2014US20140169924 Micro device transfer system with pivot mount
06/19/2014US20140169772 Heat treatment apparatus for heating substrate by irradiation with flash light
06/19/2014US20140169104 Nonvolatile flash memory structures including fullerene molecules and methods for manufacturing the same
06/19/2014US20140168985 Desktop Item with LED Means Has USB-unit(s) or USB-Module to Charge Other Electric or Digital Data Device(s)
06/19/2014US20140168910 Mounting device for expansion card
06/19/2014US20140168592 Bonding pad of array substrate, method for producing the same, array substrate, and liquid crystal display apparatus
06/19/2014US20140168014 Antenna Apparatus and Method
06/19/2014US20140167815 Area reconfigurable cells of a standard cell library
06/19/2014US20140167296 Methods of forming configurable microchannels in package structures
06/19/2014US20140167294 Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof
06/19/2014US20140167285 Interconnect structure and fabrication method
06/19/2014US20140167284 Interconnect structure and forming method thereof
06/19/2014US20140167283 Interconnect structure and fabrication method
06/19/2014US20140167276 Substrate for semiconductor package, semiconductor package using the substrate, and method of manufacturing the semiconductor package
06/19/2014US20140167272 Semiconductor Device Having an Identification Mark
06/19/2014US20140167271 Interconnect structure and forming method thereof
06/19/2014US20140167270 Method of Fabricating a Layer Stack
06/19/2014US20140167268 Graphene and metal interconnects
06/19/2014US20140167267 Method and structures for heat dissipating interposers
06/19/2014US20140167266 Semiconductor device having peripheral polymer structures
06/19/2014US20140167265 Methods of forming a bi-layer cap layer on copper-based conductive structures and devices with such a cap layer
06/19/2014US20140167264 Integrated circuits and methods for fabricating integrated circuits with silicide contacts on non-planar structures
06/19/2014US20140167263 Methods and Apparatus for Package with Interposers
06/19/2014US20140167262 Semiconductor package signal routing using conductive vias
06/19/2014US20140167257 Fabrication of three-dimensional high surface area electrodes
06/19/2014US20140167256 Flip chip package structure and fabrication process thereof
06/19/2014US20140167253 Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
06/19/2014US20140167252 Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (wlp) packages
06/19/2014US20140167251 Semiconductor device, semiconductor module, and manufacturing method for semiconductor device
06/19/2014US20140167249 Interconnect structure and fabrication method
06/19/2014US20140167236 Integrated circuit packaging system with transferable trace lead frame
06/19/2014US20140167235 Semiconductor module
06/19/2014US20140167232 Segmented conductive ground plane for radio frequency isolation
06/19/2014US20140167230 Composite substrate and process for producing same
06/19/2014US20140167228 Etch process with pre-etch transient conditioning
06/19/2014US20140167227 Method of making a semiconductor device using multiple layer sets
06/19/2014US20140167225 Crack Stop Barrier and Method of Manufacturing Thereof
06/19/2014US20140167224 Semiconductor Device and Method of Producing the Same
06/19/2014US20140167223 Semiconductor Cooling Device
06/19/2014US20140167218 Circuit configuration and manufacturing processes for vertical transient voltage suppressor (tvs) and emi filter
06/19/2014US20140167217 Package with dielectric or anisotropic conductive (acf) buildup layer
06/19/2014US20140167212 Termination Structure with Multiple Embedded Potential Spreading Capacitive Structures for Trench MOSFET and Method
06/19/2014US20140167211 Method for amnufacturing a semiconductor device
06/19/2014US20140167210 Semiconductor structure and fabrication method
06/19/2014US20140167209 Method of Manufacturing a Semiconductor Device and a Semiconductor Workpiece
06/19/2014US20140167208 Chemical mechanical planarization process and structures
06/19/2014US20140167206 Shallow trench isolation structure and method of manufacture
06/19/2014US20140167204 Semiconductor diode assembly
06/19/2014US20140167187 N Metal for FinFET
06/19/2014US20140167184 Dummy Structures and Methods
06/19/2014US20140167177 Semiconductor devices and methods of manufacturing the same
06/19/2014US20140167174 Increasing ion/ioff ratio in finfets and nano-wires
06/19/2014US20140167172 FinFET with Embedded MOS Varactor and Method of Making Same
06/19/2014US20140167167 Cmos cell produced in fd-soi technology
06/19/2014US20140167166 Semiconductor device and fabrication method
06/19/2014US20140167158 Integrated device and method for fabricating the integrated device
06/19/2014US20140167127 Memory Devices and Methods of Manufacture Thereof
06/19/2014US20140167123 Power semiconductor device and method of manufacturing the same
06/19/2014US20140167122 Semiconductor device and manufacturing method thereof
06/19/2014US20140167119 Methods of forming a sidewall spacer having a generally triangular shape and a semiconductor device having such a spacer
06/19/2014US20140167114 Method for Growing III-V Epitaxial Layers
06/19/2014US20140167105 Devices for monolithic data conversion interface protection and methods of forming the same
06/19/2014US20140167086 Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same
06/19/2014US20140167069 Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
06/19/2014US20140167068 Systems and methods for ohmic contacts in silicon carbide devices
06/19/2014US20140167066 Light emitting element and method for manufacturing same
06/19/2014US20140167062 Manufacturing method of semiconductor device
06/19/2014US20140167058 Compositionally graded nitride-based high electron mobility transistor
06/19/2014US20140167057 REO/ALO/AlN TEMPLATE FOR III-N MATERIAL GROWTH ON SILICON
06/19/2014US20140167055 Method of processing a silicon wafer and a silicon integrated circuit
06/19/2014US20140167051 Array substrate, method for manufacturing the same, and display apparatus
06/19/2014US20140167049 Method of manufacturing substrate having thin film thereabove, method of manufacturing thin-film-device substrate, thin-film substrate, and thin-film-device substrate
06/19/2014US20140167045 Test pattern for trench poly over-etched step and formation method thereof
06/19/2014US20140167044 Semiconductor Device and Method for Manufacturing a Semiconductor Device
06/19/2014US20140167043 Semiconductor device and method for manufacturing a semiconductor device
06/19/2014US20140167033 Oxide sintered body and sputtering target
06/19/2014US20140167031 Method for fabricating array substrate, array substrate and display device
06/19/2014US20140166998 Organic light emitting diode display device having built-in touch panel and method of manufacturing the same
06/19/2014US20140166981 Vertical nanowire transistor with axially engineered semiconductor and gate metallization
06/19/2014US20140166971 Variable resistance memory device and method of manufacturing the same
06/19/2014US20140166957 Hybrid circuit of nitride-based transistor and memristor
06/19/2014US20140166840 Substrate Carrier
06/19/2014US20140166762 Foil composite card
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