Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/03/2014WO2014102222A1 Microelectronic method for etching a layer
07/03/2014WO2014101990A1 Liquid doping media for the local doping of silicon wafers
07/03/2014WO2014101989A1 Doping media for the local doping of silicon wafers
07/03/2014WO2014101988A1 Oxide media for gettering impurities from silicon wafers
07/03/2014WO2014101795A1 Warped silicon-chip adsorption device and adsorption method thereof
07/03/2014WO2014101586A1 Wafer prealignment method
07/03/2014WO2014014108A9 Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell
07/03/2014WO2013055627A9 Method of creating two dimensional doping patterns in solar cells
07/03/2014US20140189615 Signal path and method of manufacturing a multiple-patterned semiconductor device
07/03/2014US20140188266 Multiple manufacturing line qualification
07/03/2014US20140188265 Systems and methods for semiconductor line scribe centering
07/03/2014US20140188264 Workflow Manager and Bar Coding System for Processing of Samples/Substrates in HPC (High Productivity Combinatorial) R&D Environment
07/03/2014US20140187126 Polishing apparatus and polishing method
07/03/2014US20140187056 Multi charged particle beam writing apparatus and multi charged particle beam writing method
07/03/2014US20140187055 Short pulse fiber laser for ltps crystallization
07/03/2014US20140187054 Methods of patterning block copolymer layers
07/03/2014US20140187053 Method of cleaning thin film forming apparatus, thin film forming method, thin film forming apparatus and non-transitory recording medium
07/03/2014US20140187052 Selective Etching of Hafnium Oxide Using Diluted Hydrofluoric Acid
07/03/2014US20140187051 Poly Removal for replacement gate with an APM mixture
07/03/2014US20140187050 Method for isotropic etching
07/03/2014US20140187049 Showerhead electrode assembly with gas flow modification for extended electrode life
07/03/2014US20140187048 Plasma Etching Method
07/03/2014US20140187047 Patterning process method for semiconductor devices
07/03/2014US20140187046 Method for forming spacers for a transitor gate
07/03/2014US20140187045 Silicon nitride gapfill implementing high density plasma
07/03/2014US20140187044 Addition of carboxyl groups plasma during etching for interconnect reliability enhancement
07/03/2014US20140187043 Polishing agent and polishing method
07/03/2014US20140187042 Method for chemical planarization and chemical planarization apparatus
07/03/2014US20140187041 High Dose Ion-Implanted Photoresist Removal Using Organic Solvent and Transition Metal Mixtures
07/03/2014US20140187040 3d ic method and device
07/03/2014US20140187039 Method for Tuning the Effective Work Function of a Gate Structure in a Semiconductor Device
07/03/2014US20140187038 High temperature tungsten metallization process
07/03/2014US20140187037 Semiconductor device with self-aligned air gap and method for fabricating the same
07/03/2014US20140187036 INTEGRATION OF Ru WET ETCH AND CMP FOR BEOL INTERCONNECTS WITH Ru LAYER
07/03/2014US20140187035 Method of etching a porous dielectric material
07/03/2014US20140187033 Method of manufacturing interconnection and semiconductor device
07/03/2014US20140187031 Semiconductor device with recess gate and method for fabricating the same
07/03/2014US20140187029 Vertical type memory device
07/03/2014US20140187028 Concurrently Forming nFET and pFET Gate Dielectric Layers
07/03/2014US20140187027 Ion implantation methods
07/03/2014US20140187026 Method of Manufacture of an Optoelectronic Device and an Optoelectronic Device Manufactured Using the Method
07/03/2014US20140187025 Method of forming silicon film and film forming apparatus
07/03/2014US20140187024 Method of forming seed layer, method of forming silicon film, and film forming apparatus
07/03/2014US20140187023 Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Compression
07/03/2014US20140187022 Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension
07/03/2014US20140187021 Method of healing defect at junction of semiconductor device using germanium
07/03/2014US20140187020 Method for low temperature layer transfer in the preparation of multilayer semicondutor devices
07/03/2014US20140187010 Replacement gate process
07/03/2014US20140187009 Uniform, damage free nitride etch
07/03/2014US20140187008 High tilt angle plus twist drain extension implant for chc lifetime improvement
07/03/2014US20140187006 Method for fabricating a semiconductor device
07/03/2014US20140187001 Method for fabricating array substrate
07/03/2014US20140186999 Wafer level packaging of microbolometer vacuum package assemblies
07/03/2014US20140186998 Semiconductor device
07/03/2014US20140186996 Etchant and etching process for oxides containing at least indium and gallium
07/03/2014US20140186995 Method of fabricating cigs solar cells with high band gap by sequential processing
07/03/2014US20140186977 Method for calculating warpage of bonded soi wafer and method for manufacturing bonded soi wafer
07/03/2014US20140186975 Method and system for in-line real-time measurements of layers of multilayered front contacts of photovoltaic devices and calculation of opto-electronic properties and layer thicknesses thereof
07/03/2014US20140186974 Measurement device and method for vapour deposition applications
07/03/2014US20140186773 Coating material and method for photolithography
07/03/2014US20140186486 Apparatus For Producing Rectangular Seeds
07/03/2014US20140186145 Systems and methods for providing wafer access in a wafer processing system
07/03/2014US20140185355 Systems and Devices Including Multi-Transistor Cells and Methods of Using, Making, and Operating the Same
07/03/2014US20140184864 Solid-state imaging device and electronic apparatus
07/03/2014US20140184782 System of measuring warpage and method of measuring warpage
07/03/2014US20140184481 Organic light emitting display, method for driving the same, and method for manufacturing the same
07/03/2014US20140183761 Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
07/03/2014US20140183760 System and Method to Improve Package and 3DIC Yield in Underfill Process
07/03/2014US20140183757 Semiconductor device including passivation layer encapsulant
07/03/2014US20140183755 Semiconductor package and fabrication method thereof
07/03/2014US20140183754 Through-Vias and Methods of Forming the Same
07/03/2014US20140183753 Fabricating polysilicon mos devices and passive esd devices
07/03/2014US20140183752 Semiconductor assembly with built-in stopper, semiconductor device and build-up circuitry and method of making the same
07/03/2014US20140183750 Ultrathin buried die module and method of manufacturing thereof
07/03/2014US20140183747 Multi-die, high current wafer level package
07/03/2014US20140183743 Manganese metal film forming method, processing system, electronic device manufacturing method and electronic device
07/03/2014US20140183742 Manganese-containing film forming method, processing system, electronic device manufacturing method and electronic device
07/03/2014US20140183740 Methods of exposing conductive vias of semiconductor devices and associated structures
07/03/2014US20140183739 Dual damascene structure with liner
07/03/2014US20140183738 Cobalt based interconnects and methods of fabrication thereof
07/03/2014US20140183737 Diffusion Barriers
07/03/2014US20140183736 Graphene electrodes for electronic devices
07/03/2014US20140183735 System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections
07/03/2014US20140183727 Waterfall wire bonding
07/03/2014US20140183726 Package substrate, method for manufacturing the same, and package on package substrate
07/03/2014US20140183725 Post-passivation interconnect structure and method of forming the same
07/03/2014US20140183722 Semiconductor device and method for manufacturing same
07/03/2014US20140183721 Semiconductor package and fabrication method thereof
07/03/2014US20140183720 Methods of manufacturing integrated circuits having a compressive nitride layer
07/03/2014US20140183718 Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
07/03/2014US20140183712 Ball grid array package with improved thermal characteristics
07/03/2014US20140183711 Semiconductor Device and Method of Making a Semiconductor Device
07/03/2014US20140183709 Compartmentalized heat spreader for electromagnetic mitigation
07/03/2014US20140183708 Electrostatic discharge protection structure and fabricating method thereof
07/03/2014US20140183707 Latchup reduction by grown orthogonal substrates
07/03/2014US20140183706 Dielectric Films Comprising Silicon And Methods For Making Same
07/03/2014US20140183704 Semiconductor chip, method for manufacturing semiconductor chip, and semiconductor device
07/03/2014US20140183702 Design method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device
07/03/2014US20140183701 Hardmask composition and method of forming patterns and semiconductor integrated circuit device including the patterns
07/03/2014US20140183700 High quality devices growth on pixelated patterned templates
1 ... 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 ... 6590