Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/02/2014EP2748845A1 Wafer structure for electronic integrated circuit manufacturing
07/02/2014EP2748844A1 Wafer structure for electronic integrated circuit manufacturing
07/02/2014EP2748843A1 Susceptor
07/02/2014EP2748842A1 A method of making a split gate non-volatile floating gate memory cell having a separate erase gate, and a memory cell made thereby
07/02/2014EP2748841A1 Formulation for acidic wet chemical etching of silicon wafers
07/02/2014EP2748840A2 A semiconductor substrate and method of manufacturing
07/02/2014EP2748839A1 Device and method for coating a substrate
07/02/2014EP2748838A1 A method for growing iii-v materials on a non iii-v material substrate comprising steps improving dislocation fault density of a finished material structure suitable for use in semiconductor manufacturing and semiconductor applications
07/02/2014CN203690326U 太阳能面板观察站 Solar panels Observatory
07/02/2014CN203690305U 半导体器件及半导体器件结构 Semiconductor device and semiconductor device structure
07/02/2014CN203690303U 电子器件 Electronic devices
07/02/2014CN203690288U 一种叠层芯片的晶圆级铜凸块封装结构 Copper bump wafer-level package structure of a stacked chip
07/02/2014CN203690287U 一种基于框架采用镀银技术的封装件 A framework for using silver-based technology package
07/02/2014CN203690278U 无引线球脚表贴式厚膜混合集成电路 Leadless surface mount ball feet thick film hybrid integrated circuits
07/02/2014CN203690277U 用于晶圆级植球机的搭载平台 For wafer level bumping machine equipped with platform
07/02/2014CN203690276U 一种适用于薄片加工的金属夹具 One for the processing of sheet metal fixture
07/02/2014CN203690275U 顶针座 Tailstocks
07/02/2014CN203690274U 半导体承载装置的阶级弹性限位结构 Semiconductor carrying device class structure elastic limit
07/02/2014CN203690273U 用于倒角机的晶圆吸附装置及包含其的倒角机 Wafer adsorption apparatus for chamfering machine and chamfering machine contains its
07/02/2014CN203690272U 一种用于太阳能电池硅片的真空吸笔 A solar cell silicon vacuum suction pen
07/02/2014CN203690271U 用于自动化生产的二极管自动梳条机流水线 For automated production lines diode automatic sliver machine
07/02/2014CN203690270U 石墨舟及其石墨舟舟钩 Graphite and graphite boat hook Zhou Zhou
07/02/2014CN203690269U 一种晶舟结构 A crystalline structure boat
07/02/2014CN203690268U 晶舟 Zhou Jing
07/02/2014CN203690267U 一种特殊的物料系统 A special material systems
07/02/2014CN203690266U 一种等离子体刻蚀设备进气装置 One kind of plasma etching equipment intake device
07/02/2014CN203690265U 一种太阳能电池片涂抹助焊剂观测装置 A solar flux coated tablets observation device
07/02/2014CN203690264U 软线测试装置 Cord testing device
07/02/2014CN203690263U 一种组装晶闸管阀串的装置 A method of assembling a thyristor valve train device
07/02/2014CN203689096U 一种自动粘片机三维运动焊头的控制系统 An automatic pasting machine welding head three-dimensional motion control systems
07/02/2014CN203687830U 封装晶体管引脚成型检测装置 Package transistor pin forming detection device
07/02/2014CN203683082U 具有孔的半导体装置 The semiconductor device having a bore
07/02/2014CN203678772U 一种晶圆清洗装置 One kind of wafer cleaning device
07/02/2014CN103907403A 具有相位控制的高效能三线圈感应耦合等离子体源 With phase control of high-performance three coil inductively coupled plasma source
07/02/2014CN103907395A 具有流体介质的高清晰度加热器系统 High Definition heater system having a fluid medium
07/02/2014CN103907207A 形成半导体基板的p型掺杂铝表面区域的方法 P-type doped semiconductor substrate region of a method of forming the aluminum surface
07/02/2014CN103907195A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/02/2014CN103907193A 碳化硅半导体器件及其制造方法 Silicon carbide semiconductor device and manufacturing method thereof
07/02/2014CN103907183A 在半导体装配中使用排斥材料保护制造区域的用途 Use material exclusion zone protection use in semiconductor manufacturing assembly
07/02/2014CN103907182A 改良的沟槽内轮廓 Improved contour trenches
07/02/2014CN103907181A 静电吸盘 Electrostatic chuck
07/02/2014CN103907180A 布线基板 Wiring board
07/02/2014CN103907179A 回流膜、焊料凸块形成方法、焊料接合的形成方法以及半导体装置 Reflux film, the solder bump forming method, and a method for forming a solder joint of a semiconductor device
07/02/2014CN103907178A 有机半导体元件的制造方法、有机半导体元件、有机单晶体薄膜的成长方法、有机单晶体薄膜、电子设备及有机单晶体薄膜组 Method for producing organic semiconductor element, an organic semiconductor element, a single crystal growth method of the organic thin film, an organic thin film single crystal, single crystal thin film electronic device and the organic group
07/02/2014CN103907177A 蚀刻停止层和电容器 Etch stop layer and a capacitor
07/02/2014CN103907176A 制造半导体器件的方法 The method of manufacturing a semiconductor device
07/02/2014CN103907175A 通过使用有槽的衬底的低翘曲晶片结合 By using a substrate having grooves of low warpage wafer bonding
07/02/2014CN103907174A 膜的形成方法 Film formation method
07/02/2014CN103907173A 细间距线栅偏振器 Fine pitch wire grid polarizer
07/02/2014CN103907061A 微透镜阵列以及使用该微透镜阵列的扫描曝光装置 The microlens array and a scanning exposure apparatus using the microlens array
07/02/2014CN103907059A 感光化射线性或感放射线性树脂组成物、感光化射线性或感放射线性膜、空白屏蔽及图案形成方法 Of ray photosensitive or radiation-sensitive resin composition, a photosensitive or radiation of the radiation-sensitive film, and the pattern forming method shield blank
07/02/2014CN103906857A 化学浴沉积设备、形成缓冲层及制造光电转换装置的方法 Chemical bath deposition apparatus, and a method of manufacturing a buffer layer of a photoelectric conversion device
07/02/2014CN103906819A 切断性优秀的半导体晶片表面保护用粘结膜 Excellent cut semiconductor wafer surface protection adhesive film
07/02/2014CN103906692A 板材的搬运系统 Sheet handling system
07/02/2014CN103906601A 浆液及浆液的制造方法 Manufacturing method of slurry and slurry
07/02/2014CN103904202A 一种用于制作led多芯片封装基板的方法及滚压刀具 A method for making a multi-chip package substrate led method and rolling tool
07/02/2014CN103904190A 发光二极管封装结构及其制造方法 LED package structure and manufacturing method
07/02/2014CN103904162A 一种非制冷红外探测器tec封装装配的简易方法 A simple method for uncooled infrared detector assembly tec package
07/02/2014CN103904158A 一种改善管式pecvd系统镀膜均匀性的方法 A method of coating uniformity improvement tube pecvd
07/02/2014CN103904137A Mos电容及其制作方法 Mos capacitor and manufacturing method thereof
07/02/2014CN103904135A 肖特基二极管及其制造方法 Schottky diode and its manufacturing method
07/02/2014CN103904134A 基于GaN基异质结构的二极管结构及制作方法 Based diode structure and method of making GaN-based heterostructures
07/02/2014CN103904133A 平衡正向压降和反向漏电流的肖特基二极管及制备方法 Balance forward voltage drop and reverse leakage current of the Schottky diode and preparation method
07/02/2014CN103904131A 肖特基势垒二极管及其制造方法 Schottky barrier diode and its manufacturing method
07/02/2014CN103904122A 一种鳍型半导体结构及其成型方法 One kind of fin-type semiconductor structure and method of forming
07/02/2014CN103904121A 一种横向高压器件及其制造方法 A widthwise high pressure device and manufacturing method
07/02/2014CN103904119A 一种具有纵向屏蔽栅的Trench MOSFET及其加工方法 Having a longitudinal shield gate Trench MOSFET and method of processing
07/02/2014CN103904118A 具有存储器功能的场效应晶体管及其三维集成方法 The field effect transistor having a memory function and three-dimensional integrated approach
07/02/2014CN103904117A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/02/2014CN103904116A 金属氧化物半导体器件和制作方法 Metal oxide semiconductor device and manufacturing method
07/02/2014CN103904115A 具有埋设的金属硅化物层的半导体器件及其制造方法 A semiconductor device and a manufacturing method of the buried metal silicide layer
07/02/2014CN103904114A 加源场板增强型AlGaN/GaN HEMT器件结构及其制作方法 Plus enhanced source field plate AlGaN / GaN HEMT device structure and fabrication method thereof
07/02/2014CN103904113A 加栅场板耗尽型AlGaN/GaN HEMT器件结构及其制作方法 Plus gate field plate depletion mode AlGaN / GaN HEMT device structure and fabrication method thereof
07/02/2014CN103904112A 耗尽型绝缘栅AlGaN/GaN器件结构及其制作方法 Depletion mode insulated gate AlGaN / GaN device structure and fabrication method thereof
07/02/2014CN103904111A 基于增强型AlGaN/GaN HEMT器件结构及其制作方法 Based on Enhanced AlGaN / GaN HEMT device structure and fabrication method thereof
07/02/2014CN103904110A 加栅场板耗尽型绝缘栅AlGaN/GaN器件结构及其制作方法 Plus gate depletion mode insulated gate field plate AlGaN / GaN device structure and fabrication method thereof
07/02/2014CN103904109A 半导体器件以及用于制造半导体器件的方法 A semiconductor device and a method for manufacturing a semiconductor device
07/02/2014CN103904108A 具有石墨烯电极的GaN基半导体器件及其制备方法 GaN-based semiconductor device and a method for preparing an electrode having a graphene
07/02/2014CN103904107A 半导体装置和制造半导体装置的方法 The method of manufacturing a semiconductor device and a semiconductor device
07/02/2014CN103904096A 双面oled显示面板及制造方法 Double-sided display panel and manufacturing method oled
07/02/2014CN103904088A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
07/02/2014CN103904087A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof
07/02/2014CN103904083A W形垂直沟道3dnand闪存及其形成方法 W-shaped vertical channel flash memory and method for forming 3dnand
07/02/2014CN103904082A 非易失性存储器结构及其制造工艺 Non-volatile memory structure and manufacturing process
07/02/2014CN103904081A 非易失性存储器件及其制造方法 Non-volatile memory device and manufacturing method thereof
07/02/2014CN103904078A 高电压接面场效晶体管结构 High voltage junction field effect transistor structure
07/02/2014CN103904066A 一种倒装芯片堆叠封装结构及封装方法 A flip-chip stacked package structure and packaging method
07/02/2014CN103904065A 电阻器、显示设备和电子设备 Resistors, display device and electronic equipment
07/02/2014CN103904057A PoP封装结构及制造工艺 PoP package structure and manufacturing process
07/02/2014CN103904056A 一种PoP封装结构及制造工艺 One kind PoP package structure and manufacturing process
07/02/2014CN103904055A 一种接触孔刻蚀阻挡层结构及其制备方法 A via etch barrier layer structure and preparation method thereof contacting
07/02/2014CN103904054A 基于玻璃基板的互连结构及方法 Interconnect structure and method based on a glass substrate
07/02/2014CN103904052A 后钝化结构中的电容器及其形成方法 After the passivation structure and method of forming a capacitor
07/02/2014CN103904051A 用于经减小串扰的两层差分对布局及其制造方法 Reduce crosstalk through two differential pairs and a manufacturing method for layout
07/02/2014CN103904050A 封装基板、封装基板制作方法及封装结构 Package substrate, the package substrate fabrication method and package structure
07/02/2014CN103904049A 一种igbt模块辅助电极结构及该结构的固定方法 A fixed-electrode structure and method of the structure igbt module auxiliary
07/02/2014CN103904047A 多功能半导体封装结构及其制作方法 Multifunctional semiconductor package structure and production methods
07/02/2014CN103904046A 作为热电容和散热装置的无源组件 As passive components and heat sink thermal capacitance
07/02/2014CN103904045A 一种侧壁绝缘的圆片级csp封装结构及其封装方法 One kind of sidewall insulation csp package and wafer level packaging method
07/02/2014CN103904044A 一种扇出型晶圆级封装结构及制造工艺 One kind of fan-out wafer level package structure and manufacturing process
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