Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/11/2014US20140256161 Process sheet resistance uniformity improvement using multiple melt laser exposures
09/11/2014US20140256160 Apparatus for Manufacturing Semiconductor Device, Method of Manufacturing Semiconductor Device, and Recording Medium
09/11/2014US20140256159 Cvd precursors
09/11/2014US20140256158 Imprint mask, method for manufacturing the same, and method for manufacturing semiconductor device
09/11/2014US20140256157 Vaporizing unit, film forming apparatus, film forming method, computer program and storage medium
09/11/2014US20140256156 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
09/11/2014US20140256155 Cleaning Solution for Preventing Pattern Collapse
09/11/2014US20140256154 Interlevel dielectric stack for interconnect structures
09/11/2014US20140256153 Multilayer dielectric structures for semiconductor nano-devices
09/11/2014US20140256152 Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and recording medium
09/11/2014US20140256151 Method for removing nitride material
09/11/2014US20140256150 Wafer processing method
09/11/2014US20140256149 Method for etching high-k dielectric using pulsed bias power
09/11/2014US20140256148 Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor
09/11/2014US20140256147 Plasma processing apparatus and plasma processing method
09/11/2014US20140256146 Method and Structure to Improve Process Window for Lithography
09/11/2014US20140256145 Dsa grapho-epitaxy process with etch stop material
09/11/2014US20140256144 Semiconductor fin formation method and mask set
09/11/2014US20140256143 Method for Hard Mask Loop with Defect Reduction
09/11/2014US20140256142 Method of etching an etch layer
09/11/2014US20140256141 Methods for fabricating integrated circuits utilizing silicon nitride layers
09/11/2014US20140256140 Methods Of Forming A Pattern On A Substrate
09/11/2014US20140256139 Self-aligned trench over fin
09/11/2014US20140256138 Method and equipment for removing photoresist residue after dry etch
09/11/2014US20140256137 Method of forming a semiconductor structure including an implantation of ions into a layer of spacer material
09/11/2014US20140256136 Method for forming fin-shaped structures
09/11/2014US20140256135 Methods of removing gate cap layers in cmos applications
09/11/2014US20140256134 Method and apparatus for improving cmp planarity
09/11/2014US20140256133 Post metal chemical-mechanical planarization cleaning process
09/11/2014US20140256132 Method for patterning semiconductor structure
09/11/2014US20140256131 Selective titanium nitride removal
09/11/2014US20140256130 Front side wafer id processing
09/11/2014US20140256129 Semiconductor film deposition apparatus and method with improved heater cooling efficiency
09/11/2014US20140256128 Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
09/11/2014US20140256127 Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
09/11/2014US20140256125 Semiconductor device and method for fabricating the same
09/11/2014US20140256123 Electrically actuated device and method of controlling the formation of dopants therein
09/11/2014US20140256122 Methods And Apparatus For Carbon Ion Source Head
09/11/2014US20140256121 Techniques and apparatus for high rate hydrogen implantation and co-implantion
09/11/2014US20140256120 Process for Preparing Graphene Based on Metal Film-Assisted Annealing and the Reaction with Cl2
09/11/2014US20140256119 Cyclic epitaxial deposition and etch processes
09/11/2014US20140256118 Method for forming polysilicon using high energy radiation source
09/11/2014US20140256117 Methods of forming epitaxial layers
09/11/2014US20140256116 Semiconductor Device and Manufacturing Method Thereof
09/11/2014US20140256115 Semiconductor process
09/11/2014US20140256114 Silicon-on-insulator channels
09/11/2014US20140256113 Semiconductor Device and Method for Forming the Same
09/11/2014US20140256107 High Gate Density Devices and Methods
09/11/2014US20140256103 Method for fabricating electronic devices having semiconductor memory unit
09/11/2014US20140256097 Methods for forming integrated circuit systems employing fluorine doping
09/11/2014US20140256095 Method for manufacturing semiconductor device
09/11/2014US20140256092 Interconnect Structures and Methods of Forming Same
09/11/2014US20140256090 Selective area heating for 3d chip stack
09/11/2014US20140256088 Semiconductor device having chip mounted on an interposer
09/11/2014US20140256086 Manufacturing method of semiconductor device
09/11/2014US20140256078 Semiconductor processing by magnetic field guided etching
09/11/2014US20140256068 Adjustable laser patterning process to form through-holes in a passivation layer for solar cell fabrication
09/11/2014US20140256067 Structure and Method for E-Beam In-Chip Overlay Mark
09/11/2014US20140256066 Radiofrequency Adjustment for Instability Management in Semiconductor Processing
09/11/2014US20140256065 Etching method
09/11/2014US20140256064 Methods of repairing damaged insulating materials by introducing carbon into the layer of insulating material
09/11/2014US20140255863 Thermal treatment apparatus
09/11/2014US20140255862 Pyrometry filter for thermal process chamber
09/11/2014US20140255500 Method for preparing graphene
09/11/2014US20140255013 Lamphead pcb with flexible standoffs
09/11/2014US20140254979 Waveguide and semiconductor packaging
09/11/2014US20140254978 Simultaneous processing of multiple photonic device layers
09/11/2014US20140254292 Overlapping interconnect signal lines for reducing capacitive coupling effects
09/11/2014US20140254061 Electrostatic chuck apparatus
09/11/2014US20140253900 Chuck, a Chuck Control System, a Lithography Apparatus and a Method of Using a Chuck
09/11/2014US20140253890 Lithographic apparatus and device manufacturing method
09/11/2014US20140252971 Method of Manufacturing a Semiconductor Device
09/11/2014US20140252787 Venturi Assisted Gripper
09/11/2014US20140252710 Substrate support with integrated vacuum and edge purge conduits
09/11/2014US20140252660 Multilayer pattern transfer for chemical guides
09/11/2014US20140252657 Package Alignment Structure and Method of Forming Same
09/11/2014US20140252654 Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
09/11/2014US20140252649 Semiconductor module
09/11/2014US20140252648 Interconnect structure and method of forming the same
09/11/2014US20140252642 Chip package and method for forming the same
09/11/2014US20140252641 Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package
09/11/2014US20140252639 Integrated circuit device, method for producing mask layout, and program for producing mask layout
09/11/2014US20140252636 Interconnect structure and method of forming the same
09/11/2014US20140252634 Packaging Devices and Methods for Semiconductor Devices
09/11/2014US20140252633 Method of fabricating an air gap using a damascene process and structure of same
09/11/2014US20140252631 Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
09/11/2014US20140252630 Self-Aligned Pitch Split For Unidirectional Metal Wiring
09/11/2014US20140252628 Interconnect structure and methods of making same
09/11/2014US20140252626 Semiconductor package and method of fabricating the same
09/11/2014US20140252625 Method of Preventing a Pattern Collapse
09/11/2014US20140252624 Semiconductor Devices and Methods of Forming Same
09/11/2014US20140252623 Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same
09/11/2014US20140252622 Method for Forming Recess-Free Interconnect Structure
09/11/2014US20140252621 Method For Forming Interconnect Structure
09/11/2014US20140252620 Material and process for copper barrier layer
09/11/2014US20140252619 Interconnect structure that avoids insulating layer damage and methods of making the same
09/11/2014US20140252618 Method for forming interconnect structure that avoids via recess
09/11/2014US20140252617 Barrier layer conformality in copper interconnects
09/11/2014US20140252616 Electroless fill of trench in semiconductor structure
09/11/2014US20140252615 Semiconductor device using carbon nanotube, and manufacturing method thereof
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