Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/02/2014US8823076 Dense arrays and charge storage devices
09/02/2014US8823075 Select gate formation for nanodot flat cell
09/02/2014US8823074 Semiconductor element, semiconductor device, and method for manufacturing the same
09/02/2014US8823073 Semiconductor memory device and semiconductor memory element
09/02/2014US8823056 Semiconductor heterostructures having reduced dislocation pile-ups and related methods
09/02/2014US8823046 Light emitting diode with a current concentrating structure
09/02/2014US8823032 Light-emitting diode element, method for manufacturing light guide structure thereof and equipment for forming the same
09/02/2014US8823015 Silicon carbide epitaxial wafer and manufacturing method therefor
09/02/2014US8823013 Second Schottky contact metal layer to improve GaN schottky diode performance
09/02/2014US8823012 Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same
09/02/2014US8823004 Semiconductor device and manufacturing method thereof
09/02/2014US8823002 Method for manufacturing semiconductor device, semiconductor device, and display device
09/02/2014US8822994 Method of repairing probe pads
09/02/2014US8822993 Integrated circuit including sensor structure, related method and design structure
09/02/2014US8822985 Diode and process for making an organic light-emitting diode with a substrate planarisation layer
09/02/2014US8822971 Semiconductor memory device having three-dimensionally arranged resistive memory cells
09/02/2014US8822948 Method and apparatus for control of a plasma for spectrometry
09/02/2014US8822882 Scribing sapphire substrates with a solid state UV laser with edge detection
09/02/2014US8822830 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822828 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822817 Direct wafer bonding
09/02/2014US8822396 Solution for removing residue after semiconductor dry process and method of removing the residue using the same
09/02/2014US8822353 Systems and methods for forming a time-averaged line image
09/02/2014US8822352 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof
09/02/2014US8822351 Composition for thermosetting silcone resin
09/02/2014US8822350 Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus
09/02/2014US8822349 Oxide formation in a plasma process
09/02/2014US8822348 Dummy wafer structure and method of forming the same
09/02/2014US8822347 Wet soluble lithography
09/02/2014US8822346 Method and apparatus for self-aligned layer removal
09/02/2014US8822345 Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
09/02/2014US8822344 Method of etching an etch layer
09/02/2014US8822343 Enhanced FinFET process overlay mark
09/02/2014US8822342 Method to reduce depth delta between dense and wide features in dual damascene structures
09/02/2014US8822341 Methods of manufacturing semiconductor devices
09/02/2014US8822340 Abrasive compositions for chemical mechanical polishing and methods for using same
09/02/2014US8822339 Slurry composition for CMP, and polishing method
09/02/2014US8822338 CVD apparatus and method of forming semiconductor superlattice structure using the same
09/02/2014US8822337 Two-sided semiconductor structure
09/02/2014US8822336 Through-silicon via forming method
09/02/2014US8822335 Semiconductor device with air gap and method for fabricating the same
09/02/2014US8822334 Semiconductor structure and method for manufacturing the same
09/02/2014US8822333 Method of manufacturing a tungsten plug
09/02/2014US8822332 Method for forming gate, source, and drain contacts on a MOS transistor
09/02/2014US8822331 Anchored damascene structures
09/02/2014US8822330 Method for providing oxide layers
09/02/2014US8822329 Method for making conductive interconnects
09/02/2014US8822328 Method for patterning semiconductor structure
09/02/2014US8822327 Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
09/02/2014US8822326 Method for manufacturing Sn alloy bump
09/02/2014US8822325 Chip package and fabrication method thereof
09/02/2014US8822324 Passivated copper chip pads
09/02/2014US8822323 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/02/2014US8822322 Semiconductor devices and methods of fabricating the same
09/02/2014US8822321 Pattern forming method
09/02/2014US8822319 Method of manufacturing non-volatile memory
09/02/2014US8822318 Doping of semiconductor substrate through carbonless phosphorous-containing layer
09/02/2014US8822317 Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact
09/02/2014US8822316 Method for manufacturing semiconductor device including an inverted region formed by doping second conductive type impurities into diffusion region of a first conductive type
09/02/2014US8822315 Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices
09/02/2014US8822314 Method of growing epitaxial layers on a substrate
09/02/2014US8822313 Surface treatment methods and systems for substrate processing
09/02/2014US8822310 Method, apparatus for holding and treatment of a substrate
09/02/2014US8822309 Heterogeneous integration process incorporating layer transfer in epitaxy level packaging
09/02/2014US8822308 Methods and apparatus for transfer of films among substrates
09/02/2014US8822307 Semiconductor manufacturing apparatus and semiconductor manufacturing method
09/02/2014US8822306 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
09/02/2014US8822305 Substrate provided with semiconductor films and manufacturing method thereof
09/02/2014US8822304 Isolation structure profile for gap filing
09/02/2014US8822303 Method for manufacturing semiconductor device
09/02/2014US8822302 Methods of fabricating a storage node in a semiconductor device and methods of fabricating a capacitor using the same
09/02/2014US8822301 Profile engineered thin film devices and structures
09/02/2014US8822300 Low capacitance transient voltage suppressor (TVS) with reduced clamping voltage
09/02/2014US8822299 Method of fabricating semiconductor device
09/02/2014US8822298 Performance enhancement in transistors by reducing the recessing of active regions and removing spacers
09/02/2014US8822297 Method of fabricating MOS device
09/02/2014US8822296 Use of plate oxide layers to increase bulk oxide thickness in semiconductor devices
09/02/2014US8822294 Method for improving write margins of SRAM cells
09/02/2014US8822293 Self-aligned halo/pocket implantation for reducing leakage and source/drain resistance in MOS devices
09/02/2014US8822292 Method for forming and controlling molecular level SiO2 interface layer
09/02/2014US8822291 High voltage device
09/02/2014US8822290 FinFETs and methods for forming the same
09/02/2014US8822288 NAND memory device containing nanodots and method of making thereof
09/02/2014US8822287 Methods of manufacturing semiconductor devices
09/02/2014US8822286 Method of fabricating a flash memory comprising a high-K dielectric and a metal gate
09/02/2014US8822285 Nonvolatile memory device and method of manufacturing the same
09/02/2014US8822284 Method for fabricating FinFETs and semiconductor structure fabricated using the method
09/02/2014US8822283 Self-aligned insulated film for high-k metal gate device
09/02/2014US8822282 Methods of fabricating contact regions for FET incorporating SiGe
09/02/2014US8822281 Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
09/02/2014US8822279 Thin film transistor display panel and manufacturing method thereof
09/02/2014US8822277 Method for manufacturing light emitting diode package
09/02/2014US8822276 Magnetic integration double-ended converter
09/02/2014US8822275 Composite wafer including a molded wafer and a second wafer
09/02/2014US8822274 Packaged IC having printed dielectric adhesive on die pad
09/02/2014US8822271 Method and apparatus for manufacturing chip package
09/02/2014US8822270 Configurable passive components
09/02/2014US8822269 Semiconductor device and method of manufacturing the same
09/02/2014US8822268 Redistributed chip packages containing multiple components and methods for the fabrication thereof
09/02/2014US8822267 System in package manufacturing method using wafer-to-wafer bonding
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