Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/11/2014DE112011106054T5 Methoden der Bildung von Hetero-Schichten mit reduzierter Oberflachenrauhigkeit und Defektdichte auf ortsfremden Oberflächen und die dadurch entstehenden Strukturen Methods of formation of hetero-layers with reduced surface roughness and defect density on non-local surfaces and the resulting structures
09/11/2014DE112011106052T5 Verfahren zur Integration von dielektrischen Multigate-Transistoren in einen Tri-Gate-Prozess (FINFET) Method for the integration of multi-dielectric gate transistors in a tri-gate process (FinFET)
09/11/2014DE112011106031T5 Einaxial gespannte Nanodrahtstrukturen Uniaxially strained nanowire structures
09/11/2014DE112011106023T5 Nanodrahtstrukturen mit nicht diskreten Source- und Drain-Gebieten Nanowire structures with non-discrete source and drain regions
09/11/2014DE112011106006T5 Nanodrahtstrukturen mit Rundumkontakten Nanowire structures with round contacts
09/11/2014DE112011105995T5 Nicht-planare Rundum-Gate-Schaltung und deren Herstellungsverfahren Non-planar gate-all-around circuit, and their method of preparation
09/11/2014DE112011105987T5 Nichtplanarer III-N-Transistor Nonplanar III-N-transistor
09/11/2014DE112011105909T5 Stapelspeicher mit Schnittstelle, die Offset-Kopplungsstrukturen bereitstellt Provides stack with interface, the offset coupling structures
09/11/2014DE112011105905T5 Gestapelter Speicher, der Veränderlichkeit bei Zusammenschaltungen von Geräten erlaubt Stacked memory, the variability in interconnection of devices allowed
09/11/2014DE112011105892T5 Verpackungssubstrat für einen aktiven Chip und Verfahren zu dessen Herstellung Packaging substrate for an active chip and process for its preparation
09/11/2014DE112011105848T5 Kontrollierte Anlötchip-Integrationen an Baugruppen und Verfahren zur Montage derselben Controlled Anlötchip integrations to modules and method of assembling same
09/11/2014DE102014204114A1 Transistor mit einer Gateelektrode, die sich rund um ein oder mehrere Kanalgebiete erstreckt Transistor having a gate electrode, which extends around one or more channel regions
09/11/2014DE102014203796A1 Kontaktgeometrie mit einer von einer Transistorlänge entkoppelten Gatesiliziumlänge Contact geometry with a decoupled from a transistor gate length silicon length
09/11/2014DE102014202113A1 Infrarot-basierte Metrologie zur Erfassung von Verspannung und Defekten um Siliziumdurchkontaktierungen Infrared-based metrology for the detection of strain and defects to Siliziumdurchkontaktierungen
09/11/2014DE102014201446A1 Integrierte Schaltungen und Verfahren zum Herstellen integrierter Schaltungen mit Deckschichten zwischen Metallkontakten und Zwischenverbindungen Integrated circuits and methods for manufacturing integrated circuits with outer layers between metal contacts and interconnections
09/11/2014DE102014103050A1 Halbleiter-Bauelement und Verfahren zu dessen Herstellung A semiconductor device and method for its production
09/11/2014DE102014102944A1 Eine Package-Anordnung und ein Verfahren zur Herstellung einer Package-Anordnung A package assembly and a method of manufacturing a package assembly
09/11/2014DE102014102917A1 Abzugsstrecken Withdrawal routes
09/11/2014DE102014102910A1 Chipträgerstruktur, Chipgehäuse und Verfahren zu deren Herstellung Chip carrier structure, chip package and process for their preparation
09/11/2014DE102014102899A1 Leistungshalbleiter-Zusammenbau und -Modul Power semiconductor module assembly and
09/11/2014DE102014102500A1 System zum Simulieren einer Halbleitervorrichtung und zugehöriges Betriebsverfahren System for simulating a semiconductor device and associated operating method
09/11/2014DE102014002615A1 Chemisch-mechanisches Mehrschicht-Polierkissen Chemical mechanical polishing pad multilayer
09/11/2014DE102013204113A1 Verfahren und Maschinenträger zur Herstellung von dünnen Scheiben aus einem Materialblock Method and machine support for the preparation of thin slices from a block of material
09/11/2014DE102013203995A1 Verfahren und Vorrichtung zum Schützen eines Substrats während einer Bearbeitung mit einem Teilchenstrahl Method and apparatus for protecting a substrate during a particle beam processing with a
09/11/2014DE102013108147A1 Verfahren und Struktur für vertikalen Tunnel-Feldeffekttransistor und planare Vorrichtungen Method and structure for vertical tunnel field effect transistor and planar devices
09/11/2014DE102013106840A1 Zwischenverbindungsstruktur, die Schäden an der Isolierschicht vermeidet, und Verfahren für ihre Herstellung Interconnect structure that avoids damage to the insulating layer, and methods for their preparation
09/11/2014DE102013104481A1 FinFETs mit verspannten Bereichen und Verfahren zu deren Herstellung FinFETs with strained areas and methods for their preparation
09/11/2014DE102013104368A1 Verfahren für die Ausbildung einer Verbindungsstruktur A method for forming an interconnection structure
09/11/2014DE102013104191A1 FinFET mit gerundetem Source/Drain-Profile FinFET with a rounded source / drain profiles
09/11/2014DE102013103806A1 Zelle mit verschobener Grenze sowie Grenzverschiebungsschema Cell with shifted boundary and boundary shift scheme
09/11/2014DE102013102322A1 Verfahren und Vorrichtung zur Vermessung und Optimierung einer optoelektronischen Komponente Method and apparatus for measuring and optimizing an optoelectronic component
09/11/2014DE102013004116A1 Verfahren zum Optimieren eines Abscheidungsprozesses, Verfahren zum Einstellen einer Depositionsanlage und Depositionsanlage A method for optimizing a deposition process method for adjusting a deposition system and deposition system
09/11/2014DE102012100234B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
09/11/2014DE102010054781B4 Modul zur Reduzierung von thermomechanischem Stress und Verfahren zu dessen Herstellung Module to reduce thermo-mechanical stress and process for its preparation
09/11/2014DE102010036978B4 Bauelement mit einer ringförmigen Metallstruktur und Verfahren Component with an annular metal structure and procedures
09/11/2014DE102009043482B4 Ein Halbleiterfertigungsprozess mit dazugehörigem Apparat A semiconductor manufacturing process with associated apparatus
09/11/2014DE102007030958B4 Verfahren zum Schleifen von Halbleiterscheiben A method of grinding semiconductor wafers
09/11/2014DE102006031097B4 Speicherzellenanordnung und Verfahren zur Herstellung einer Speicherzellenanordnung Memory cell arrangement and method for fabricating a memory cell arrangement
09/11/2014DE102005030845B4 Nichtflüchtige NAND-Typ-Halbleiterspeichervorrichtungen mit Gräben und Verfahren zum Bilden derselben Non-volatile NAND-type semiconductor memory devices with trenches and method of forming same
09/10/2014EP2775534A1 Film forming device for solar cell
09/10/2014EP2775530A2 Systems and methods for separating components of a multilayer stack of electronic components
09/10/2014EP2775525A1 High dynamic range pixel having a plurality of photodiodes with a single implant
09/10/2014EP2775516A2 Balanced stress assembly for semiconductor devices with one or more devices bonded on both sides to lead frames, the other sides of the lead frames being bonded to AlN, Al2O3 or Si3N4 substrates
09/10/2014EP2775511A1 Semiconductor device and manufacturing method thereof
09/10/2014EP2775510A2 Adhesive material applicator, method of applying adhesive material, and method of manufacturing solid-state image sensing apparatus
09/10/2014EP2774743A1 Method for producing concave-convex substrate using sol-gel method, sol solution used in same, method for producing organic el element using same, and organic el element obtained thereby
09/10/2014EP2774187A1 A PROCESS OF FORMING AN ALUMINUM p-DOPED SURFACE REGION OF A SEMICONDUCTOR SUBSTRATE
09/10/2014EP2774177A1 Method and apparatus for floating or applying voltage to a well of an integrated circuit
09/10/2014EP2774176A1 Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
09/10/2014EP2774175A1 Process variation-based model optimization for metrology
09/10/2014EP2774174A2 Structures incorporating silicon nanoparticle inks, densified silicon materials from nanoparticle silicon deposits and corresponding methods
09/10/2014EP2774173A1 Interdigitated foil interconnect for rear-contact solar cells
09/09/2014US8832631 Integrated circuit apparatus, systems, and methods
09/09/2014US8832344 Baseboard, extension module, and structure for connecting baseboard and extension module
09/09/2014US8831910 Method of measuring defect density of single crystal
09/09/2014US8831899 Inspecting apparatus and an inspecting method
09/09/2014US8830751 Semiconductor memory device
09/09/2014US8830723 Method of driving nonvolatile semiconductor device
09/09/2014US8830720 Circuit and system of using junction diode as program selector and MOS as read selector for one-time programmable devices
09/09/2014US8830691 Printed circuit board and method of manufacturing printed circuit board
09/09/2014US8830486 Atmospheric molecular contamination control with local purging
09/09/2014US8830413 Peeling method and method for manufacturing display device using the peeling method
09/09/2014US8830146 EL display device, driving method thereof, and electronic equipment provided with the EL display device
09/09/2014US8830078 Method of manufacturing bearing device component coated with photoluminescence material, bearing device component and processing device
09/09/2014US8830003 Ultrasonic generator and program writing method
09/09/2014US8829968 Semiconductor integrated circuit device
09/09/2014US8829939 Shuttle plate having pockets for accomodating multiple semiconductor package sizes
09/09/2014US8829933 Semiconductor apparatus and probe test method thereof
09/09/2014US8829918 Die connection monitoring system and method
09/09/2014US8829694 Thermosetting resin compositions with low coefficient of thermal expansion
09/09/2014US8829693 Supply voltage or ground connections for integrated circuit device
09/09/2014US8829691 Light-emitting device package and method of manufacturing the same
09/09/2014US8829689 Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
09/09/2014US8829688 Semiconductor device with means for preventing solder bridges, and method for manufacturing semiconductor device
09/09/2014US8829687 Semiconductor package and fabrication method thereof
09/09/2014US8829685 Circuit device having funnel shaped lead and method for manufacturing the same
09/09/2014US8829684 Integrated circuit package
09/09/2014US8829683 Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
09/09/2014US8829681 Semiconductor device having groove-shaped via-hole
09/09/2014US8829680 Reliable packaging and interconnect structures
09/09/2014US8829678 Semiconductor package and method for manufacturing the same
09/09/2014US8829677 Semiconductor die having fine pitch electrical interconnects
09/09/2014US8829675 Repairing anomalous stiff pillar bumps
09/09/2014US8829672 Semiconductor package, package structure and fabrication method thereof
09/09/2014US8829670 Through silicon via structure for internal chip cooling
09/09/2014US8829665 Semiconductor chip and stack package having the same
09/09/2014US8829661 Warp compensated package and method
09/09/2014US8829655 Semiconductor package including a substrate and an interposer
09/09/2014US8829654 Semiconductor package with interposer
09/09/2014US8829650 Zener diode in a SiGe BiCMOS process and method of fabricating the same
09/09/2014US8829647 High temperature ALD process for metal oxide for DRAM applications
09/09/2014US8829644 Nonvolatile memory device and method of manufacturing the same
09/09/2014US8829642 Semiconductor device and method for manufacturing the same
09/09/2014US8829641 Method of forming a dual-trench field effect transistor
09/09/2014US8829637 Image sensor with controllable vertically integrated photodetectors using a buried layer
09/09/2014US8829630 Pressure sensor and method for manufacturing pressure sensor
09/09/2014US8829629 Capacitance type sensor
09/09/2014US8829622 Integrated circuit comprising an isolating trench and corresponding method
09/09/2014US8829621 Semiconductor substrate for manufacturing transistors having back-gates thereon
09/09/2014US8829620 Transistor with adjustable supply and/or threshold voltage