Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/17/2014EP2779218A2 Method of forming hemt semiconductor devices and structure therefor
09/17/2014EP2779217A2 Chemical mechanical planarization for tungsten-containing substrates
09/17/2014EP2779216A1 Polishing composition and polishing method using same, and substrate manufacturing method
09/17/2014EP2779215A1 Semiconductor device and method for producing semiconductor device
09/17/2014EP2779214A1 Semiconductor wafer with monocrystalline central region and polycrystalline edge region and process for forming thereof
09/17/2014EP2779213A1 Semiconductor wafer with a layer of AlzGa1-zN and process for producing it
09/17/2014EP2779212A2 Method of forming a high electron mobility semiconductor device
09/17/2014EP2779211A2 Metal Liftoff Tools and Methods
09/17/2014EP2778587A1 Thermal diffusion chamber with convection compressor
09/17/2014EP2778120A1 Mems sensor packaging and method thereof
09/17/2014EP2777878A1 Polishing composition
09/17/2014EP2777071A1 Low-k dielectric protection spacer for patterning through substrate vias through a low-k wiring layer
09/17/2014EP2777070A1 Method for obtaining a heterogeneous substrate for the production of semiconductors, and corresponding substrate
09/17/2014EP2777069A2 Substrate processing system and method
09/17/2014EP2777068A1 Damascene template for directed assembly and transfer of nanoelements
09/17/2014EP2777067A1 A system for use in the formation of semiconductor crystalline materials
09/17/2014EP2777066A1 Thermally stable optical sensor mount
09/17/2014EP2777065A1 A method of testing data retention of a non-volatile memory cell having a floating gate
09/16/2014US8839176 Semiconductor integrated circuit and pattern layouting method for the same
09/16/2014US8839161 Semiconductor device
09/16/2014US8837924 Vacuum heating/cooling apparatus and manufacturing method of magnetoresistance element
09/16/2014US8837923 Pulsed processing semiconductor heating methods using combinations of heating sources
09/16/2014US8837777 Wafer detecting apparatus
09/16/2014US8837223 Nonvolatile semiconductor memory device and method for manufacuring the same
09/16/2014US8837222 Methods and apparatuses including a select transistor having a body region including monocrystalline semiconductor material and/or at least a portion of its gate located in a substrate
09/16/2014US8837216 Non-volatile storage system with shared bit lines connected to a single selection device
09/16/2014US8837203 Semiconductor device
09/16/2014US8837160 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
09/16/2014US8837149 Electronic component and method of manufacturing electronic component
09/16/2014US8837108 Glass substrate-holding tool and method for producing an EUV mask blank by employing the same
09/16/2014US8836780 Process control and manufacturing method for fan out wafers
09/16/2014US8836478 Electronic device including finger sensor and related methods
09/16/2014US8836429 CMOS integrated circuit and amplifying circuit
09/16/2014US8836342 Test structure for highly accelerated electromigration tests for thick metallization systems of solid state integrated circuits
09/16/2014US8836140 Three-dimensional vertically interconnected structure
09/16/2014US8836139 CD control
09/16/2014US8836137 Method for creating a 3D stacked multichip module
09/16/2014US8836135 Semiconductor device with interconnection connecting to a via
09/16/2014US8836134 Semiconductor stacked package and method of fabricating the same
09/16/2014US8836130 Light emitting semiconductor element bonded to a base by a silver coating
09/16/2014US8836129 Plug structure
09/16/2014US8836128 Forming fence conductors in an integrated circuit
09/16/2014US8836126 Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
09/16/2014US8836125 Flexible electronic devices and related methods
09/16/2014US8836123 Methods for discretized formation of masking and capping layers on a substrate
09/16/2014US8836122 Semiconductor device having copper wiring with increased migration resistance
09/16/2014US8836121 Circuit board with twinned CU circuit layer and method for manufacturing the same
09/16/2014US8836118 Electronic device packages including bump buffer spring pads and methods of manufacturing the same
09/16/2014US8836117 Electronic device having a contact recess and related methods
09/16/2014US8836116 Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates
09/16/2014US8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
09/16/2014US8836113 Electronic module
09/16/2014US8836111 Semiconductor integrated device assembly and related manufacturing process
09/16/2014US8836110 Heat spreader for use within a packaged semiconductor device
09/16/2014US8836109 Semiconductor device and method of manufacturing a semiconductor device
09/16/2014US8836108 Circuit board structure and package structure
09/16/2014US8836105 Semiconductor device package with cap element
09/16/2014US8836102 Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
09/16/2014US8836101 Multi-chip semiconductor packages and assembly thereof
09/16/2014US8836098 Surface mount semiconductor device with solder ball reinforcement frame
09/16/2014US8836097 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding
09/16/2014US8836094 Package device including an opening in a flexible substrate and methods of forming the same
09/16/2014US8836089 Positive photosensitive resin composition, method of creating resist pattern, and electronic component
09/16/2014US8836088 Semiconductor structure having etch stop layer
09/16/2014US8836085 Cost-effective TSV formation
09/16/2014US8836084 Structure for reducing integrated circuit corner peeling
09/16/2014US8836083 Methods to reduce the critical dimension of semiconductor devices and related semiconductor devices
09/16/2014US8836081 Semiconductor structures, devices and engineered substrates including layers of semiconductor material having reduced lattice strain
09/16/2014US8836079 Metal-on-metal (MoM) capacitors having laterally displaced layers, and related systems and methods
09/16/2014US8836075 Semiconductor device and fabrication method thereof
09/16/2014US8836074 Semiconductor memory device
09/16/2014US8836073 Semiconductor device and structure
09/16/2014US8836068 Backside illumination image sensor and electronic system including the backside illumination image sensor
09/16/2014US8836059 Shape enhanced pin read head magnetic transducer with stripe height defined first and method of making same
09/16/2014US8836050 Structure and method to fabricate a body contact
09/16/2014US8836048 Field effect transistor device having a hybrid metal gate stack
09/16/2014US8836047 Reducing defect rate during deposition of a channel semiconductor alloy into an in situ recessed active region
09/16/2014US8836044 Structure and method for making low leakage and low mismatch NMOSFET
09/16/2014US8836043 Lateral bipolar junction transistor
09/16/2014US8836040 Shared-diffusion standard cell architecture
09/16/2014US8836039 Semiconductor device including high-k/metal gate electrode
09/16/2014US8836038 CMOS dual metal gate semiconductor device
09/16/2014US8836037 Structure and method to form input/output devices
09/16/2014US8836036 Method for fabricating semiconductor devices using stress engineering
09/16/2014US8836035 Method and apparatus for reducing gate resistance
09/16/2014US8836031 Electrical isolation structures for ultra-thin semiconductor-on-insulator devices
09/16/2014US8836030 Methods of forming memory cells, memory cells, and semiconductor devices
09/16/2014US8836026 High-voltage transistor having multiple dielectrics and production method
09/16/2014US8836024 Electronic device including a trench and a conductive structure therein having a contact within a Schottky region and a process of forming the same
09/16/2014US8836019 Recessed channel transistors, and semiconductor devices including a recessed channel transistor
09/16/2014US8836017 Semiconductor device and fabricating method thereof
09/16/2014US8836014 Double-gate electronic memory cell and method of manufacturing such a cell
09/16/2014US8836013 Nonvolatile memory device and method for fabricating the same
09/16/2014US8836008 Semiconductor device and method of manufacturing same
09/16/2014US8836005 Memory array
09/16/2014US8836003 Lateral epitaxial grown SOI in deep trench structures and methods of manufacture
09/16/2014US8835998 Compositionally graded heterojunction semiconductor device and method of making same
09/16/2014US8835995 Semiconductor devices including silicide regions and methods of fabricating the same
09/16/2014US8835994 Reduced corner leakage in SOI structure and method
09/16/2014US8835988 Hybrid monolithic integration
1 ... 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 ... 6590