Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/09/2014US8828141 Substrate processing apparatus and method for manufacturing semiconductor device
09/09/2014US8828140 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
09/09/2014US8827695 Wafer's ambiance control
09/09/2014US8827618 Transport system
09/09/2014US8827617 Substrate processing apparatus
09/09/2014US8827339 Robot hand
09/09/2014US8827254 Substrate transfer processing apparatus
09/09/2014US8826857 Plasma processing assemblies including hinge assemblies
09/09/2014US8826855 C-shaped confinement ring for a plasma processing chamber
09/09/2014US8826847 Imprinting apparatus, imprinting method, and manufacturing method of uneven plate
09/09/2014US8826528 Electrical connections for anodized thin film structures
09/09/2014US8826527 Electronic component-embedded printed circuit board and method of manufacturing the same
09/09/2014US8826526 Method of manufacturing multilayer wiring substrate
09/09/2014CA2829970C A reverse optical proximity correction method
09/09/2014CA2635774C Laser annealing method and laser annealing device
09/04/2014WO2014134444A1 Tunnel junction field effect transistors having self-aligned source and gate electrodes
09/04/2014WO2014134387A1 Pick-up tip assembly
09/04/2014WO2014134356A1 Dc high-voltage super-radiant free-electron based euv source
09/04/2014WO2014134338A1 Oligonucleotide functionalized quantum dots
09/04/2014WO2014134301A1 Capacitive micromachined ultrasonic transducer (cmut) device with through-substrate via (tsv)
09/04/2014WO2014134068A1 Weighted regression of thickness maps from spectral data
09/04/2014WO2014134001A1 Method for aligning a biochip
09/04/2014WO2014133967A1 Enhanced etching processes using remote plasma sources
09/04/2014WO2014133840A1 Techniques for clamping and declamping a substrate
09/04/2014WO2014133743A1 Integrated solution for solid state light sources in a process chamber
09/04/2014WO2014133722A1 Metal oxide tft stability improvement
09/04/2014WO2014133529A1 Bootstrapping and synthesis of mechanosynthesis tips
09/04/2014WO2014133465A1 A capacitively coupled electrodeless plasma apparatus and a method using capacitively coupled electrodeless plasma for processing a silicon substrate
09/04/2014WO2014133390A1 Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components
09/04/2014WO2014133267A1 Method of fabricating nitride substrate
09/04/2014WO2014133187A1 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, electronic device and compound
09/04/2014WO2014133176A1 Semiconductor device, driver circuit, and display device
09/04/2014WO2014132242A1 Segmented guard ring structures with electrically insulated gap structures and design structures thereof
09/04/2014WO2014131654A1 Method and system for naturally oxidizing a substrate
09/04/2014WO2014131461A1 Dual sti integrated circuit including fdsoi transistors and method for manufacturing the same
09/04/2014WO2014131459A1 Low leakage dual sti integrated circuit including fdsoi transistors
09/04/2014WO2014110039A8 Removal of selected portions of protective coatings from substrates
09/04/2014WO2014064153A3 Method for the metallization of blind vias
09/04/2014WO2014062377A3 Hybrid gate last integration scheme for multi-layer high-k gate stacks
09/04/2014WO2013126458A8 Improved structures, devices and methods related to copper interconnects for compound semiconductors
09/04/2014WO2010010482A9 Integrated circuit
09/04/2014US20140249777 Fault detecting system and fault detecting method
09/04/2014US20140249667 Processing Facility
09/04/2014US20140248784 Microwave processing apparatus and microwave processing method
09/04/2014US20140248783 Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording medium
09/04/2014US20140248782 Substrate processing method
09/04/2014US20140248780 Enhanced etching processes using remote plasma sources
09/04/2014US20140248779 Line width roughness improvement with noble gas plasma
09/04/2014US20140248778 Methods of forming asymmetric spacers on various structures on integrated circuit products
09/04/2014US20140248777 Resist composition and method for producing semiconductor device
09/04/2014US20140248776 Composition for polishing compound semiconductor
09/04/2014US20140248775 Cleaning agent and method for producing silicon carbide single-crystal substrate
09/04/2014US20140248774 Liquid treatment apparatus and liquid treatment method
09/04/2014US20140248773 Patterning method and method of forming memory device
09/04/2014US20140248772 Method for tuning a deposition rate during an atomic layer deposition process
09/04/2014US20140248771 Methods for forming a conductive material and methods for forming a conductive structure
09/04/2014US20140248770 Microwave-assisted heating of strong acid solution to remove nickel platinum/platinum residues
09/04/2014US20140248769 Methods of Processing Substrates and Methods of Forming Conductive Connections to Substrates
09/04/2014US20140248768 Mask Assignment Optimization
09/04/2014US20140248767 Methods Of Fabricating Integrated Circuitry
09/04/2014US20140248766 Three-dimensional semiconductor device and method of fabricating the same
09/04/2014US20140248764 Methods of forming structures on an integrated circuit product
09/04/2014US20140248763 Vertical Bit Line Non-Volatile Memory Systems And Methods Of Fabrication
09/04/2014US20140248762 Method for fabricating semiconductor device
09/04/2014US20140248761 Semiconductor device having dual metal silicide layers and method of manufacturing the same
09/04/2014US20140248759 Safe handling of low energy, high dose arsenic, phosphorus, and boron implanted wafers
09/04/2014US20140248758 Method of severing a semiconductor device composite
09/04/2014US20140248757 Wafer processing method
09/04/2014US20140248756 Method of manufacturing semiconductor device
09/04/2014US20140248755 Methods of fabricating nonvolatile memory devices including voids between active regions and related devices
09/04/2014US20140248754 Controlled air gap formation
09/04/2014US20140248751 Method and apparatus for enhancing channel strain
09/04/2014US20140248749 Stress memorization technique
09/04/2014US20140248745 Three-Dimensional Integrated Circuit (3DIC)
09/04/2014US20140248744 Semiconductor substrate and method for manufacturing semiconductor device
09/04/2014US20140248743 Semiconductor memory modules and methods of fabricating the same
09/04/2014US20140248739 Heating a furnace for the growth of semiconductor material
09/04/2014US20140248733 Method of manufacturing photoelectric conversion device
09/04/2014US20140248722 Packaging and Function Tests for Package-on-Package and System-in-Package Structures
09/04/2014US20140248721 Method of manufacturing semiconductor device and method of testing the same
09/04/2014US20140248720 Device for determining the temperature of a substrate
09/04/2014US20140248439 Pattern formation method
09/04/2014US20140247975 Source and mask optimization by changing intensity and shape of the illumination source and magnitude and phase of mask diffraction orders
09/04/2014US20140247572 Printed circuit board
09/04/2014US20140247412 Semiconductor device and method of manufacturing the same
09/04/2014US20140247204 Pixel circuit, display device, and method of driving pixel circuit
09/04/2014US20140247195 Semiconductor package including antenna substrate and manufacturing method thereof
09/04/2014US20140246791 14 lpm contact power rail
09/04/2014US20140246790 Floating bond pad for power semiconductor devices
09/04/2014US20140246783 Semiconductor device and method for manufacturing the semiconductor device
09/04/2014US20140246780 Semiconductor device including dummy pattern
09/04/2014US20140246777 Controlled metal extrusion opening in semiconductor structure and method of forming
09/04/2014US20140246775 Methods of forming non-continuous conductive layers for conductive structures on an integrated circuit product
09/04/2014US20140246774 Semiconductor device having a buffer layer and method of manufacturing the same
09/04/2014US20140246769 Semiconductor device and semiconductor device manufacturing method
09/04/2014US20140246764 Rolled-up transmission line structure for a radiofrequency integrated circuit (rfic)
09/04/2014US20140246763 Systems and methods for testing and packaging a superconducting chip
09/04/2014US20140246762 Semiconductor device having deep wells and fabrication method thereof
09/04/2014US20140246760 Charge Protection for III-Nitride Devices
09/04/2014US20140246759 Semiconductor device structures comprising a polymer bonded to a base material and methods of fabrication
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