Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/11/2014US20140252614 Surface Treatment Method and Apparatus for Semiconductor Packaging
09/11/2014US20140252611 Ball Amount Process in the Manufacturing of Integrated Circuit
09/11/2014US20140252609 Package-on-Package Structure and Methods for Forming the Same
09/11/2014US20140252608 Method and Apparatus for Packaging Pad Structure
09/11/2014US20140252601 Interconnect Structures and Methods of Forming Same
09/11/2014US20140252600 Treating Copper Surfaces for Packaging
09/11/2014US20140252599 Substrate-less interposer technology for a stacked silicon interconnect technology (ssit) product
09/11/2014US20140252596 Bump-on-Trace (BOT) Structures and Methods for Forming the Same
09/11/2014US20140252594 Package Structures and Methods for Forming the Same
09/11/2014US20140252593 Method and Apparatus for Connecting Packages onto Printed Circuit Boards
09/11/2014US20140252591 Reinforcement structure and method for controlling warpage of chip mounted on substrate
09/11/2014US20140252576 Semiconductor Device and Manufacturing Method Thereof
09/11/2014US20140252575 Lead frame for semiconductor package
09/11/2014US20140252573 Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
09/11/2014US20140252572 Structure and Method for 3D IC Package
09/11/2014US20140252568 Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
09/11/2014US20140252567 Patterned silicon-on-plastic (sop) technology and methods of manufacturing the same
09/11/2014US20140252566 Silicon-on-dual plastic (sodp) technology and methods of manufacturing the same
09/11/2014US20140252565 Nucleation Interface for High-K Layer on Germanium
09/11/2014US20140252563 Semiconductor Device with Trench Structure and Methods of Manufacturing
09/11/2014US20140252559 Multiple Edge Enabled Patterning
09/11/2014US20140252558 Methods and Apparatus for Wafer Level Packaging
09/11/2014US20140252557 Method for forming a semiconductor device and semiconductor device structures
09/11/2014US20140252556 Single-mask spacer technique for semiconductor device features
09/11/2014US20140252555 Substrate for forming elements, and method of manufacturing the same
09/11/2014US20140252553 Wafer structure and power device using the same
09/11/2014US20140252552 Semiconductor dies having substrate shunts and related fabrication methods
09/11/2014US20140252548 Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
09/11/2014US20140252540 Semiconductor Device and Method of Manufacturing Thereof
09/11/2014US20140252538 Electronic fuse with resistive heater
09/11/2014US20140252537 Package arrangement and a method of manufacturing a package arrangement
09/11/2014US20140252535 Integrated Passive Device Having Improved Linearity and Isolation
09/11/2014US20140252534 Method of making deep trench, and devices formed by the method
09/11/2014US20140252533 Insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure
09/11/2014US20140252532 Semiconductor device and method for fabricating the same
09/11/2014US20140252505 Semiconductor analysis microchip and method of manufacturing the same
09/11/2014US20140252504 Method for Fabricating a Semiconductor Device
09/11/2014US20140252503 Multi-plasma nitridation process for a gate dielectric
09/11/2014US20140252502 Multilayer dielectric structures for semiconductor nano-devices
09/11/2014US20140252497 Isolation Region Gap Fill Method
09/11/2014US20140252496 Gate Contact Structure for FinFET
09/11/2014US20140252495 Method of forming a cmos structure having gate insulation films of different thicknesses
09/11/2014US20140252492 Gate stack including a high-k gate dielectric that is optimized for low voltage applications
09/11/2014US20140252491 Semiconductor device and manufacturing method of the same
09/11/2014US20140252487 Gate Security Feature
09/11/2014US20140252485 Low-Cost CMOS Structure with Dual Gate Dielectrics and Method of Forming the CMOS Structure
09/11/2014US20140252483 Semiconductor device having finfet structures and method of making same
09/11/2014US20140252474 Method of forming finfet having fins of different height
09/11/2014US20140252470 Semiconductor Device with Integrated Electrostatic Discharge (ESD) Clamp
09/11/2014US20140252465 Semiconductor device and method of producing the same
09/11/2014US20140252464 Method of forming stacked trench contacts and structures formed thereby
09/11/2014US20140252445 Method of forming split-gate cell for non-volative memory devices
09/11/2014US20140252441 Semiconductor device and method of manufacturing same
09/11/2014US20140252434 Semiconductor device and method of manufacturing the same
09/11/2014US20140252433 Multi-Layer Metal Contacts
09/11/2014US20140252432 Semiconductor Device and Method for Forming the Same
09/11/2014US20140252429 Contact geometry having a gate silicon length decoupled from a transistor length
09/11/2014US20140252427 Self-aligned Contacts For Replacement Metal Gate Transistors
09/11/2014US20140252425 Methods of forming semiconductor device with self-aligned contact elements and the resulting devices
09/11/2014US20140252424 Methods of forming semiconductor device with self-aligned contact elements and the resulting devices
09/11/2014US20140252419 Mems device and method of manufacture
09/11/2014US20140252418 Electrical coupling of memory cell access devices to a word line
09/11/2014US20140252414 Passivated III-V or Ge Fin-Shaped Field Effect Transistor
09/11/2014US20140252412 Strained and Uniform Doping Technique for FINFETs
09/11/2014US20140252396 Highly efficient gallium nitride based light emitting diodes via surface roughening
09/11/2014US20140252376 Silicon carbide substrate, method for manufacturing same and method for manufacturing silicon carbide semiconductor device
09/11/2014US20140252375 Delamination and Crack Prevention in III-Nitride Wafers
09/11/2014US20140252373 Semiconductor Device and Method for Producing the Same
09/11/2014US20140252367 Driver for normally on iii-nitride transistors to get normally-off functionality
09/11/2014US20140252363 Three dimensional memory structure
09/11/2014US20140252359 Semiconductor Device and Method of Making
09/11/2014US20140252357 Semiconductor device
09/11/2014US20140252356 Devices and methods for measurement of magnetic characteristics of mram wafers using magnetoresistive test strips
09/11/2014US20140252355 Semiconductor device and method for producing same
09/11/2014US20140252344 P-type oxide composition, and method for producing p-type oxide composition
09/11/2014US20140252342 Encapsulation barrier stack
09/11/2014US20140252134 Insulated semiconductor faceplate designs
09/11/2014US20140251976 Hot plate and method of manufacturing the same
09/11/2014US20140251542 Wafer susceptor for forming a semiconductor device and method therefor
09/11/2014US20140251539 Substrate processing apparatus and substrate processing method
09/11/2014US20140251535 Collet Cleaning Method and Die Bonder Using the Same
09/11/2014US20140251382 Methods for Confinement of Foam Delivered by a Proximity Head
09/11/2014US20140251375 Methods and apparatus for substrate edge cleaning
09/11/2014US20140251374 Methods and apparatus for cleaning a substrate
09/11/2014US20140251214 Heated substrate support with flatness control
09/11/2014US20140251209 Support member and semiconductor manufacturing apparatus
09/11/2014US20140251207 Substrate support with multi-piece sealing surface
09/11/2014US20140250714 Supercritical drying method for semiconductor substrate and supercritical drying apparatus
09/11/2014US20140250678 Substrate transport apparatus, electronic device manufacturing system, and electronic device manufacturing method
09/11/2014US20140250658 Vacuum chambers and components for semiconductor substrate processing and methods of fabrication
09/11/2014DE19849938B4 Flashspeicher und Verfahren zu seiner Herstellung Flash memory and method for its preparation
09/11/2014DE112012005302T5 Verfahren zur Fertigung eines Epitaxialwafers A method for manufacturing an epitaxial wafer
09/11/2014DE112012005174T5 Bipolartransistorstruktur für reduzierte Stromverdichtung und Verfahren zu ihrer Herstellung Bipolar transistor structure for reduced power compression and process for their preparation
09/11/2014DE112012004985T5 Halbleitervorrichtung Semiconductor device
09/11/2014DE112012004934T5 FinFET mit verschmolzenen Rippen und vertikalem Silicid FinFET with fused ribs and vertical silicide
09/11/2014DE112012004819T5 Verfahren zum Schneiden eines Werkstücks A method for cutting a workpiece
09/11/2014DE112012004211T5 Doppelseitiges Polierverfahren Double-sided polishing process
09/11/2014DE112012004143T5 Nitridätzprozess mit hoher Selektivität Nitridätzprozess with high selectivity
09/11/2014DE112012003214T5 Halbleiter-Leistungsmodul, Herstellungsverfahren für Halbleiter-Leistungsmodul und Schaltkreissubstrat The semiconductor power module manufacturing method for semiconductor power module and circuit substrate
09/11/2014DE112011106068T5 MEMS auf Rückseite von Bulk-Silizium MEMS on back of bulk silicon
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