Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/04/2014US20140246758 Nitrogen-containing oxide film and method of forming the same
09/04/2014US20140246756 Lithography method and device
09/04/2014US20140246752 Segmented guard ring structures with electrically insulated gap structures and design structures thereof
09/04/2014US20140246751 Integrated Circuit Using Deep Trench Through Silicon (DTS)
09/04/2014US20140246734 Replacement metal gate with mulitiple titanium nitride laters
09/04/2014US20140246732 Circuit Incorporating Multiple Gate Stack Compositions
09/04/2014US20140246731 Voids in STI Regions for Forming Bulk FinFETs
09/04/2014US20140246728 Spacer elements for semiconductor device
09/04/2014US20140246720 Integrated circuit protected from short circuits caused by silicide
09/04/2014US20140246715 Decoupling capacitor for integrated circuit
09/04/2014US20140246709 Semiconductor device having a spacer and a liner overlying a sidewall of a gate structure and method of forming the same
09/04/2014US20140246697 Semiconductor Device with Charge Compensation Structure
09/04/2014US20140246695 Isolation structure of semiconductor device
09/04/2014US20140246679 III-N MATERIAL GROWN ON ErAlN BUFFER ON Si SUBSTRATE
09/04/2014US20140246651 Grown nanofin transistors
09/04/2014US20140246650 Nanostructured device
09/04/2014US20140246480 Automatic rework processes for non-stick conditions in wire bonding operations
09/04/2014US20140246422 Heating Configuration for Use in Thermal Processing Chambers
09/04/2014US20140246153 Multi-step and asymmetrically shaped laser beam scribing
09/04/2014US20140245954 Plating apparatus
09/04/2014DE19861495B3 Halbleitergeräte, Anzeigegerät und Vorrichtung Semiconductor devices, display device and device
09/04/2014DE112011106034T5 Verfahren zum Herstellen eines Halbleiterbauelementes A method of manufacturing a semiconductor device
09/04/2014DE112011106029T5 Atomare Schichtabscheidung (ALD) auf TaAIC für die Kondensatorintegration Atomic layer deposition (ALD) on TaAIC for the integration capacitor
09/04/2014DE112011106004T5 CMOS-Nanodrahtstruktur CMOS nanowire structure
09/04/2014DE112011105996T5 Halbleiterbauelement mit einem verengten Halbleiterkörper und Verfahren zum Ausbilden von Halbleiterkörpern variierender Breite A semiconductor device with a narrowed semiconductor body and method of forming semiconductor elements of varying width
09/04/2014DE112011105993T5 Prozessabstimmbarer Widerstand mit Nutzerwählbaren Werten Prozessabstimmbarer resistance with User Selectable values
09/04/2014DE112011105988T5 111-N-Materialstruktur für Gate-Aussparungstransistoren 111-N material structure for the gate recess transistors
09/04/2014DE112011105979T5 Halbleiterbauelement mit isolierten Gehäuseteilen Semiconductor component with insulated housing parts
09/04/2014DE10394239B4 Verfahren zum Verpacken integrierter Schaltungen und integriertes Schaltungsgehäuse A method of packaging of integrated circuits and integrated circuit package
09/04/2014DE10262345B4 Halbleiterbauelement mit einer Siliziumcarbidschicht mit vorbestimmtem Leitfähigkeitstyp Semiconductor device with a silicon carbide layer having a predetermined conductivity type
09/04/2014DE102013104970A1 Gekapselte Halbleitervorrichtungen und Kapselungsvorrichtungen und -verfahren Encapsulated semiconductor devices and Kapselungsvorrichtungen and procedures
09/04/2014DE102013101706A1 CVD-Vorrichtung sowie Verfahren zum Reinigen einer Prozesskammer einer CVD-Vorrichtung CVD apparatus and method for cleaning a process chamber of a CVD apparatus
09/04/2014DE102013003693A1 Verfahren und Vorrichtung zum Prüfen einer Mehrzahl von Antennen Method and apparatus for testing a plurality of antennas
09/04/2014DE102013003527A1 Vorrichtung zum Niedertemperatur-Drucksintern, Verfahren zum Niedertemperatur-Drucksintern und leistungselektronische Baugruppe Apparatus for low temperature pressure sintering method for low-temperature and high-pressure sintering electronic assembly
09/04/2014DE102008036744B4 Verfahren zum Herstellen von einer Siliziumcarbid-Halbleitervorrichtung A method for producing a silicon carbide semiconductor device
09/04/2014DE102005061820B4 Verfahren zur Herstellung einer Solarzelle A process for producing a solar cell
09/04/2014DE10162576B4 Ätzmittel und Verfahren zum Bilden eines Matrixsubstrats für Flüssigkristallanzeigevorrichtungen Etchant and method for forming a matrix substrate for liquid crystal display devices
09/03/2014EP2772951A1 Light-emitting diode, method for manufacturing light-emitting diode, light-emitting diode lamp and illumination device
09/03/2014EP2772943A1 Method for producing a microelectronic device and corresponding device
09/03/2014EP2772942A2 Capacitorless one transistor dram cell, integrated circuitry comprising an array of capacitorless one transistor dram cells, and method of forming lines of capacitorless one transistor dram cells
09/03/2014EP2772935A1 Device and method for testing of quantum cell by semiconductor probe
09/03/2014EP2772934A1 Method and system for naturally oxidizing a substrate
09/03/2014EP2772933A1 Room temperature bonding apparatus
09/03/2014EP2772804A1 Positioning and loading a substrate in an exposure apparatus
09/03/2014EP2772803A1 Positioning and loading a substrate in an exposure apparatus
09/03/2014EP2771920A1 Solution-processable tungsten oxide buffer layers and organic electronics comprising same
09/03/2014EP2771912A1 Devices including a diamond layer
09/03/2014EP2771911A1 Method for treating and directly bonding a layer of material
09/03/2014EP2771910A1 Method for the direct bonding of a silicon oxide layer
09/03/2014EP2771909A1 Device for heating a substrate
09/03/2014EP2771908A1 Flip-chip hybridization of microelectronic components by local heating of connecting elements
09/03/2014EP2771907A1 Diagnostic method and apparatus for characterization of a neutral beam and for process control therewith
09/03/2014EP2771906A1 Process for smoothing a surface via heat treatment
09/03/2014EP2771905A1 Heat removal from substrates in vacuum
09/03/2014EP2771904A2 Debonding temporarily bonded semiconductor wafers
09/03/2014EP2771903A2 Silicon carbide epitaxy
09/03/2014EP2771277A1 Methods of enriching different species of carbon nanotubes
09/02/2014USRE45106 Semiconductor structure and method of manufacture
09/02/2014US8826221 Adaptive patterning for panelized packaging
09/02/2014US8826194 Pattern data generating apparatus
09/02/2014US8825226 Deployment of mobile automated vehicles
09/02/2014US8824994 Wireless communication system
09/02/2014US8824842 Optical semiconductor device and method for fabricating the optical semiconductor device
09/02/2014US8824837 Integration of optoelectronics with waveguides using interposer layer
09/02/2014US8824774 Method and apparatus for inspecting patterns formed on a substrate
09/02/2014US8824187 Phase change memory devices and methods of manufacturing the same
09/02/2014US8824159 Three dimensional structure memory
09/02/2014US8824114 Monitor circuit for determining the lifetime of a semiconductor device
09/02/2014US8823920 Lithographic apparatus and device manufacturing method
09/02/2014US8823620 Semiconductor device, and display device and electronic device utilizing the same
09/02/2014US8823409 Semiconductor apparatus and method of testing and manufacturing the same
09/02/2014US8823309 Stage device
09/02/2014US8823187 Semiconductor package, semiconductor package manufacturing method and semiconductor device
09/02/2014US8823181 Stack semiconductor apparatus having a through silicon via and method of fabricating the same
09/02/2014US8823179 Electronic device package and method for fabricating the same
09/02/2014US8823178 Bit cell with double patterned metal layer structures
09/02/2014US8823176 Discontinuous/non-uniform metal cap structure and process for interconnect integration
09/02/2014US8823174 Electronic device
09/02/2014US8823170 Apparatus and method for three dimensional integrated circuits
09/02/2014US8823168 Die underfill structure and method
09/02/2014US8823155 Semiconductor device and method of manufacturing the same
09/02/2014US8823149 Contact landing pads for a semiconductor device and methods of making same
09/02/2014US8823147 Semiconductor substrate including doped zones forming P-N junctions
09/02/2014US8823143 Electrodeposition method for forming Ge on semiconductor substrates
09/02/2014US8823141 Semiconductor wafer, method of producing semiconductor wafer, electronic device, and method of producing electronic device
09/02/2014US8823136 On chip inductor with frequency dependent inductance
09/02/2014US8823134 Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
09/02/2014US8823131 Semiconductor devices having a trench isolation layer and methods of fabricating the same
09/02/2014US8823130 Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same
09/02/2014US8823128 Semiconductor structure and circuit with embedded Schottky diode
09/02/2014US8823123 Solid-state image sensor
09/02/2014US8823118 Spin torque transfer magnetic tunnel junction fabricated with a composite tunneling barrier layer
09/02/2014US8823110 Semiconductor device and manufacturing method of the same
09/02/2014US8823108 CMOS fabrication
09/02/2014US8823107 Method for protecting the gate of a transistor and corresponding integrated circuit
09/02/2014US8823099 Semiconductor device having gradient doping profile
09/02/2014US8823092 Semiconductor device and manufacturing method thereof
09/02/2014US8823091 Semiconductor device having saddle fin transistor and manufacturing method of the same
09/02/2014US8823087 Semiconductor device including auxiliary structure and methods for manufacturing a semiconductor device
09/02/2014US8823079 Semiconductor device and method for manufacturing same