Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/28/2014US20140242792 Method for Forming Semiconductor Device
08/28/2014US20140242790 Method of manufacturing semiconductor device
08/28/2014US20140242789 Semiconductor device manufacturing method
08/28/2014US20140242788 Method of forming a high quality interfacial layer for a semiconductor device by performing a low temperature ald process
08/28/2014US20140242787 Photosensitive resin composition and method for producing semiconductor device
08/28/2014US20140242785 Semiconductor films on sapphire glass
08/28/2014US20140242784 Method for forming a graphene layer on the surface of a substrate including a silicon layer
08/28/2014US20140242783 Reactor and method for production of silicon by chemical vapor deposition
08/28/2014US20140242782 Methods of transferring semiconductor elements and manufacturing semiconductor devices
08/28/2014US20140242781 Coating adhesives onto dicing before grinding and micro-fabricated wafers
08/28/2014US20140242780 Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
08/28/2014US20140242779 Semiconductor device manufacturing method and manufacturing apparatus
08/28/2014US20140242778 Methods of Forming Strained-Semiconductor-on-Insulator Device Structures
08/28/2014US20140242777 Method for Bonding Semiconductor Devices
08/28/2014US20140242775 Method of fabricating finfets
08/28/2014US20140242772 Method for fabricating semiconductor device
08/28/2014US20140242769 Method of manufacturing a super-junciton semiconductor device
08/28/2014US20140242768 Reducing wafer distortion through a high cte layer
08/28/2014US20140242767 Method of manufacturing a semiconductor device
08/28/2014US20140242760 Semiconductor radio frequency switch with body contact
08/28/2014US20140242759 Reducing wafer distortion through a high cte layer
08/28/2014US20140242758 Wafer and method for forming the same
08/28/2014US20140242757 Adhesive for electronic component
08/28/2014US20140242756 Method for preparing semiconductor devices applied in flip chip technology
08/28/2014US20140242755 Making an integtated circuit module with dual leadframes
08/28/2014US20140242754 Multi-chip package and method of manufacturing the same
08/28/2014US20140242753 Flip chip packaging method, and flux head manufacturing method applied to the same
08/28/2014US20140242750 Polishing slurry, and polishing method
08/28/2014US20140242749 Method for manufacturing semiconductor device
08/28/2014US20140242747 Thin Film Deposition of Materials by External Induced Release from a Ribbon Tape
08/28/2014US20140242742 Wafer packaging method
08/28/2014US20140242741 Material for forming passivation film for semiconductor substrate, passivation film for semiconductor substrate and method of producing the same, and photovoltaic cell element and method of producing the same
08/28/2014US20140242735 Method for Aligning a Biochip
08/28/2014US20140242734 Leadframe, semiconductor device, and method of manufacturing the same
08/28/2014US20140242733 Reflective mask, method of monitoring the same, and method of manufacturing semiconductor device
08/28/2014US20140242732 Ion implantation apparatus and method of determining state of ion implantation apparatus
08/28/2014US20140242731 System and method for performing a wet etching process
08/28/2014US20140242730 Spectraphic monitoring based on pre-screening of theoretical library
08/28/2014US20140242729 Substrate warp correcting device and substrate warp correcting method
08/28/2014US20140242530 Substrate heat treatment apparatus and method
08/28/2014US20140242367 Barrier film and methods of making same
08/28/2014US20140242323 Reactive hot-melt adhesive for use on electronics
08/28/2014US20140241848 Electric switchable magnet slitvalve
08/28/2014US20140241836 Substrate transporting apparatus, substrate delivery position confirming method, and substrate processing system
08/28/2014US20140241707 Integrated solution for solid state light sources in a process chamber
08/28/2014US20140241682 Photonic device structure and method of manufacture
08/28/2014US20140241053 Trench isolation implantation
08/28/2014US20140240892 Electrostatic chuck, reticle, and electrostatic chuck method
08/28/2014US20140240891 Techniques for clamping and declamping a substrate
08/28/2014US20140240704 Measurement mark, method for measurement, and measurement apparatus
08/28/2014US20140240685 Exposure apparatus, exposure method, and method for producing device
08/28/2014US20140240683 Focus position adjusting apparatus, reticle, focus position adjusting program, and method of manufacturing semiconductor device
08/28/2014US20140239569 Universal clamping fixture to maintain laminate flatness during chip join
08/28/2014US20140239516 Carbosilane Polymer Compositions for Anti-Reflective Coatings
08/28/2014US20140239512 Connections for memory electrode lines
08/28/2014US20140239507 Peripheral Electrical Connection of Package on Package
08/28/2014US20140239503 Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects
08/28/2014US20140239502 Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
08/28/2014US20140239501 Integrated circuit interconnects and methods of making same
08/28/2014US20140239500 Integrated circuit (ic) having electrically conductive corrosion protecting cap over bond pads
08/28/2014US20140239497 Packaged semiconductor device
08/28/2014US20140239490 Packaging substrate and fabrication method thereof
08/28/2014US20140239487 Heat pipe in overmolded flip chip package
08/28/2014US20140239484 Method for forming sintered silver coating film, baking apparatus, and semiconductor device
08/28/2014US20140239483 Heat spreading in molded semiconductor packages
08/28/2014US20140239482 Integrated heat spreader for multi-chip packages
08/28/2014US20140239479 Microelectronic package including an encapsulated heat spreader
08/28/2014US20140239476 Semiconductor device with integral heat sink
08/28/2014US20140239474 Chip arrangement and a method for manufacturing a chip arrangement
08/28/2014US20140239472 Dual-flag stacked die package
08/28/2014US20140239471 Ic package with stainless steel leadframe
08/28/2014US20140239465 Semiconductor package having a waveguide antenna and manufacturing method thereof
08/28/2014US20140239464 Semiconductor packages with thermal-enhanced conformal shielding and related methods
08/28/2014US20140239462 Pecvd films for euv lithography
08/28/2014US20140239461 Oxygen Monolayer on a Semiconductor
08/28/2014US20140239460 Semiconductor Device Having an Insulating Layer Structure and Method of Manufacturing the Same
08/28/2014US20140239459 Method for producing mechanically flexible silicon substrate
08/28/2014US20140239456 Semiconductor wafer and its manufacture method, and semiconductor chip
08/28/2014US20140239453 Multiple bonding layers for thin-wafer handling
08/28/2014US20140239450 Guard structure for semiconductor structure and method of forming guard layout pattern for semiconductor layout pattern
08/28/2014US20140239444 Buried tsv's used for decaps
08/28/2014US20140239442 Electroless plated material formed directly on metal
08/28/2014US20140239441 Semiconductor device and method of manufacturing the same
08/28/2014US20140239440 Thin Beam Deposited Fuse
08/28/2014US20140239438 Semiconductor device
08/28/2014US20140239437 Semiconductor device
08/28/2014US20140239436 High voltage fast recovery trench diode
08/28/2014US20140239427 Integrated Antenna on Interposer Substrate
08/28/2014US20140239418 Semiconductor Dielectric Interface and Gate Stack
08/28/2014US20140239415 Stress memorization in rmg finfets
08/28/2014US20140239411 Through Vias and Methods of Formation Thereof
08/28/2014US20140239407 Replacement metal gate transistor with controlled threshold voltage
08/28/2014US20140239404 FInFET Structure and Method for Forming the Same
08/28/2014US20140239396 Metal Gate and Gate Contact Structure for FinFET
08/28/2014US20140239394 U-shaped semiconductor structure
08/28/2014US20140239390 Lateral devices containing permanent charge
08/28/2014US20140239388 Termination trench for power mosfet applications
08/28/2014US20140239387 MOS Transistor Structure and Method
08/28/2014US20140239377 Manufacturing method of semiconductor device, and semiconductor device
08/28/2014US20140239376 Vertical memory devices and methods of manufacturing the same
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