Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/28/2014US20140239368 Semiconductor storage device and method of manufacturing the same
08/28/2014US20140239363 Capacitors comprising slot contact plugs and methods of forming the same
08/28/2014US20140239360 Semiconductor device and a method of manufacturing the same, and solid-state image pickup device using the same
08/28/2014US20140239347 Structure and Method for Defect Passivation To Reduce Junction Leakage For FinFET Device
08/28/2014US20140239345 Strained transistor integration for cmos
08/28/2014US20140239309 Heterostructure Power Transistor With AlSiN Passivation Layer
08/28/2014US20140239308 Mix doping of a semi-insulating group iii nitride
08/28/2014US20140239307 REO GATE DIELECTRIC FOR III-N DEVICE ON Si SUBSTRATE
08/28/2014US20140239303 Semiconductor devices including wisx and methods of fabrication
08/28/2014US20140239300 Semiconductor test device and method for fabricating the same
08/28/2014US20140239298 Semiconductor device and method for manufacturing semiconductor device
08/28/2014US20140239292 Methods of forming oxide thin film and electrical devices and thin film transistors using the methods
08/28/2014US20140239256 Method of manufacturing graphene laminated structure, graphene laminated structure, and electronic device including the graphene laminated structure
08/28/2014US20140239249 Rapid biological synthesis process to produce semiconducting chalcogenide nanostructures for transistor or solar cell applications
08/28/2014US20140239247 Transistor, resistance variable memory device including the same, and manufacturing method thereof
08/28/2014US20140238972 Thermal processing apparatus and method of controlling the same
08/28/2014US20140238896 Substrate container having limit structure
08/28/2014US20140238851 Structure of reaction chamber of semiconductor sputtering equipment
08/28/2014US20140238618 Die ejector and die separation method
08/28/2014US20140238609 Mounting table and plasma processing apparatus
08/28/2014US20140238605 Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
08/28/2014US20140238574 Design of a mold for forming complex 3d mems components
08/28/2014US20140238452 Apparatus and method for cleaning semiconductor substrate
08/28/2014US20140238443 Nozzle assembly, substrate treatment apparatus including the nozzle assembly, and method of treating substrate using the assembly
08/28/2014US20140238105 Device for detecting evaporation source and method for applying the same
08/28/2014US20140237815 Stiffener frame fixture
08/28/2014US20140237812 High load and high precision polygonal guide, and picker actuator using same
08/28/2014DE112013000373T5 Dicke On-Chip-Verdrahtungsstrukturen mit hoher Leistungsfähigkeit Thickness on-chip wiring structures with high efficiency
08/28/2014DE112013000360T5 Halbleitereinheit mit einem Low-k-Abstandhalter und Verfahren zur Herstellung derselben Semiconductor device with a low-k spacers and methods for making same
08/28/2014DE112012005285T5 Nahinfrarot-absorbierende Dünnschichtzusammensetzung für eine lithographische Anwendung Near-infrared absorbing film composition for lithographic applications
08/28/2014DE112012004917T5 Verfahren zum Verhindern eines elektrischen Kurzschlusses in einem Halbleiterschichtstapel, CPV-Zelle mit dünnem Substrat und Solarzellenanordnung A method for preventing an electrical short circuit in a semiconductor layer stack, CPV-cell with thin substrate and solar cell arrangement
08/28/2014DE112012004882T5 Verbesserung von Metallkontakten zu Gruppe-IV-Halbleitern durch Einfügung grenzflächiger atomischer Monoschichten Improvement of metal contacts to group-IV semiconductors by introducing cross-scale atomic monolayers
08/28/2014DE112012004880T5 Kammerdichtungselement Chamber sealing element
08/28/2014DE112011106033T5 Halbleiterbauelemente mit einer aktiven Germaniumschicht mit darunterliegender Diffusionssperrschicht Semiconductor devices with an active layer with germanium underlying diffusion barrier layer
08/28/2014DE112011105805T5 Ätzstop-Schichten und Kondensatoren Etch stop layers and capacitors
08/28/2014DE112011105635T5 Systeme und Verfahren zum Vereinzeln von Materialien Systems and methods for separating materials
08/28/2014DE112011105633T5 Siliziumkarbidhalbleitervorrichtung und Verfahren zu ihrer Herstellung Silicon carbide semiconductor device and process for their preparation
08/28/2014DE10314307B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Kondensator A method for producing a semiconductor device having capacitor
08/28/2014DE102014203427A1 Elektronisches Bauteil und elektronische Vorrichtung Electronic component and electronic device
08/28/2014DE102014102364A1 Mehrchipbaugruppe mit getrennten zwischenverbindungen zwischen chips Multi-chip module with separate between connections between chips
08/28/2014DE102014102359A1 Revolverkopf-Handhabungsvorrichtungen und Betriebsverfahren dafür Turret-handling devices and operating method therefor
08/28/2014DE102014102242A1 Verfahren und Vorrichtung zur Beschichtung mit porösem Metall und Vorrichtungen mit derartiger Beschichtung Method and apparatus for coating with porous metal, and devices having such coating
08/28/2014DE102014102118A1 Halbleiterbauelement Semiconductor device
08/28/2014DE102014101408A1 Chipanordnung und Verfahren zur Herstellung einer Chipanordnung Chip arrangement and method for producing a chip arrangement
08/28/2014DE102014101407A1 Eine Chipanordnung und ein Verfahren zum Herstellen einer Chipanordnung A chip assembly and a method for producing a chip arrangement
08/28/2014DE102014101074A1 Durchkontaktierungen und Verfahren zu ihrer Ausbildung Vias and methods of training
08/28/2014DE102013225320A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
08/28/2014DE102013213135B3 Verfahren zum Weichlöten von Halbleiterchips auf Substrate und Verfahren zum Herstellen eines Leistungshalbleitermoduls A method of soft soldering semiconductor chips to substrates and method for producing a power semiconductor module
08/28/2014DE102013203350A1 Elektronisches Bauelement und Verfahren zu seiner Herstellung An electronic device and method for its preparation
08/28/2014DE102013203212A1 Verfahren zur Herstellung eines Solarmoduls und Anordnung zur Herstellung von Teil-Solarzellen A process for producing a solar module and arrangement for the production of solar cell sub-
08/28/2014DE102013104070A1 Schichtweises elektrochemisches Plattierungsverfahren (ECP) Layer-by electrochemical plating (ECP)
08/28/2014DE102013104015A1 Verfahren für die Ausbildung eines Halbleiterbauteils A method for forming a semiconductor device
08/28/2014DE102013102540A1 Metall-Keramik-Substrat, Modulanordnung sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate, module assembly and method of manufacturing a metal-ceramic substrate
08/28/2014DE102012205320B4 Verfahren mit Polysiliziumentfernung durch Trockenätzung in Austauschgates Method with polysilicon removal by dry etching in exchange Gates
08/28/2014DE102010049326B4 Elektrische Verbindungsvorrichtung und Testsystem zur Verwendung derselben The electrical connection apparatus and test system for using the same
08/28/2014DE102009021083B4 Chipträger und Halbleiter-Bauelement Chip carrier and semiconductor device
08/28/2014DE102008047378B4 Leistungsbauelemente und Verfahren zum Herstellen eines Leistungsbauelements sowie zum Herstellen einer Maske für eine Metallisierung Power devices and methods for producing a power component and for producing a mask for metallization
08/28/2014DE102008023622B4 Verfahren zum Herstellen einer DRAM-Vorrichtung mit einer dielektrischen Gate-Schicht mit mehreren Dicken A method for manufacturing a DRAM device with a gate dielectric layer having a plurality of thicknesses
08/28/2014DE102005060083B4 Halbleiterspeicherbauelement, Verfahren zu dessen Ausbildung, Speicherzelle und Verfahren zu deren Ausbildung A semiconductor memory device, process for its formation, the memory cell and method for their formation
08/28/2014DE102004060378B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
08/28/2014DE102004039981B4 MOS-Gatterverknüpfte Vorrichtung vom Grabentyp mit einer verspannten Schicht an der Grabenseitenwand MOS gate Linked device type from the grave with a strained layer at the grave side wall
08/27/2014EP2770545A2 Growth substrate, nitride semiconductor device and method of manufacturing the same
08/27/2014EP2770544A1 Method for forming metal silicide layers
08/27/2014EP2770538A1 Fin type semiconductor structure suitable for producing esd protection device
08/27/2014EP2770537A1 Silicon carbide semiconductor device and method for manufacturing same
08/27/2014EP2770534A1 Semiconductor device and method of manufacturing the same
08/27/2014EP2770529A2 Semiconductor device and method for manufacturing the same
08/27/2014EP2770528A1 Solder bump formation method and device
08/27/2014EP2770526A1 Oxygen monolayer on a semiconductor
08/27/2014EP2770525A1 Method for producing transparent soi wafers
08/27/2014EP2770524A1 Method for reclaiming peeled-off wafer
08/27/2014EP2769597A2 High definition heater and method of operation
08/27/2014EP2769416A2 Method for producing an organised network of semiconductor nanowires made of zno
08/27/2014EP2769414A1 Memory cells and memory cell arrays
08/27/2014EP2769413A1 Memristive element based on hetero-junction oxide
08/27/2014EP2769412A1 Microelectronic package with stacked microelectronic units and method for manufacture thereof
08/27/2014EP2769411A1 Package-on-package assembly with wire bond vias
08/27/2014EP2769407A1 Techniques for tiling arrays of pixel elements
08/27/2014EP2769406A1 Low warpage wafer bonding through use of slotted substrates
08/27/2014EP2769405A1 Method of increasing the thickness of colloidal nanosheets and materials consisting of said nanosheets
08/27/2014EP2769404A1 Process for the thickness growth of colloidal nanosheets and materials composed of said nanosheets
08/27/2014EP2769403A1 Improved biomarkers and use thereof
08/27/2014EP2769249A1 Method for producing a refractive or diffractive optical device
08/27/2014EP2769188A1 Device for determining the temperature of a substrate
08/27/2014EP2769003A1 A single crystal high dielectric constant material
08/27/2014EP2768920A1 Non-amine post-cmp composition and method of use
08/26/2014US8818545 Semiconductor fabrication apparatus and temperature adjustment method
08/26/2014US8818265 Interface for communication between voltage domains
08/26/2014US8818146 Silica-on-silicon waveguides and related fabrication methods
08/26/2014US8818144 Process for preparing an optical interposer for waveguides
08/26/2014US8817559 Semiconductor device and manufacturing method thereof
08/26/2014US8817449 Substrate holding device
08/26/2014US8817430 AC voltage controller
08/26/2014US8817262 Method for determining the doping profile of a partially activated doped semiconductor region
08/26/2014US8817230 Immersion photolithography system and method using microchannel nozzles
08/26/2014US8817144 Photoelectric conversion apparatus
08/26/2014US8816715 MOS test structure, method for forming MOS test structure and method for performing wafer acceptance test
08/26/2014US8816565 Two-dimensional comb-drive actuator and manufacturing method thereof
08/26/2014US8816515 Semiconductor module having sliding case and manufacturing method thereof
08/26/2014US8816509 Semiconductor package including underfill layers
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