Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/18/2014WO2014142031A1 Substrate processing device, method for controlling substrate processing device, cleaning method, method for manufacturing semiconductor device, and recording medium
09/18/2014WO2014142023A1 Plasma cvd device and plasma cvd method
09/18/2014WO2014141975A1 Bonding wire
09/18/2014WO2014141974A1 Cooling plate, method for manufacturing same, and semiconductor manufacturing device member
09/18/2014WO2014141972A1 Method for manufacturing semiconductor light-emitting element
09/18/2014WO2014141969A1 Resin composition for plating resist and method for producing substrate using same
09/18/2014WO2014141959A1 METHOD AND DEVICE FOR MANUFACTURING GALLIUM NITRIDE (GaN) FREE-STANDING SUBSTRATE
09/18/2014WO2014141890A1 Substrate processing device
09/18/2014WO2014141889A1 Polishing pad and polishing method
09/18/2014WO2014141876A1 Pattern forming method, active light-sensitive or radiation-sensitive resin composition for organic solvent development used in same, method for producing active light-sensitive or radiation-sensitive resin composition for organic solvent development, method for manufacturing electronic device, and electronic device
09/18/2014WO2014141858A1 Active light-sensitive or radiation-sensitive resin composition, resist film using active light-sensitive or radiation-sensitive resin composition, pattern forming method, method for manufacturing electronic device, and electronic device
09/18/2014WO2014141846A1 Method for forming organic semiconductor film
09/18/2014WO2014141838A1 Process for forming organic semiconductor film
09/18/2014WO2014141827A1 Pattern forming method, active light-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device, and electronic device
09/18/2014WO2014141807A1 Pattern forming method, composition kit, resist film, method for manufacturing electronic device using pattern forming method, and electronic device
09/18/2014WO2014141775A1 Charged particle radiation apparatus
09/18/2014WO2014141754A1 Silicon carbide semiconductor device
09/18/2014WO2014141740A1 Modified phenolic novolac resin, resist material, coating film, and permanent resist film
09/18/2014WO2014141739A1 Defect inspection method and device using same
09/18/2014WO2014141664A1 Etching method and etching apparatus
09/18/2014WO2014141662A1 Metal induced nanocrystallization of amorphous semiconductor quantum dots
09/18/2014WO2014141607A1 Semiconductor device and method of manufacturing semiconductor device
09/18/2014WO2014141601A1 Film formation method, method for manufacturing semiconductor light-emitting element, semiconductor light-emitting element, and lighting apparatus
09/18/2014WO2014141580A1 Method for treating washing tank
09/18/2014WO2014141563A1 Substrate processing device, semiconductor device manufacturing method, substrate storage unit conveyance method and program
09/18/2014WO2014141514A1 Flip chip bonder and flip chip bonding method
09/18/2014WO2014141485A1 Method for manufacturing semiconductor device having sgt
09/18/2014WO2014141472A1 Semiconductor device, and manufacturing method for same
09/18/2014WO2014141399A1 Semiconductor device
09/18/2014WO2014140796A1 Wafer-level flip chip device packages and related methods
09/18/2014WO2014140672A1 Bis(alkylimido)-bis(alkylamido)molybdenum molecules for deposition of molybdenum-containing films
09/18/2014WO2014140372A1 Light emitting diode semiconductor structures having active regions comprising ingan
09/18/2014WO2014140371A1 Semiconductor structures having active regions comprising ingan, methods of forming such semiconductor structures, and light emitting devices formed from such semiconductor structures
09/18/2014WO2014140370A1 Semiconductor light emitting structure having active region comprising ingan and method of its fabrication
09/18/2014WO2014139793A1 Methods for providing lithography features on a substrate by self-assembly of block copolymers
09/18/2014WO2014139674A1 Electronic sub-assembly and method for the production of an electronic sub-assembly
09/18/2014WO2014139291A1 Manufacturing method of polycrystalline silicon layer, and polycrystalline silicon thin film transistor and manufacturing method thereof
09/18/2014WO2014139283A1 Array substrate and manufacturing method thereof, and display apparatus
09/18/2014WO2014139187A1 Hole wall metalizing process during production of ceramic shells
09/18/2014WO2014139167A1 Transistor with modified gate structure
09/18/2014WO2014138869A1 Structure and method for manufacture of memory device with thin silicon body
09/18/2014US20140279750 Method and system for identifying a clean endpoint time for a chamber
09/18/2014US20140278197 4 Port L-2L De-Embedding Method
09/18/2014US20140278177 Method and apparatus for low latency communication in an automatic testing system
09/18/2014US20140277682 Processing System and Method for Providing a Heated Etching Solution
09/18/2014US20140275929 Neural sensing device and method for making the same
09/18/2014US20140275911 Neural sensing device and method for making the same
09/18/2014US20140273539 Methods for conformal treatment of dielectric films with low thermal budget
09/18/2014US20140273538 Non-ambipolar electric pressure plasma uniformity control
09/18/2014US20140273537 High density plasma reactor with multiple top coils
09/18/2014US20140273536 Charged particle beam writing apparatus, aperture unit, and charged particle beam writing method
09/18/2014US20140273535 Systems and Methods of Laser Texturing and Crystallization of Material Surfaces
09/18/2014US20140273534 Integration of absorption based heating bake methods into a photolithography track system
09/18/2014US20140273533 Semiconductor Annealing Method Utilizing a Vacuum Environment
09/18/2014US20140273532 Processing system for electromagnetic wave treatment of a substrate at microwave frequencies
09/18/2014US20140273531 Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES
09/18/2014US20140273530 Post-Deposition Treatment Methods For Silicon Nitride
09/18/2014US20140273529 PEALD of Films Comprising Silicon Nitride
09/18/2014US20140273528 Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES
09/18/2014US20140273527 Methods for forming silicon nitride thin films
09/18/2014US20140273526 Atomic Layer Deposition Of Films Comprising Si(C)N Using Hydrazine, Azide And/Or Silyl Amine Derivatives
09/18/2014US20140273525 Atomic Layer Deposition of Reduced-Leakage Post-Transition Metal Oxide Films
09/18/2014US20140273524 Plasma Doping Of Silicon-Containing Films
09/18/2014US20140273523 Multi-step bake apparatus and method for directed self-assembly lithography control
09/18/2014US20140273522 Multi-step bake apparatus and method for directed self-assembly lithography control
09/18/2014US20140273521 Photoresist system and method
09/18/2014US20140273520 Enhanced productivity for an etch system through polymer management
09/18/2014US20140273519 Hydrogen-plasma process for surface preparation prior to insulator deposition on compound semiconductor materials
09/18/2014US20140273518 Methods for forming layers on semiconductor substrates
09/18/2014US20140273517 Nh3 containing plasma nitridation of a layer of a three dimensional structure on a substrate
09/18/2014US20140273516 Vbd and tddb improvement thru interface engineering
09/18/2014US20140273515 Integrated platform for fabricating n-type metal oxide semiconductor (nmos) devices
09/18/2014US20140273514 Topography minimization of neutral layer overcoats in directed self-assembly applications
09/18/2014US20140273513 Resist composition and manufacturing method of semiconductor device
09/18/2014US20140273512 Trialkylsilane silicon precursor compound, method of forming a layer using the same, and semiconductor device including the layer
09/18/2014US20140273511 Methods for fabricating integrated circuits including formation of chemical guide patterns for directed self-assembly lithography
09/18/2014US20140273510 Silane and borane treatments for titanium carbide films
09/18/2014US20140273509 Method and Apparatus for Planarization of Substrate Coatings
09/18/2014US20140273508 Wafer Back Side Processing Structure and Apparatus
09/18/2014US20140273507 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
09/18/2014US20140273506 Unlocking Layer and Method
09/18/2014US20140273505 Semiconductor apparatus with transportable edge ring for substrate transport
09/18/2014US20140273504 Selective deposition by light exposure
09/18/2014US20140273503 Methods of gas distribution in a chemical vapor deposition system
09/18/2014US20140273502 Techniques to mitigate straggle damage to sensitive structures
09/18/2014US20140273501 Wet strip process for an antireflective coating layer
09/18/2014US20140273500 Metal liftoff tools and methods
09/18/2014US20140273499 Method and Apparatus for Localized and Controlled Removal of Material from a Substrate
09/18/2014US20140273498 Substrate processing apparatus and substrate processing method
09/18/2014US20140273497 Wet Processing Systems and Methods with Replenishment
09/18/2014US20140273496 Method of removing a metal hardmask
09/18/2014US20140273495 Non-volatile memory devices and methods of fabricating the same
09/18/2014US20140273494 Parallel plate dry etching apparatus and method for manufacturing semiconductor device using same
09/18/2014US20140273493 Hydrogen Plasma Cleaning of Germanium Oxide Surfaces
09/18/2014US20140273492 Methods Of Etching Films Comprising Transition Metals
09/18/2014US20140273491 Dry-etch for silicon-and-carbon-containing films
09/18/2014US20140273490 Method for improving cd micro-loading in photomask plasma etching
09/18/2014US20140273489 Processing systems and methods for halide scavenging
09/18/2014US20140273488 Processing systems and methods for halide scavenging
09/18/2014US20140273487 Pulsed dc plasma etching process and apparatus
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