H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/07/2011	EP1720199B1 Optical system, exposure system, and exposure method
12/07/2011	EP1665348B1 Method and device
12/07/2011	EP1579488B1 Method of manufacturing a semiconductor device
12/07/2011	EP1390964B1 Dipole ion source
12/07/2011	EP1388159B1 Magnetic mirror plasma source
12/07/2011	EP1328969B1 Method of manufacturing a mos transistor
12/07/2011	CN202067823U 一种新型太阳能边框组装机 A new solar frame assembly machine
12/07/2011	CN202067787U 托盘组件和具有该托盘组件的基片处理设备 Tray assembly and the substrate processing apparatus having the tray assembly
12/07/2011	CN202067786U 基底支撑组件 Substrate support assembly
12/07/2011	CN202067785U 定位块 Positioning block
12/07/2011	CN202067784U 承载板 Bearing plate
12/07/2011	CN202067783U 承载架 Carriages
12/07/2011	CN202067782U 一种金属外壳烧结用模具 Sintered metal shell mold
12/07/2011	CN202067781U 一种台阶型带材的厚度控制装置 Stepped a strip thickness control device
12/07/2011	CN202067780U 一种控制引线高度一致性的金属封装外壳烧结模具 A method of controlling the consistency of the metal wire height encapsulation shell sintering mold
12/07/2011	CN202067779U 一种半导体硬质合金引线框架冲模整形卸料结构 A semiconductor die hard alloy lead frame plastic discharge structure
12/07/2011	CN202067778U 可减少半导体基材毛边的热裁切装置 A semiconductor substrate can reduce hot flash cutting device
12/07/2011	CN202067777U 直立式基板湿制程浸泡装置 Vertical substrate soaked wet process equipment
12/07/2011	CN202067075U 一种减压干燥设备 One kind of vacuum drying equipment
12/07/2011	CN1992168B 第iii族氮化物晶体物质的制造方法和制造装置 Manufacturing method and apparatus iii nitride crystal substance
12/07/2011	CN1991593B 支持机构及使用支持机构的掩模载台 Support organizations and agencies that support the mask stage
12/07/2011	CN1979344B 使用曝光掩模的曝光方法 Exposure method using an exposure mask
12/07/2011	CN1871711B 显示器件及其制造方法,以及电视接收机 Display device and manufacturing method thereof, and a television receiver
12/07/2011	CN1866030B 探针卡及微小结构体的检查装置 Probe card inspection apparatus and micro structure
12/07/2011	CN1716587B 内插器及其制造方法以及使用该内插器的半导体器件 Interpolator using the method of manufacturing the interposer and a semiconductor device
12/07/2011	CN1656598B 大型基材测试系统 Large base test system
12/07/2011	CN102273017A 电气部件和用于这种部件的排针 Electrical components and parts for this pin
12/07/2011	CN102272934A 场效应晶体管、场效应晶体管的制造方法以及生物传感器 Field effect transistor, the field effect transistor, and a method of manufacturing a biosensor
12/07/2011	CN102272933A 隧道场效应晶体管及其制造方法 Tunneling field effect transistor and manufacturing method thereof
12/07/2011	CN102272929A 具有集成的高k电介质和基于金属的控制栅的闪存单元 High-k dielectric and a metal-based control gate of flash memory cells having an integrated
12/07/2011	CN102272928A 嵌入式存储器单元及其制造方法 Embedded memory cell and its manufacturing method
12/07/2011	CN102272927A 半导体存储器的制造方法 The method of manufacturing a semiconductor memory
12/07/2011	CN102272925A 用于制造照明用具的方法 Method for manufacturing lighting appliances
12/07/2011	CN102272918A 半导体存储装置 The semiconductor memory device
12/07/2011	CN102272917A 半导体集成电路 The semiconductor integrated circuit
12/07/2011	CN102272916A 具有熔丝型硅通孔的3d芯片叠层 3d chip stack has a fuse-type silicon vias
12/07/2011	CN102272915A 销升降系统 Pin lifting system
12/07/2011	CN102272914A 整体平台定位系统和方法 Overall platform positioning system and method
12/07/2011	CN102272913A 晶片分离装置、晶片分离输送装置、晶片分离方法、晶片分离输送方法以及用于太阳能电池的晶片分离输送方法 Wafer separation means separating the wafer transport apparatus, a wafer separating method, separating a wafer transport method for transporting the separation method and the wafer for solar cells
12/07/2011	CN102272912A “绝缘体上半导体”型衬底的支撑衬底的测试方法 Test Methods "semiconductor on insulator" type substrate supporting substrate
12/07/2011	CN102272911A 引线焊接装置及焊接方法 Wire bonding apparatus and welding method
12/07/2011	CN102272910A 两方向移动台 The mobile station in both directions
12/07/2011	CN102272909A 制造电子组装的方法和设备，采用该方法或在该设备中制造的电子组装 Method and apparatus for manufacturing an electronic assembly, using the method or the apparatus of manufacturing an electronic assembly
12/07/2011	CN102272908A 晶片接合用树脂浆料、使用该浆料的半导体装置的制造方法及半导体装置 The method of manufacturing a wafer bonding resin slurry, the slurry using a semiconductor device and a semiconductor device
12/07/2011	CN102272907A 形成倒装芯片互连的原位熔化和回流处理及其系统 Flip chip interconnect is formed in situ melting and reflow processing and systems
12/07/2011	CN102272906A 包括双栅极结构的半导体装置及形成此类半导体装置的方法 A semiconductor device comprising a double gate structure and a method of forming such a semiconductor device
12/07/2011	CN102272905A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/07/2011	CN102272904A 通过用于晶圆到晶圆结合的化学机械抛光工艺来形成沟道式电容器和通孔连接的方法 A method of forming a trench capacitor and a through hole for connection by a wafer-to-wafer bonding chemical mechanical polishing process of
12/07/2011	CN102272903A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/07/2011	CN102272902A 通过等离子体氧化处理的轮廓和cd均匀性控制 By plasma oxidation process and outline cd uniformity control
12/07/2011	CN102272901A 用于制造电子领域中的衬底的修整方法 Field shaping method of manufacturing an electronic substrate for
12/07/2011	CN102272900A 狭缝式超音速喷嘴及具备该喷嘴的表面处理装置 Supersonic nozzle and the slit of the nozzle with the surface treatment apparatus
12/07/2011	CN102272899A 电致动器件和控制电致动器件中的掺杂剂的形成的方法 Electric actuating devices and control devices are formed in the electrically actuated dopant method
12/07/2011	CN102272898A 喷淋型气相生长装置及其气相生长方法 Apparatus and vapor growth method spray type vapor phase growth
12/07/2011	CN102272897A 等离子体处理装置以及等离子体cvd成膜方法 Cvd plasma deposition apparatus and plasma processing method
12/07/2011	CN102272896A 等离子体处理装置 The plasma processing apparatus
12/07/2011	CN102272895A 等离子体处理装置 The plasma processing apparatus
12/07/2011	CN102272894A 等离子体处理装置 The plasma processing apparatus
12/07/2011	CN102272893A 等离子体处理装置 The plasma processing apparatus
12/07/2011	CN102272892A 具有升温气体注入的化学气相沉积 Is warming gas injection chemical vapor deposition
12/07/2011	CN102272891A 外延生长用内部改性衬底和使用其制造的晶体成膜体、器件、块状衬底以及它们的制造方法 Internal reforming epitaxial growth using the crystal substrate and the film-forming substance, device, bulk substrate manufacturing method thereof and its manufacture
12/07/2011	CN102272890A 形成半导体层的方法 The method of forming a semiconductor layer
12/07/2011	CN102272889A 电子器件用外延基板及其生产方法 The epitaxial substrate for an electronic device and production method thereof
12/07/2011	CN102272888A 柱形结构的阻剂结构元件和可移除间隔物间距加倍构图方法 Resist structural element cylindrical structures and a removable spacer pitch doubling patterning method
12/07/2011	CN102272887A 光固化性转印片、以及使用其的凹凸图案的形成方法 The photo-curable transfer sheet, and a method for forming a concave-convex pattern using the same
12/07/2011	CN102272886A 用于形成阵列双图案的间隔物 Spacers for forming an array of double patterning
12/07/2011	CN102272885A 具有静电放电保护结构的光刻掩模版 Photolithographic mask has ESD protection structures
12/07/2011	CN102272884A 用于光电的薄膜太阳能电池的固化装置 Means for curing the thin film photovoltaic solar cell
12/07/2011	CN102272863A 导电性粒子、导电性粒子的制造方法、各向异性导电材料及连接结构体 Conductive particles, the manufacturing method of the conductive particles, an anisotropic conductive material and connection structure
12/07/2011	CN102272675A 使用双重构图的光致抗蚀剂成像方法 Using double patterned photoresist image forming method
12/07/2011	CN102272612A 测试装置 Test device
12/07/2011	CN102272352A Cvd装置 Cvd device
12/07/2011	CN102272350A 等离子cvd装置 Plasma cvd means
12/07/2011	CN102272349A 含金属薄膜的制造方法中的残存水分子除去工艺及清洗溶剂 Metal-containing thin film manufacturing method a process of removing the residual water molecules and cleaning solvent
12/07/2011	CN102272234A 酞菁纳米线、含有它的油墨组合物及电子元件、以及酞菁纳米线的制造方法 Phthalocyanine nanowires, the ink composition containing it and electronic components, and a method for producing a phthalocyanine nanowires
12/07/2011	CN102272094A 用于印刷电子部件的功能材料 Functional materials for printed electronics components
12/07/2011	CN102272028A 卷轴装置和利用其的薄膜装载装置 Spool means and using its film loading device
12/07/2011	CN102271887A 脱模膜及发光二极管的制造方法 The method of producing a release film and a light emitting diode
12/07/2011	CN102271859A 激光加工装置 The laser processing apparatus
12/07/2011	CN102270737A 一种具有内禀铁磁性ZnO基稀磁半导体薄膜及其制备方法 Having intrinsic ferromagnetic ZnO-based diluted magnetic semiconductor thin film and its preparation method
12/07/2011	CN102270665A 场效应晶体管及其制造方法和半导体氧化石墨烯制造方法 Field effect transistor and its manufacturing method and a semiconductor manufacturing method of the graphene oxide
12/07/2011	CN102270664A Ldmos晶体管结构及其形成方法 Ldmos transistor structure and method of forming
12/07/2011	CN102270663A 具有超结结构的平面型功率mosfet器件及其制造方法 Having a planar type power mosfet device and manufacturing method of super-junction structure
12/07/2011	CN102270662A 自对准工艺制备的半导体功率器件以及更加可靠的电接触 Alignment process for the preparation of semiconductor power devices, and more reliable electrical contact since
12/07/2011	CN102270661A 单边栅极鳍状场效晶体管及其制造方法 Unilateral gate fin field effect transistor and manufacturing method thereof
12/07/2011	CN102270660A 沟槽型金属氧化物半导体场效应晶体管结构及其形成方法 Trench metal-oxide semiconductor field effect transistor structure and method of forming
12/07/2011	CN102270654A 阻变随机访问存储器件及其制造和操作方法 Resistive random access memory device and method of manufacturing and operating
12/07/2011	CN102270652A 具有跨接电极的发光二极管模组及其制造方法 A light emitting diode module and manufacturing method of an electrode having a jumper
12/07/2011	CN102270645A 显示装置及其制造方法 Display device and manufacturing method
12/07/2011	CN102270644A 薄膜晶体管显示面板及其制造方法 The thin film transistor display panel and manufacturing method thereof
12/07/2011	CN102270643A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/07/2011	CN102270642A 存储器单元 Memory unit
12/07/2011	CN102270641A 半导体器件 Semiconductor devices
12/07/2011	CN102270640A 大电流整晶圆全压接平板式封装的igbt及其制造方法 Entire wafer high current full crimp flatbed igbt package and method of manufacturing
12/07/2011	CN102270638A 一种半导体集成器件及其制造方法 A semiconductor integrated device and manufacturing method thereof
12/07/2011	CN102270636A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof
12/07/2011	CN102270635A 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method thereof
12/07/2011	CN102270624A 配线基板及其制造方法 Wiring board and manufacturing method thereof
12/07/2011	CN102270623A 芯片的凸块结构及凸块结构的制造方法 Bump structure and manufacturing method of the chip bump structure
12/07/2011	CN102270622A 裸片尺寸半导体元件封装及其制造方法 Die size and method of manufacturing a semiconductor device package

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