Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/08/2011US20110298050 Fin transistor structure and method of fabricating the same
12/08/2011US20110298047 Three-dimensional semiconductor device structures and methods
12/08/2011US20110298046 Semiconductor device with buried bit lines and method for fabricating the same
12/08/2011US20110298045 Self-aligned contact for trench mosfet
12/08/2011US20110298044 Semiconductor device and method of manufacturing semiconductor device
12/08/2011US20110298043 Semiconductor Device Structures and Related Processes
12/08/2011US20110298042 Power semiconductor device with trench bottom polysilicon and fabrication method thereof
12/08/2011US20110298040 Semiconductor device and method of manufacturing the same
12/08/2011US20110298035 Memory device transistors
12/08/2011US20110298034 Memory cell
12/08/2011US20110298032 Array architecture for embedded flash memory devices
12/08/2011US20110298031 Semiconductor memory device including multi-layer gate structure
12/08/2011US20110298028 Hafnium tantalum titanium oxide films
12/08/2011US20110298027 Semiconductor device
12/08/2011US20110298026 LOGIC-BASED eDRAM USING LOCAL INTERCONNECTS TO REDUCE IMPACT OF EXTENSION CONTACT PARASITICS
12/08/2011US20110298025 Finfet-compatible metal-insulator-metal capacitor
12/08/2011US20110298021 Semiconductor device and method for manufacturing the same
12/08/2011US20110298020 Semiconductor device
12/08/2011US20110298019 Compact field effect transistor with counter-electrode and fabrication method
12/08/2011US20110298018 Transistor and manufacturing method of the same
12/08/2011US20110298017 Replacement gate mosfet with self-aligned diffusion contact
12/08/2011US20110298010 Cell Library, Integrated Circuit, and Methods of Making Same
12/08/2011US20110298009 Epitaxial substrate for electronic device and method of producing the same
12/08/2011US20110298008 SELF-ALIGNED EMBEDDED SiGe STRUCTURE AND METHOD OF MANUFACTURING THE SAME
12/08/2011US20110298007 Select devices including an open volume, memory devices and systems including same, and methods for forming same
12/08/2011US20110298005 Method for fabricating an n-type semiconductor material using silane as a precursor
12/08/2011US20110297998 Semiconductor light emitting device and method for manufacturing the same
12/08/2011US20110297996 Electronic device and method of manufacturing the same
12/08/2011US20110297979 Passivation for a semiconductor light emitting device
12/08/2011US20110297963 Silicon carbide semiconductor device and method of manufacturing thereof
12/08/2011US20110297962 Schottky diode with diamond rod and method for manufacturing the same
12/08/2011US20110297960 Transistor assembly and method for manufacturing the same
12/08/2011US20110297959 Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
12/08/2011US20110297954 Semiconductor device, schottky barrier diode, electronic apparatus, and method of producing semiconductor device
12/08/2011US20110297950 Crystalline semiconductor film manufacturing method, substrate coated with crystalline semiconductor film, and thin-film transistor
12/08/2011US20110297940 Micromachine and method for manufacturing the same
12/08/2011US20110297938 Thin film transistor, method of manufacturing the same, and electronic device
12/08/2011US20110297930 Thin film transistor display panel and manufacturing method of the same
12/08/2011US20110297927 Oxide based memory
12/08/2011US20110297916 N-and P-Channel Field-Effect Transistors with Single Quantum Well for Complementary Circuits
12/08/2011US20110297913 Nanostructure optoelectronic device having sidewall electrical contact
12/08/2011US20110297912 Non-Volatile Memory Having 3d Array of Read/Write Elements with Vertical Bit Lines and Laterally Aligned Active Elements and Methods Thereof
12/08/2011US20110297910 Method of fabrication of programmable memory microelectric device
12/08/2011US20110297771 Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
12/08/2011US20110297640 Method for producing mold and electrode structure used therefor
12/08/2011US20110297533 Plasma processing method and plasma processing apparatus
12/08/2011US20110297329 Debonders and related devices and methods for semiconductor fabrication
12/08/2011US20110297321 Substrate support stage of plasma processing apparatus
12/08/2011US20110297320 Plasma processing apparatus
12/08/2011US20110297319 Reduction of Copper or Trace Metal Contaminants in Plasma Electrolytic Oxidation Coatings
12/08/2011US20110297215 Manufacturing method and apparatus for a copper indium gallium diselenide solar cell
12/08/2011US20110296912 Integrated circuit and manufacturing method therefor
12/08/2011DE202008018175U1 Lichtemittierende Halbleitervorrichtung A semiconductor light emitting device
12/08/2011DE10332590B4 Zeilendecodierer in einem Flashspeicher sowie Löschverfahren für eine Flashspeiicherzelle in diesem Row decoder in a flash memory and an erasing method for Flashspeiicherzelle in this
12/08/2011DE102011102861A1 Verwendung von Vorrichtungszusammenbau zur Verallgemeinerung von dreidimensionalen Metallverbindungstechnologien Use of device assembly for generalization of three-dimensional metal interconnect technologies
12/08/2011DE102011076883A1 Halbleitervorrichtung Semiconductor device
12/08/2011DE102011076610A1 Stromsensor, inverterschaltung und diese aufweisende halbleitervorrichtung Current sensor, inverter circuit and semiconductor device having these
12/08/2011DE102011050228A1 Halbleiter-Package mit Induktionsspule The semiconductor package with induction coil
12/08/2011DE102011001527A1 Flachgrabenisolationsbereich mit vergrabenem Kondensator Flat grave isolation region buried capacitor
12/08/2011DE102011000751A1 Halbleiter-Bauelement mit einem einen Hohlraum aufweisenden Träger und Herstellungsverfahren Semiconductor device with a carrier having a cavity and manufacturing method
12/08/2011DE102010029760A1 Bauelement mit einer Durchkontaktierung Component with a via
12/08/2011DE102010029741A1 Verfahren zum Herstellen von Silizium-Wafern und Silizium-Solarzelle A method for producing silicon wafers and silicon solar cell
12/08/2011DE102010029650A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
12/08/2011DE102010017263A1 Method for performing adaptive quality inspection of silicon wafers, involves performing sampling group test on wafer lots/production units having measurement value measured in signature group test, between inner and outer limits
12/08/2011DE102009047312B4 Transistor mit einer Metallgateelektrodenstruktur mit großem ε, die auf der Grundlage eines vereinfachten Abstandshalterschemas hergestellt ist Transistor with a metal gate electrode structure with large ε, which is formed on the basis of a simplified spacer schema
12/08/2011DE102009020733B4 Verfahren zur Kontaktsinterung von bandförmigen Kontaktelementen Method for Kontaktsinterung of band-shaped contact elements
12/08/2011DE102009006237B4 Waferverarbeitungsverfahren zum Verarbeiten von Wafern mit darauf ausgebildeten Bondhügeln Wafer processing method of processing wafers having formed thereon bumps
12/08/2011DE102008061521B4 Verfahren zur Behandlung einer Halbleiterscheibe A process for treating a semiconductor wafer
12/08/2011DE102008011531B4 Verfahren zum Bearbeiten eines Objekts mit miniaturisierten Strukturen A method for processing an object with miniaturized structures
12/08/2011DE102007014389B4 Ein Verfahren zum Erzeugen einer Mehrzahl von Halbleiterbauteilen A method for generating a plurality of semiconductor devices
12/08/2011DE102006043360B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit dreidimensionalem Aufbau A method of manufacturing a semiconductor device having three-dimensional structure
12/08/2011DE102006016090B4 Verfahren zum Herstellen mehrerer Lotdepots auf einem Substrat A method for fabricating a plurality of solder deposits on a substrate
12/08/2011DE102006013721B4 Halbleiterschaltungsanordnung und zugehöriges Verfahren zur Temperaturerfassung A semiconductor circuit arrangement, and associated method for temperature detection
12/08/2011DE102005031658B4 Bleifreies Glas für elektronische Bauelemente Lead-free glass for electronic components
12/08/2011DE102004017723B4 In Rückwärtsrichtung sperrendes Halbleiterbauteil und Verfahren zu seiner Herstellung In the reverse direction blocking semiconductor device and process for its preparation
12/08/2011DE10136285B4 Integrierte Halbleiterschaltungsvorrichtung und Verfahren zum Anbringen von Schaltungsblöcken in der integrierten Halbleiterschaltungsvorrichtung A semiconductor integrated circuit apparatus and method for attaching of circuit blocks in the semiconductor integrated circuit device
12/08/2011CA2801900A1 Method for providing lateral thermal processing of thin films on low-temperature substrates
12/08/2011CA2801123A1 Manufacturing device and process
12/08/2011CA2788714A1 Multi-spectrum photosensitive device and manufacturing method thereof
12/08/2011CA2770764A1 Method for manufacturing silicon carbide substrate, method for manufacturing semiconductor device, silicon carbide substrate, and semiconductor device
12/07/2011EP2393177A1 Electrostatic discharge protection structures for high speed technologies with mixed and ultra-low voltage supplies
12/07/2011EP2393130A2 Light-emitting device and method of manufacturing the same
12/07/2011EP2393118A1 Single-gate FinFET and fabrication method thereof
12/07/2011EP2393115A1 Memory cell
12/07/2011EP2393109A1 Semiconductor components including conductive through-wafer vias
12/07/2011EP2393108A1 Compact field-effect transistor with counter-electrode and manufacturing method
12/07/2011EP2393106A1 Curable composition for transfer material and urea compound containing (meth)acryloyl group
12/07/2011EP2392696A1 Method for firmly fixing particles, and method for producing structure having firmly fixed particles
12/07/2011EP2392692A1 Composition for metal electroplating comprising leveling agent
12/07/2011EP2392629A1 Temporary adhesive composition, and method of producing thin wafer
12/07/2011EP2392578A1 Cyclooctatetraenetricarbonylruthenium complex, process for producing same, and process for producing film using the complex as raw material
12/07/2011EP2392552A1 Cordierite-based sintered body
12/07/2011EP2392528A1 Position controller for flexible substrate
12/07/2011EP2392025A1 Photovoltaic device with improved crystal orientation
12/07/2011EP2392024A2 Material sheet handling system and processing methods
12/07/2011EP2391581A2 Arrangement and method for measurement of the temperature and of the thickness growth of silicon rods in a silicon deposition reactor
12/07/2011EP2391578A1 Method for forming nanowires and associated method for manufacturing an optical component
12/07/2011EP2391506A1 Structures comprising high aspect ratio molecular structures and methods of fabrication
12/07/2011EP1812238B1 Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
12/07/2011EP1779435B1 Monolithic vertical junction field effect transistor and schottky barrier diode fabricated from silicon carbide and method for fabricating the same