H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/07/2011	CN102270621A 包括多个管芯和引线取向的管芯封装 Includes a plurality of dies and the leads of the die package orientation
12/07/2011	CN102270617A 一种倒装芯片凸块结构及其制作工艺 A flip chip bump structure and manufacturing process
12/07/2011	CN102270616A 晶片级封装结构及其制造方法 Wafer-level package structure and manufacturing method
12/07/2011	CN102270609A 用于三维金属互连技术的一般化的器件组装的使用 Use metal interconnect technology for three-dimensional generalization of the device assembly
12/07/2011	CN102270608A 分栅式闪存制造方法 Sub-gate flash memory manufacturing method
12/07/2011	CN102270607A 栅极堆叠的制造方法和半导体器件 Gate stack and the semiconductor device manufacturing method
12/07/2011	CN102270606A 形成接触窗的方法 The method of forming a contact window
12/07/2011	CN102270605A 平板显示设备及其制造方法 Flat panel display device and manufacturing method thereof
12/07/2011	CN102270604A 阵列基板的结构及其制造方法 Structure and manufacturing method of an array substrate
12/07/2011	CN102270603A 一种硅通孔互连结构的制作方法 A method of making silicon via interconnect structure
12/07/2011	CN102270602A 一种铝导线的形成方法 The method for forming an aluminum wire
12/07/2011	CN102270601A 双镶嵌结构的制造方法 The method of manufacturing a dual damascene structure
12/07/2011	CN102270600A 通孔的形成方法 The method of forming a through hole
12/07/2011	CN102270599A 一种用于集成电路制造的场区隔离方法 A field zone isolation method for the manufacture of integrated circuits
12/07/2011	CN102270598A 一种用于集成电路制造的场区隔离方法 A field zone isolation method for the manufacture of integrated circuits
12/07/2011	CN102270597A 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 The wafer carrier assembly and wafer wafer exchange means for exchanging means
12/07/2011	CN102270596A 吸盘及其承片台 Sucker and bearing piece Taiwan
12/07/2011	CN102270595A 旋转气浮系统 Rotation flotation system
12/07/2011	CN102270594A 搬送室、基板处理装置和基板异常的检测方法 Detection transfer chamber, the substrate processing apparatus and the substrate abnormality
12/07/2011	CN102270593A 一种离子注入机机械臂装卸托盘 An ion implanter manipulator handling pallets
12/07/2011	CN102270592A 一种半导体方形基片旋转自动紧固装置 A semiconductor substrate is rotated square automatic fastening device
12/07/2011	CN102270591A 双半导体芯片单次压模工艺 Double single semiconductor chip die process
12/07/2011	CN102270590A 晶圆级封装结构及封装方法 Wafer-level packaging structure and packaging method
12/07/2011	CN102270589A 半导体元件的制造方法和相应的半导体元件 The method of manufacturing a semiconductor element and the corresponding semiconductor element
12/07/2011	CN102270588A 在半导体管芯周围形成emi屏蔽层的半导体器件和方法 Semiconductor device and method of the semiconductor die is formed around the shielding layer emi
12/07/2011	CN102270587A 一种塑封晶体管溢料软化液及其制备方法 One kind of flash to soften plastic transistor liquid and its preparation method
12/07/2011	CN102270586A 半导体元件的封装方法 The method of encapsulating a semiconductor element
12/07/2011	CN102270585A 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board
12/07/2011	CN102270584A 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board
12/07/2011	CN102270583A 沟槽mos及其形成方法 And a method of forming a trench mos
12/07/2011	CN102270582A 一种提高soi-pmos器件背栅阈值电压的方法 A back gate threshold voltage of the device to improve the method of soi-pmos
12/07/2011	CN102270581A 低电阻接触结构及其形成方法 Low resistance contact structure and method of forming
12/07/2011	CN102270580A 一种制造高压nmos管的方法 A method of manufacturing the high-pressure pipe nmos
12/07/2011	CN102270579A 一种遮挡晶片制备方法 A wafer preparation shelter
12/07/2011	CN102270578A 掺杂衬底上的超薄SiO<sub>2</sub>生长工艺 Doped thin SiO <sub> on the substrate 2 </ sub> growth process
12/07/2011	CN102270577A 等离子体处理装置和方法 The plasma processing apparatus and method
12/07/2011	CN102270576A Mos晶体管制造方法 Mos transistor fabrication method
12/07/2011	CN102270575A 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/07/2011	CN102270574A 侧墙形成方法 Sidewall forming method
12/07/2011	CN102270573A 栅极制造方法 The gate manufacturing method
12/07/2011	CN102270572A 侧墙及mos晶体管的形成方法 The method for forming the side wall and mos transistors
12/07/2011	CN102270571A 半导体器件的制作方法 The method of making a semiconductor device
12/07/2011	CN102270570A 使硅层结晶的方法及使用该方法形成薄膜晶体管的方法 Method of crystallizing the silicon layer using the same method of forming a thin film transistor
12/07/2011	CN102270569A 一种半导体应变硅片成型方法 One kind of silicon semiconductor strain shaping method
12/07/2011	CN102270568A 一种绒面ZnO基薄膜的盐溶液腐蚀方法 Salt solution method for etching a textured ZnO-based film
12/07/2011	CN102270567A 电容器的制作方法 Capacitor production methods
12/07/2011	CN102270566A 反应腔室的密封装置及方法 Apparatus and method for sealing the reaction chamber
12/07/2011	CN102270565A 基板处理装置 Substrate processing apparatus
12/07/2011	CN102270564A 热处理装置、热处理方法和存储介质 Heat treatment apparatus, a heat treatment method and a storage medium
12/07/2011	CN102270563A 热处理装置、热处理方法和存储介质 Heat treatment apparatus, a heat treatment method and a storage medium
12/07/2011	CN102270562A 基板处理系统和基板处理方法 A substrate processing system and a substrate processing method
12/07/2011	CN102270561A 具有适配热导体的等离子体处理室部件 Plasma processing chamber means having a thermal conductor adapted
12/07/2011	CN102270560A 液处理装置 Liquid treatment apparatus
12/07/2011	CN102270559A 沟槽型功率晶体管中副产物的清洗方法 The method of cleaning a trench type power transistor byproducts
12/07/2011	CN102270558A 一种用于真空处理系统的安装装置 A mounting device for a vacuum processing system
12/07/2011	CN102270557A 离子注入装置 Ion implantation apparatus
12/07/2011	CN102270317A 半导体器件及其工作方法 Semiconductor device and method of work
12/07/2011	CN102269901A 平板显示设备及其制造方法 Flat panel display device and manufacturing method thereof
12/07/2011	CN102269900A Tft阵列基板及其制造方法 Tft array substrate and manufacturing method thereof
12/07/2011	CN102269310A 旋转接头 Rotary joint
12/07/2011	CN102268737A 生成iii-n层的方法，和iii-n层或iii-n衬底，以及其上的器件 The method of generating iii-n layer, and the device iii-n layer or iii-n substrate, and on which
12/07/2011	CN102268224A 可控氧化硅去除速率的化学机械抛光液 Controllable silicon oxide removal rate in chemical-mechanical polishing solution
12/07/2011	CN102267260A 具有激光烧结的底板的基片 A laser sintered substrate plate
12/07/2011	CN102005431B Flip-dual face graphic-chip plating-first and etching-second single encapsulation method
12/07/2011	CN101930922B Mos晶体管的制作方法 Mos transistor manufacturing method
12/07/2011	CN101908477B 一种金属纳米晶存储器栅叠层的制备方法 Preparation of nanocrystalline metal gate stack memory
12/07/2011	CN101901769B 引线框的微爆处理方法 Microburst treatment leadframe
12/07/2011	CN101901763B 可控硅生产工艺 SCR production process
12/07/2011	CN101901742B 用于薄晶粒分离和拾取的设备 For thin grain separation and picked up equipment
12/07/2011	CN101887883B 一种mtm反熔丝单元结构及其制备方法 Mtm one kind of anti-fuse unit structure and its preparation method
12/07/2011	CN101866923B 三层光罩沟槽mos器件及制造方法 Three mask trench mos device and manufacturing method
12/07/2011	CN101866892B 芯片的布局结构与方法 Chip layout structure and methods
12/07/2011	CN101866875B Method for preparing silicon germanium on insulator (SGOI) by layer transfer and ion implantation technology
12/07/2011	CN101853832B Base island exposed type and embedded type base island lead frame structure and first-engraving last-plating method thereof
12/07/2011	CN101842879B 等离子体处理装置和等离子体处理方法 The plasma processing apparatus and plasma processing method
12/07/2011	CN101819975B 垂直沟道双栅隧穿晶体管及其制备方法 Vertical channel double gate tunneling transistor and its preparation method
12/07/2011	CN101814525B 用于FinFET的ESD保护 ESD protection for FinFET
12/07/2011	CN101814446B Island expose and multi-salient-point island expose lead frame structure and carving and plating method thereof
12/07/2011	CN101802997B 切割与加工存储卡的装置 Cutting and machining device memory card
12/07/2011	CN101800285B 采用体有源层材料作为前驱体诱导有源层有序生长的方法 Using the body as a precursor of the active layer material inducing method of growing the active layer orderly
12/07/2011	CN101800206B 半导体封装构造及其封装方法 Semiconductor package and packaging method
12/07/2011	CN101800186B 用于处理电子元件的传送装置及其传送方法 Transfer means and transmission method for handling electronic components
12/07/2011	CN101797717B 侦测化学机械研磨机台水槽上/下位置的装置及方法 Detect the chemical mechanical polishing machine sink apparatus and method / down position
12/07/2011	CN101789429B 金属-绝缘体-金属电容结构及其制造方法 Metal - insulator - metal capacitor structure and manufacturing method
12/07/2011	CN101789423B U盘结构及其封装方法 U disk structure and packaging method
12/07/2011	CN101789384B 退火的检测方法 Detection annealing
12/07/2011	CN101783364B 一种纳米电子器件的制作方法 A nanometer manufacturing method of electronic devices
12/07/2011	CN101777502B 倒装芯片封装方法 Flip-chip packaging method
12/07/2011	CN101772835B 工件输送方法以及具有工件交接机构的装置 Work conveyance method and apparatus having a workpiece transfer mechanism
12/07/2011	CN101764084B 铜阻挡层-籽晶层薄膜制备的方法 Copper barrier - the seed layer film preparation method
12/07/2011	CN101764081B 连接孔的制造方法 Connection method for producing holes
12/07/2011	CN101764069B 用于微电子系统级封装的堆叠芯片悬臂柔性层键合的方法 Stacked chip scale package cantilever microelectronic systems for flexible layer bonding method
12/07/2011	CN101752261B 半导体工艺及应用此工艺所形成的硅基板及芯片封装结构 Silicon substrate of semiconductor technology and application of this process and the formation of the chip package structure
12/07/2011	CN101752253B Mos晶体管的制造方法 Mos transistor manufacturing method
12/07/2011	CN101752234B 具导通孔的电子元件及薄膜晶体管元件的制造方法 The method of producing a through-hole electronic components and the thin film transistor element
12/07/2011	CN101752229B 袋形注入区的离子注入方法及mos晶体管的制造方法 Pocket implant region ion implantation method and manufacturing method mos transistor
12/07/2011	CN101748378B 成膜载板及太阳能电池的生产方法 Film-forming vehicle and solar cell panel manufacturing method
12/07/2011	CN101740456B 浅沟槽结构制造方法及快闪存储器 Shallow trench structure and manufacturing method of a flash memory
12/07/2011	CN101740451B 芯片分拣设备的顶针机构 Thimble institution chip sorting equipment
12/07/2011	CN101740416B 一种四方扁平无引脚封装结构及其封装方法 One kind of quad flat no-lead package and packaging method

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