Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/08/2011US20110300689 Methods of Forming Trench Isolation in the Fabrication of Integrated Circuitry and Methods of Fabricating Integrated Circuitry
12/08/2011US20110300688 Methods for forming a gate and a shallow trench isolation region and for planarizing an etched surface of silicon substrate
12/08/2011US20110300687 Nano-dimensional non-volatile memory cells
12/08/2011US20110300686 Methods of Fabricating Non-Volatile Memory Devices
12/08/2011US20110300685 Methods for fabricating phase change memory devices
12/08/2011US20110300684 Method fabricating phase-change semiconductor memory device
12/08/2011US20110300682 Charge trapping devices with field distribution layer over tunneling barrier
12/08/2011US20110300681 Raised source/drain with super steep retrograde channel
12/08/2011US20110300680 Non-volatile semiconductor memory device and depletion-type mos transistor
12/08/2011US20110300679 Process of forming an electronic device including a trench and a conductive structure therein
12/08/2011US20110300678 Symmetric blocking transient voltage suppressor (TVS) using bipolar transistor base snatch
12/08/2011US20110300677 Novel Method to Enhance Channel Stress in CMOS Processes
12/08/2011US20110300676 Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates
12/08/2011US20110300675 Method of fabricating thin film transistor
12/08/2011US20110300674 Method of crystallizing silicon layer and method of forming a thin film transistor using the same
12/08/2011US20110300673 Post-dispense vacuum oven for reducing underfill voids during ic assembly
12/08/2011US20110300672 Semiconductor device, and manufacturing method therefor
12/08/2011US20110300671 Leadframe-based semiconductor package and fabrication method thereof
12/08/2011US20110300670 Method of manufacturing semiconductor device
12/08/2011US20110300669 Method for Making Die Assemblies
12/08/2011US20110300668 Use of device assembly for a generalization of three-dimensional metal interconnect technologies
12/08/2011US20110300667 Electric-field-sensitive element and display device using the same
12/08/2011US20110300659 Method for fabricating mems device
12/08/2011US20110300658 Methods of creating a micro electro-mechanical systems accelerometer using a single double silicon-on-insulator wafer
12/08/2011US20110300648 Substrate processing method and method for manufacturing liquid ejection head
12/08/2011US20110300647 Method for manufacturing semiconductor chips from a semiconductor wafer
12/08/2011US20110300646 Pattern forming method, manufacturing method of semiconductor device, and template manufacturing method
12/08/2011US20110300645 Apparatus and method for batch non-contact material characterization
12/08/2011US20110300644 Method for manufacturing semiconductor light emitting device
12/08/2011US20110300643 Method of assembling displays on substrates
12/08/2011US20110300605 Nanoscaling ordering of hybrid materials using genetically engineered mesoscale virus
12/08/2011US20110300472 Exposure Apparatus Inspection Mask and Exposure Apparatus Inspection Method
12/08/2011US20110300413 Battery-operated wireless-communication apparatus and method
12/08/2011US20110299962 Vacuum Processing Apparatus And Vacuum Processing Method
12/08/2011US20110299961 Processing system and method of operating a processing system
12/08/2011US20110299701 Miniature micro-electromechanical system (mems) based directional sound sensor
12/08/2011US20110299337 Methods and apparatus for an isfet
12/08/2011US20110299329 Bottom electrode geometry for phase change memory
12/08/2011US20110299318 Semiconductor memory cell and manufacturing method thereof, and semiconductor memory devices
12/08/2011US20110299317 Integrated circuit heating to effect in-situ annealing
12/08/2011US20110299255 Semiconductor device, method of manufacturing the same, electronic device, and electronic component
12/08/2011US20110299218 Heated annulus chuck
12/08/2011US20110299217 Heated electrostatic chuck including mechanical clamp capability at high temperature
12/08/2011US20110299164 Method and device for the production of a structured object, and structured object
12/08/2011US20110299074 Nanostructure optoelectronic device with independently controllable junctions
12/08/2011US20110299055 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method with two optical elements having different thicknesses
12/08/2011US20110298551 Integrated circuits and methods of forming the same
12/08/2011US20110298492 Adjustable Interface Buffer Circuit Between A Programmable Logic Device And A Dedicated Device
12/08/2011US20110298481 Capacitance electrode and sensor-system capable of sensing contaminants and method therefor
12/08/2011US20110298465 Process monitor and semiconductor manufacturing apparatus
12/08/2011US20110298140 Component having a through-contact
12/08/2011US20110298137 Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
12/08/2011US20110298134 Three dimensional interconnect structure and method thereof
12/08/2011US20110298128 Multi-chip package with pillar connection
12/08/2011US20110298126 Carrier-free semiconductor package and fabrication method
12/08/2011US20110298125 Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
12/08/2011US20110298122 Integrated circuit apparatus, systems, and methods
12/08/2011US20110298119 Integrated circuit package system with package stacking and method of manufacture thereof
12/08/2011US20110298116 Semiconductor device and production method thereof
12/08/2011US20110298115 Semiconductor component and method of manufacture
12/08/2011US20110298114 Stacked interposer leadframes
12/08/2011US20110298113 Integrated circuit packaging system with increased connectivity and method of manufacture thereof
12/08/2011US20110298111 Semiconductor package and manufactring method thereof
12/08/2011US20110298110 Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
12/08/2011US20110298109 Semiconductor device and method of forming prefabricated emi shielding frame with cavities containing penetrable material over semiconductor die
12/08/2011US20110298107 Shielded stacked integrated circuit packaging system and method of manufacture thereof
12/08/2011US20110298106 Integrated circuit packaging system with magnetic film and method of manufacture thereof
12/08/2011US20110298105 Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure
12/08/2011US20110298104 Semiconductor Body with a Protective Structure and Method for Manufacturing the Same
12/08/2011US20110298103 Semiconductor package and method of manufacturing the semiconductor package
12/08/2011US20110298102 Semiconductor package and method of manufacturing the semiconductor package
12/08/2011US20110298101 Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die
12/08/2011US20110298100 Semiconductor device producing method and semiconductor device
12/08/2011US20110298099 Silicon dioxide layer deposited with bdeas
12/08/2011US20110298097 Semiconductor device and method for manufacturing the same
12/08/2011US20110298095 Passivation layer extension to chip edge
12/08/2011US20110298093 Thermal Processing of Substrates with Pre- and Post-Spike Temperature Control
12/08/2011US20110298092 Diodes with a dog bone or cap-shaped junction profile to enhance esd performance, and other substructures, integrated circuits and processes of manufacture and testing
12/08/2011US20110298090 Capacitors, Systems, and Methods
12/08/2011US20110298089 Trench capacitor and method of fabrication
12/08/2011US20110298088 Semiconductor Package with Integrated Inductor
12/08/2011US20110298087 Electrical fuse device based on a phase-change memory element and corresponding programming method
12/08/2011US20110298085 Shallow trench isolation area having buried capacitor
12/08/2011US20110298084 Method for manufacturing semiconductor element
12/08/2011US20110298083 Soi wafer, method for producing same, and method for manufacturing semiconductor device
12/08/2011US20110298082 Semiconductor integrated circuit and method of driving the same
12/08/2011US20110298077 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
12/08/2011US20110298070 Semiconductor Device Having Magnetoresistive Element and Manufacturing Method Thereof
12/08/2011US20110298066 Micro structure, micro electro mechanical system therewith, and manufacturing method thereof
12/08/2011US20110298065 Electromechanical system having a controlled atmosphere, and method of fabricating same
12/08/2011US20110298064 Sensor module and method for producing sensor modules
12/08/2011US20110298063 Micromechanical Component
12/08/2011US20110298062 Metal gate structures and methods for forming thereof
12/08/2011US20110298061 Structure and method for replacement gate mosfet with self-aligned contact using sacrificial mandrel dielectric
12/08/2011US20110298060 Interface structure for channel mobility improvement in high-k metal gate stack
12/08/2011US20110298059 Integrated circuits having dummy gate electrodes and methods of forming the same
12/08/2011US20110298058 Faceted epi shape and half-wrap around silicide in s/d merged finfet
12/08/2011US20110298056 Contact resistivity reduction in transistor devices by deep level impurity formation
12/08/2011US20110298053 Manufacturing method of gate stack and semiconductor device
12/08/2011US20110298052 Vertical Stacking of Field Effect Transistor Structures for Logic Gates