Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2011
12/14/2011CN102282665A 具有气体导引开口的基板支撑件 Substrate support member having the gas guide opening
12/14/2011CN102282664A 基板处理系统与基板传送方法 A substrate processing system and a substrate transfer method
12/14/2011CN102282663A 用于降低装载锁中的压力的方法和相关设备 Method for reducing the pressure in the load lock and related equipment
12/14/2011CN102282662A 探针、安装有探针的探针卡、在探针卡上安装探针的方法、以及移除探针卡上已安装探针的方法 Probe, a probe of a probe card mounted on a probe of the probe card mounting method, and a method of removing the probe card is installed on a probe
12/14/2011CN102282661A 半导体芯片的安装方法、使用该方法获得的半导体装置以及半导体芯片的连接方法与表面设有布线的立体结构物及其制法 A semiconductor chip mounting method, a method for connecting the surface of the semiconductor device and a semiconductor chip obtained by the method has a three-dimensional wiring structure and its preparation method
12/14/2011CN102282660A 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物 Method of manufacturing a semiconductor package, a semiconductor packaging method and solvent-based semiconductor package epoxy resin composition
12/14/2011CN102282659A 半导体基板结构及半导体装置 The semiconductor substrate and semiconductor device structure
12/14/2011CN102282658A 使用不导电丝网印刷与施涂粘合剂的半导体裸片附接方法 Use non-conductive semiconductor die screen printing and applying adhesive attachment methods
12/14/2011CN102282657A 通过cvd蚀刻与淀积顺序形成的cmos晶体管结区 Cmos transistor junction region by etching and deposition sequence cvd formed
12/14/2011CN102282656A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
12/14/2011CN102282655A 形成栅极叠层及其结构的方法 And a method of forming a gate stack structure
12/14/2011CN102282654A 蚀刻装置、分析装置、蚀刻处理方法、以及蚀刻处理程序 Etching apparatus, the analyzing apparatus, an etching treatment method, and etching treatment procedures
12/14/2011CN102282653A 防止在蚀刻处理和/或随后的清洗处理期间蚀刻副产物沉淀的方法 Preventing the etching process and / or during the subsequent washing treatment methods etch byproducts precipitated
12/14/2011CN102282652A 在蚀刻处理和/或随后的清洗处理期间防止蚀刻副产物沉淀的方法 In or during the etching process and / subsequent cleaning process to prevent etching by-products precipitation method
12/14/2011CN102282651A 具有非平面浮动栅极的存储器晶体管及其制造方法 Memory transistor and its manufacturing method having a floating gate of a non-planar
12/14/2011CN102282650A 太阳能电池方法及结构 The method and the solar cell structure
12/14/2011CN102282649A 添加前体至氧化硅化学气相沉积以增进低温间隙填充的方法 Before adding to the body of the silicon oxide to improve the low temperature chemical vapor deposition method for filling the gap
12/14/2011CN102282648A 蒸镀装置、薄膜沉积装置及提供原料予其装置的方法 The method of vapor deposition apparatus, the thin film deposition apparatus and the apparatus to provide raw materials for their
12/14/2011CN102282647A 剥除半导体晶片边缘的方法和系统 Stripping a semiconductor wafer edge method and system
12/14/2011CN102282646A 量子点超级电容器和电子电池 Quantum dots super capacitors and electronic battery
12/14/2011CN102282645A 导电密封环静电吸盘 Conductive sealing ring electrostatic chuck
12/14/2011CN102282291A 化学气相沉积用原料及使用了该原料的含硅薄膜形成方法 Chemical vapor deposition using a silicon-containing raw material and the film-forming method of the raw material
12/14/2011CN102282290A 真空涂层设备和用于操作真空涂层设备的方法 Vacuum coating apparatus and a method for operating a vacuum coating apparatus
12/14/2011CN102282103A 高级硅烷组合物和带膜的基板的制造方法 The method for preparing a silane composition and the substrate with film
12/14/2011CN102281991A 浆液再生装置及方法 Apparatus and method for regeneration of a slurry
12/14/2011CN102281990A 具有窗口支撑件的研磨垫与系统 Polishing pad with a window system having a support member
12/14/2011CN102281973A 烧结材料、烧结结合体以及制造烧结结合体的方法 The method of the sintered material, and producing a sintered body of a sintered combination of a combination of
12/14/2011CN102281702A 基板布局与其形成方法 Its method of forming the substrate layout
12/14/2011CN102280817A 氮化物半导体器件及其制造方法 The nitride semiconductor device and manufacturing method thereof
12/14/2011CN102280582A 显示装置的制造方法 A display device manufacturing method
12/14/2011CN102280579A 电子器件及其制造方法 Electronic device and manufacturing method thereof
12/14/2011CN102280557A 发光元件组立装置及其方法 Emitting element group legislature apparatus and method
12/14/2011CN102280555A 一种发光二极管及其制造方法 A light-emitting diode and its manufacturing method
12/14/2011CN102280533A Method for preparing gallium nitride substrate material
12/14/2011CN102280531A 一种硅片转载器 Reprinted device silicon wafers
12/14/2011CN102280522A Method of forming current tracks on semiconductors
12/14/2011CN102280521A 处理太阳能电池的方法 The method of processing a solar cell
12/14/2011CN102280497A 累积型场效应管可变电容及其制造工艺 Cumulative FET variable capacitor and its manufacturing process
12/14/2011CN102280496A 变容器与形成其的方法以及应用此变容器的三维集成电路 3D IC varactor and its method of formation and the application of this varactor
12/14/2011CN102280495A 一种齐纳二极管及其制造方法 One kind of zener diode and its manufacturing method
12/14/2011CN102280492A 非易失性半导体存储器晶体管、非易失性半导体存储器及非易失性半导体存储器的制造方法 The method of manufacturing a nonvolatile semiconductor memory transistor, a nonvolatile semiconductor memory and the nonvolatile semiconductor memory
12/14/2011CN102280491A 混合式薄膜晶体管及其制造方法以及显示面板 Hybrid thin film transistor and manufacturing method thereof and a display panel
12/14/2011CN102280488A Tft、包括tft的阵列基板及制造tft和阵列基板的方法 Tft, includes an array substrate and a method of manufacturing an array substrate and tft tft of
12/14/2011CN102280487A 一种新型沟槽结构的功率mosfet器件及其制造方法 A power mosfet device and a manufacturing method of a new type trench structure
12/14/2011CN102280486A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
12/14/2011CN102280484A 一种栅源和栅漏过压保护的晶体管功率器件及其制造方法 One kind of gate-source and gate-drain transistor power overvoltage protection device and manufacturing method
12/14/2011CN102280483A 一种栅源侧台保护的功率器件及其制造方法 One kind of the gate power source side protection station device and a manufacturing method
12/14/2011CN102280482A 射频侧向扩散金属氧化物半导体器件及制备方法 RF laterally diffused metal oxide semiconductor device and method of preparation
12/14/2011CN102280481A 横向双扩散金属氧化物半导体器件及其制造方法 Lateral double diffused metal oxide semiconductor device and manufacturing method thereof
12/14/2011CN102280480A 双栅沟道导电类型可调单壁碳纳米管场效应晶体管及制备工艺 Adjustable dual-gate channel conductivity type field effect transistor single-walled carbon nanotubes and preparation
12/14/2011CN102280479A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011CN102280478A 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process
12/14/2011CN102280476A 一种赝配高电子迁移率晶体管及其制作方法 One kind pseudomorphic high electron mobility transistor and its manufacturing method
12/14/2011CN102280474A 一种igbt器件及其制造方法 One kind of device and manufacturing method thereof igbt
12/14/2011CN102280473A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
12/14/2011CN102280470A 半导体器件和半导体器件制造方法 Semiconductor device and a semiconductor device manufacturing method
12/14/2011CN102280469A 硅表面上ⅲ-v化合物半导体的外延生长 Epitaxial growth on a silicon surface ⅲ-v compound semiconductor
12/14/2011CN102280467A 有机发光显示器及其制造方法 The organic light emitting display and a method of manufacturing
12/14/2011CN102280466A 显示设备及其制造方法 The display device and manufacturing method thereof
12/14/2011CN102280465A 阻变随机访问存储器件及制造方法 Resistive random access memory device and method of manufacture
12/14/2011CN102280464A 像素隔离结构以及像素隔离结构制造方法 Pixel isolation structure and method of manufacturing the pixel isolation structure
12/14/2011CN102280454A 半导体晶体管结构及其制造方法 Semiconductor transistor structure and method of manufacturing
12/14/2011CN102280453A 半导体器件 Semiconductor devices
12/14/2011CN102280452A 薄膜晶体管基板、其制造方法及具有该基板的平板显示器 A thin film transistor substrate, its manufacturing method and the substrate having a flat panel display
12/14/2011CN102280451A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
12/14/2011CN102280449A 集成dmos和肖特基 Dmos and integrated Schottky
12/14/2011CN102280445A 显示装置及其制造方法 Display device and method of manufacturing
12/14/2011CN102280443A 阵列基板的结构及制造方法 Structure and method for manufacturing an array substrate
12/14/2011CN102280440A 一种叠层封装结构及制造方法 A laminated package structure and method of manufacture
12/14/2011CN102280439A 一种微波功率晶体管内匹配网络及其制造方法 A matching network and a manufacturing method in the microwave power transistor
12/14/2011CN102280436A 薄膜金属层接线结构及其制造方法和阵列基板 Thin-film metal-layer wiring structure and its manufacturing method and array substrate
12/14/2011CN102280435A 配线基板及其制造的方法 And a method of manufacturing the wiring substrate
12/14/2011CN102280433A 晶圆级芯片尺寸封装结构及其封装方法 Wafer-level chip size package and packaging method
12/14/2011CN102280431A 具有保护层的半导体封装及其制作方法 Semiconductor package and method of making a protective layer
12/14/2011CN102280428A 封装件及其制造方法 Package and manufacturing method thereof
12/14/2011CN102280427A 一种金属与塑料混合封装的可控硅封装结构及其方法 A thyristor package structure and method of mixing metal and plastic packaging
12/14/2011CN102280426A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011CN102280425A 具备键合引线的半导体器件及其制造方法 The method of manufacturing a semiconductor device and bonding wires
12/14/2011CN102280424A 非挥发性内存装置、集成电路装置及集成电路制造方法 Non-volatile memory devices, integrated circuits and integrated circuit device manufacturing method
12/14/2011CN102280423A 集成电路装置及其制造方法 Integrated circuit device and manufacturing method thereof
12/14/2011CN102280422A 包含金属和粒子填充的硅片直通通路的集成电路芯片 Containing silicon metal and particle-filled paths straight integrated circuit chip
12/14/2011CN102280419A 一种大型电子设备用散热板及其制造方法 A large, electronic equipment cooling plate and its manufacturing method
12/14/2011CN102280416A Semiconductor device and method of manufacture thereof
12/14/2011CN102280415A 封装结构、印制电路板组件和固定方法 Package, printed circuit board assembly and method of fixing
12/14/2011CN102280413A 应力释放单元及其制造方法、安装结构和电子装置 Stress relief unit and its manufacturing method, and electronic device mounting structure
12/14/2011CN102280412A Vertical semiconductor device and method of manufacturing the same
12/14/2011CN102280411A 制作半导体器件结构的方法 The method of fabricating a semiconductor device structure
12/14/2011CN102280410A 基于玻璃基的plc晶圆切割方法 Based plc glass substrate wafer cutting method
12/14/2011CN102280409A 半导体装置 Semiconductor device
12/14/2011CN102280408A Method for manufacturing thin film transistor matrix substrate and display panel
12/14/2011CN102280407A 元器件侧壁图形化的制作方法 Component sidewall graphical production method
12/14/2011CN102280406A 制造半导体器件的方法 The method of manufacturing a semiconductor device
12/14/2011CN102280405A 双沟槽隔离结构的形成方法 The method of forming a dual trench isolation structure
12/14/2011CN102280404A 双沟槽隔离结构的形成方法 The method of forming a dual trench isolation structure
12/14/2011CN102280403A 形成具有目标关键尺寸的沟槽的方法 The method of forming a trench having a target CD of
12/14/2011CN102280402A 刻蚀和填充深沟槽的方法 Deep trench etching and filling method
12/14/2011CN102280401A 石英舟基板支撑杆装置 Quartz substrate boat strut device
12/14/2011CN102280400A 一种激光束加工处理中的晶圆片对准方法 A laser beam processing the wafer alignment method
12/14/2011CN102280399A 在线型晶圆输送装置 Online-type wafer conveying device
12/14/2011CN102280398A 晶圆组分配方法 Wafer group allocation method
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