Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/30/2011CN102263140A 一种塑封功率二极管及其制造工艺 One kind of plastic power diode and its manufacturing process
11/30/2011CN102263138A 新型结构的保护用二极管 The new structure protection diode
11/30/2011CN102263137A 一种混合型非易失存储单元及其制作方法 A hybrid non-volatile memory cell and its production method
11/30/2011CN102263136A 浮栅场效应晶体管及其制造方法 Floating gate field effect transistor and manufacturing method thereof
11/30/2011CN102263134A 一种双极性薄膜晶体管及其制备方法 A bipolar thin film transistor and its preparation method
11/30/2011CN102263133A 低栅极电荷低导通电阻深沟槽功率mosfet器件及其制造方法 Low gate charge low on-resistance deep trench power mosfet device and manufacturing method
11/30/2011CN102263132A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
11/30/2011CN102263131A 一种半导体器件及其形成方法 A semiconductor device and method of forming
11/30/2011CN102263127A 一种mos型功率器件及其制造方法 One kind mos power devices and manufacturing method
11/30/2011CN102263115A 固态图像传感器的制造方法 The method of manufacturing a solid-state image sensor
11/30/2011CN102263111A 阵列基板及制造该阵列基板的方法 The method of the array substrate of the array substrate and manufacturing
11/30/2011CN102263110A 嵌入bcd工艺的eeprom核结构及其形成方法 Embed bcd process eeprom nuclear structure and method of forming
11/30/2011CN102263109A 非易失性存储器件及其制造方法 Non-volatile memory device and manufacturing method thereof
11/30/2011CN102263108A 非易失性存储器件及其制造方法 Non-volatile memory device and manufacturing method thereof
11/30/2011CN102263107A 一种半导体功率器件及其制造方法 A semiconductor power device and manufacturing method thereof
11/30/2011CN102263105A 沟渠式半导体组件及其制作方法 Ditches semiconductor components and manufacturing method thereof
11/30/2011CN102263099A 3d集成电路及其制造方法 3d integrated circuit and its manufacturing method
11/30/2011CN102263097A 具有集成电路与发光二极管的异质整合结构及其制作方法 Integration of heterogeneous integrated circuit structure and method of making the light-emitting diodes
11/30/2011CN102263092A 半导体模块及其制造方法 The semiconductor module and manufacturing method thereof
11/30/2011CN102263089A 具有多芯片结构的半导体集成电路 The semiconductor integrated circuit having a multi-chip structure
11/30/2011CN102263087A 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
11/30/2011CN102263085A 封装结构以及封装工艺 Package and packaging process
11/30/2011CN102263083A 集成电路结构与其形成方法 The method for forming an integrated circuit structure and its
11/30/2011CN102263082A 封装基板结构及其制造方法 Package substrate structure and manufacturing method
11/30/2011CN102263081A 带双凸点的四边扁平无引脚双ic芯片封装件及其生产方法 Four sides with double bump ic chip dual flat no-lead package and its production method
11/30/2011CN102263080A 带双凸点的四边扁平无引脚三ic芯片封装件及其生产方法 Four sides with dual flat no-lead bumps three ic chip package and its production method
11/30/2011CN102263076A 封装结构及形成封装结构的方法 Package structure and method of forming a package structure
11/30/2011CN102263075A 具有电接地热沉的电子装置及其制造方法 An electrically grounded heat sink of an electronic device and manufacturing method thereof
11/30/2011CN102263073A 金刚石和铝的接合体及其制造方法 Assembly and manufacturing method of diamond and aluminum
11/30/2011CN102263069A 电路模块 Circuit module
11/30/2011CN102263068A 带低温压力烧结连接的两个连接配对件系统及其制造方法 Temperature pressure sintering is connected with two mating parts and a manufacturing method of connecting the system
11/30/2011CN102263067A 微凸块接合装置 Microbump engagement means
11/30/2011CN102263065A 非易失性存储器件及制造方法与包括其的存储模块和系统 Non-volatile memory device and manufacturing method thereof and includes memory modules and systems
11/30/2011CN102263064A 分立栅存储器件的形成方法 Discrete gate memory device forming method
11/30/2011CN102263063A 互补金属氧化物半导体晶体管的制作方法 Production methods complementary metal oxide semiconductor transistors
11/30/2011CN102263062A 复合半导体器件的侧壁形成方法 Sidewall composite semiconductor device forming method
11/30/2011CN102263061A 形成在块体衬底上的自对准多栅极晶体管 Formed on the block substrate self-aligned multi-gate transistor
11/30/2011CN102263060A 阵列基板及其制造方法、液晶显示器 Array substrate and manufacturing method thereof, a liquid crystal display
11/30/2011CN102263059A 整合肖特基二极管与功率晶体管于基材的制造方法 Schottky diodes and power transistors integrated in the substrate manufacturing method
11/30/2011CN102263058A 半导体装置的制造方法 The method of manufacturing a semiconductor device
11/30/2011CN102263057A 在半导体器件中形成接触孔的方法 The method of forming a contact hole in a semiconductor device
11/30/2011CN102263056A 一种金属互连方法 Metal interconnection method
11/30/2011CN102263055A 接触孔的形成方法、半导体结构 The method of forming a contact hole, a semiconductor structure
11/30/2011CN102263054A 多层晶片中的沟槽结构 The multi-layered wafer trench structure
11/30/2011CN102263053A 半导体装置、无缝填隙的方法与浅沟槽隔离结构的制法 Semiconductor device, method and seamless interstitial shallow trench isolation structure is prepared by
11/30/2011CN102263052A 浅沟槽隔离形成方法 The method for forming a shallow trench isolation
11/30/2011CN102263051A 晶片承载装置 Wafer carrying device
11/30/2011CN102263050A 一种用于移动石墨舟上半导体晶粒的装置 An apparatus for moving a graphite boat on the semiconductor die
11/30/2011CN102263049A 显示面板模块装配装置 The display panel module assembly unit
11/30/2011CN102263048A 芯片封装体的承载装置及承载组件 Carrying device and bearing assembly of chip package
11/30/2011CN102263047A 一种晶圆片热缓冲栈及实现热缓冲的方法 A wafer thermal buffer stack and the way to achieve thermal buffer
11/30/2011CN102263046A 一种具有椭圆门闩结构的前开式圆片盒 Having elliptical latch structure front opening wafer cassette
11/30/2011CN102263045A 横向推移机构 Over the lateral agencies
11/30/2011CN102263044A 热处理腔、温度测量装置与方法 Heat treatment chamber, a temperature measuring device and method
11/30/2011CN102263043A Fpd组件的组装装置 Fpd component assembly apparatus
11/30/2011CN102263042A 晶片级回焊设备和焊料球体与倒装芯片组装体的制造 Wafer-level manufacturing equipment and reflow solder ball and flip chip assembly of
11/30/2011CN102263041A 多层堆叠电阻转换存储器的制造方法 Resistance conversion method for manufacturing a multi-layer stack memory
11/30/2011CN102263040A 半导体电子元件的封装方法 The semiconductor packaging method of an electronic device
11/30/2011CN102263039A 晶粒总成的制造方法 Grain assembly manufacturing method
11/30/2011CN102263038A 键合铜丝在生产过程中的表面处理技术 Bonding wire in the production process of surface treatment technology
11/30/2011CN102263037A 表面贴装二极管框架成形及组装方法 Surface Mount Diode frame molding and assembly method
11/30/2011CN102263036A 一种制备CdS/ZnS纳米线异质结的方法 A CdS / ZnS nanowire heterojunction prepared
11/30/2011CN102263035A 形成含氧半导体薄膜晶体管的方法 Oxygen-containing method of forming a semiconductor thin film transistor
11/30/2011CN102263034A Bcd工艺中的高压mos晶体管结构及其制造方法 Bcd high pressure process mos transistor structure and manufacturing method thereof
11/30/2011CN102263033A 半导体器件的制造方法 The method of manufacturing a semiconductor device
11/30/2011CN102263032A 具有嵌埋应变诱发材料的晶体管 With a strain-inducing material embedded transistors
11/30/2011CN102263031A 沟槽型vmos晶体管制作方法 Trench transistor fabrication method vmos
11/30/2011CN102263030A 一种沟槽型功率器件的制备方法 Method for preparing a trench type power device
11/30/2011CN102263029A 横向扩散型金属氧化物半导体晶体管及其制作方法 Laterally diffused metal oxide semiconductor transistor and its manufacturing method
11/30/2011CN102263028A 晶圆的形成方法 The method for forming wafer
11/30/2011CN102263027A 成膜方法和成膜装置 Film formation method and film forming apparatus
11/30/2011CN102263026A 等离子体处理装置和方法 The plasma processing apparatus and method
11/30/2011CN102263025A 等离子体处理装置及其处理气体供给机构 The plasma processing apparatus and a processing gas supply means
11/30/2011CN102263024A 一种单面抛光晶片的背面防腐蚀方法 The back of the anti-corrosion method of polishing a single wafer
11/30/2011CN102263023A 晶片的平坦加工方法 Flat wafer processing method
11/30/2011CN102263022A 半导体装置的制造方法 The method of manufacturing a semiconductor device
11/30/2011CN102263021A 一种低电压栅氧化层制备方法 A low-voltage gate oxide layer preparation
11/30/2011CN102263020A 低栅极阻抗的功率半导体结构的制造方法 The method of producing a low gate resistance of the power semiconductor structure
11/30/2011CN102263019A 自对准沟槽式功率半导体结构的制造方法 Self-aligning method of manufacturing a trench type power semiconductor structure
11/30/2011CN102263018A 改善芯片栅极侧墙生长的负载效应的方法 Ways to improve the growth of chip gate sidewall loading effect
11/30/2011CN102263017A 制作半导体器件栅极的方法 The method of fabricating a semiconductor device gate
11/30/2011CN102263016A N型沟槽功率器件的形成方法 The method for forming the N-type trench power devices
11/30/2011CN102263015A 应用于nMOS的硅基砷化镓材料结构的制备方法 Preparation method was applied to the silicon GaAs nMOS structure
11/30/2011CN102263014A 一种用晶核预控制激光晶化法制备多晶硅薄膜材料的方法 A method used to control the laser crystallization nuclei pre-prepared polycrystalline silicon thin film materials
11/30/2011CN102263013A 石墨烯的图形化方法 Graphical methods graphene
11/30/2011CN102263012A 表面处理方法以及表面处理装置 The surface treatment method and surface treatment apparatus
11/30/2011CN102263011A 半导体结构的制造方法 The method of manufacturing a semiconductor structure
11/30/2011CN102263010A 将芯片器件装配在线上的设备 The assembly line equipment on-chip devices
11/30/2011CN102263009A 晶圆视觉对中单元 Wafer vision for the unit
11/30/2011CN102263001A 等离子体处理装置和方法 The plasma processing apparatus and method
11/30/2011CN102262998A 离子注入装置 Ion implantation apparatus
11/30/2011CN102262357A 光刻胶和光刻胶图形的优化方法 Optimization photoresist and the photoresist pattern
11/30/2011CN102262356A 光刻胶图形的优化方法和接触孔的形成方法 The method of forming a resist pattern optimization method and contact holes
11/30/2011CN102262326A 面内切换型液晶显示面板 In-plane switching type liquid crystal display panel
11/30/2011CN102262324A 阵列基板及其制造方法、液晶面板和液晶显示器 Array substrate and manufacturing method thereof, a liquid crystal panel and liquid crystal display
11/30/2011CN102260907A 一种ZnO纳米同质pn结阵列的制备方法 Method for preparing homogeneous nano-ZnO pn junction arrays
11/30/2011CN102260870A 一种亚微米尺寸二维介质柱型光子晶体的制备方法 A method for preparing a two-dimensional medium submicron size cylindrical photonic crystals
11/30/2011CN102259863A 使用后切割砂浆的处理方法 After cutting processing method using mortar
11/30/2011CN102259247A 电子元件一孔焊接模及焊接工艺 A hole soldering electronic components mold and welding technology
11/30/2011CN102259222A 用于在工件上涂覆焊料的方法和装置 Methods and apparatus for coating the solder on the workpiece
1 ... 1194 1195 1196 1197 1198 1199 1200 1201 1202 1203 1204 1205 1206 1207 1208 1209 1210 1211 1212 1213 1214 ... 6590